Copolythiophene semiconductors for electronic device applications
    42.
    发明授权
    Copolythiophene semiconductors for electronic device applications 有权
    用于电子设备应用的共聚噻吩半导体

    公开(公告)号:US08569443B1

    公开(公告)日:2013-10-29

    申请号:US13718308

    申请日:2012-12-18

    CPC classification number: C08G75/00

    Abstract: A semiconducting copolythiophene composition that includes repeating units obtained from the copolymerization of compounds of Formula (2): and Formula (3): in which the copolythiophene has at least two repeating units (possessing side chains, such as alkyl side chains), which are arranged in manner such that the side chains on the polythiophene backbone are distributed non-uniformly, is described. Electronic devices incorporating such copolythiophene compositions are also described.

    Abstract translation: 一种半导体共聚噻吩组合物,其包含由式(2):和式(3)的化合物的共聚获得的重复单元:其中共聚噻吩具有至少两个重复单元(具有侧链,如烷基侧链),它们是 以使得聚噻吩主链上的侧链不均匀分布的方式进行描述。 还描述了包含这种共聚噻吩组合物的电子器件。

    Sensors comprising palladium complex ink

    公开(公告)号:US10043605B2

    公开(公告)日:2018-08-07

    申请号:US14691868

    申请日:2015-04-21

    Abstract: A sensor including a sensing element comprising conductive features formed on a substrate; wherein the conductive features have been formed from a palladium complex ink composition that has been deposited onto the substrate to form the deposited features and wherein the deposited features have been heated to form the conductive features on the substrate. A method including disposing a palladium complex ink composition onto a substrate to form deposited features; and heating the deposited features to form conductive features on the substrate. A strain gauge sensor including a sensing element comprising conductive features formed on a substrate; wherein the conductive features conform to a two dimensional substrate surface; or wherein the conductive features conform to a three dimensional substrate surface.

    SOLDER MASK COMPOSITIONS FOR AEROSOL JET PRINTING
    50.
    发明申请
    SOLDER MASK COMPOSITIONS FOR AEROSOL JET PRINTING 有权
    用于航空喷墨打印机的焊膏组合物

    公开(公告)号:US20170044388A1

    公开(公告)日:2017-02-16

    申请号:US15340896

    申请日:2016-11-01

    CPC classification number: C09D11/36 B05D1/02 C09D11/101 C09D11/322

    Abstract: A solder mask ink for aerosol jet printing includes a metal oxide and a propylene glycol-based solvent; the solder mask ink has a viscosity from about 50 cps to about 1,000 cps at shear rate of 10 1/s at 25° C., and a shear thinning index from about 1.0 to about 2.0.

    Abstract translation: 用于气溶胶喷射印刷的焊接掩模油墨包括金属氧化物和基于丙二醇的溶剂; 焊接掩模油墨在25℃下的剪切速率为10 1 / s时具有约50cps至约1,000cps的粘度,以及约1.0至约2.0的剪切稀化指数。

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