Abstract:
A current-to-voltage converter receives a current which varies with temperature according to a selected one of two or more temperature coefficient factors and converts it to a temperature-dependent voltage to be used as a control signal to a varactor in a voltage controlled oscillator, VCO, to compensate for temperature-induced frequency drift in the VCO. A feedback arrangement with hysteresis is provided for controlling the selection of the temperature coefficient factor and operates by comparing the temperature-dependent voltage with a reference voltage. The reference voltage may be pre-set and equivalent to a known operating temperature. A switching signal is generated when Vout approaches the reference voltage and in response a control module generates a selection signal for selecting a different temperature coefficient factor. Thus multi-slope voltage and current generation with a wide dynamic range is continuously provided, which is particularly useful for controlling VCO's used in short range FMCW radar systems.
Abstract:
A system for steering data packets in a communication network that includes compute nodes having processors for executing application and service virtual machines (VMs), and traffic steering accelerators. A virtual local area network-identifier (VLAN-ID) assignment module generates records and associates the records with the service VMs. Each record includes an input VLAN-ID, an output VLAN-ID, and a port number corresponding to one of the service VMs. A service-chaining module generates chaining rules associated with n-Tuples. A traffic steering controller generates a chain of the records based on the service chaining rules. The traffic steering accelerator then steers the data packets based on the input and output VLAN-IDs included in the data packet.
Abstract:
An integrated electronic package includes an integrated circuit (IC) die and conductive discrete components. Electrical interconnects are formed directly between bond pads on an active side of the IC die and contacts on the conductive discrete components without an intervening lead frame. The IC die, conductive discrete components and electrical interconnects are embedded in an encapsulation material. Contact surfaces of at least some of the conductive discrete components are exposed from the encapsulation material and can be attached to a printed circuit board in order to mount the integrated electronic package to the printed circuit board.
Abstract:
There is disclosed an apparatus for external access to core resources (211,212) of a processor (2) comprising a processing core (21), a shared memory (22), and a multiple paths Direct Memory Access, DMA, controller (23). Access to core critical resources can be performed while the core is executing an application program. The proposed apparatus comprises a Manager module (13) which is operable to setup the DMA controller to copy the assigned core resources via allocated DMA channel into a safe memory region. Further, an Observer module (14) is operable to read the transferred data and make the correlation on the host apparatus side. This allows accessing data used by the core via the DMA controller into, e.g., a run-time debugger accessible region.
Abstract:
The present application suggests a receiver and a method of operating thereof for determining a noise estimate based on a radio frequency signal from an interference source over different propagation paths through a plurality of antennas. A covariance matrix estimator coupled through separate processing paths to a respective one of the plurality of antennas is arranged to determine an estimate of a covariance matrix based on the received radio frequency signal. A noise estimator coupled to the covariance matrix estimator for receiving the estimate of the covariance matrix is arranged to determine a noise estimate by solving a polynomial equation of second order as a function of the noise estimate on the basis the elements of the covariance matrix estimate relating to a set of two antennas.
Abstract:
A packaged integrated circuit (IC) device having a heatsink mounted onto an IC die, itself mounted onto a die pad, is assembled using a lead frame having tie bars that deflect during an encapsulation phase of the device assembly, which enables the die pad, the die, and the heatsink to move relative to the lead frame support structure when compressive force is applied by the molding tool. This movement results in negligible relative displacement between the heatsink and the die during encapsulation, which reduces the probability of physical damage to the die. Each tie bar has a number of differently angled sections that enable it to deflect when compressive force is applied to it.
Abstract:
An integrated circuit device comprises a signal processing system having at least one first signal processing module fabricated by way of a first production process; and at least one second signal processing module fabricated by way of a second production process, wherein the second production process is different to the first production process. The signal processing system further comprises a signal processing management module arranged to: determine a desired system performance of the integrated circuit device; determine at least one operating condition of the signal processing system; and configure a signal processing operating mode of the signal processing system based at least partly on: the determined desired system performance; the at least one determined operating condition; and at least one of the first production process and the second production process.
Abstract:
An electrostatic discharge (ESD) device is disclosed having two PNP transistors. During a high-voltage ESD event a parasitic NPN transistor couples to one of the two PNP transistors to provide ESD protection.
Abstract:
A method of undervoltage detection includes detecting a voltage level for a power supply of a system, placing the system in an undervoltage state if the voltage level is below an undervoltage threshold, activating a load of the system at a first power level if the detected voltage level exceeds a first activation threshold and if the system resides in the undervoltage state, and activating the load at a second power level if the detected voltage level exceeds a second activation threshold.
Abstract:
A system for generating a tamper detection signal indicating tampering with one or more circuits of an integrated circuit (IC) includes both a static wire mesh and an active wire mesh. The wire meshes can be formed in the same layer over the circuits to be protected or in different layers. The wire meshes also may cover the entire chip area or only predetermined areas, such as over secure memory and register areas. The wire meshes are connected to a tamper detection module, which monitors the meshes and any signals transmitted via the meshes to detect attempts to access the protected circuits via micro-probing.