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    Stage apparatus and exposure apparatus
    42.
    发明授权
    Stage apparatus and exposure apparatus 有权
    舞台装置和曝光装置

    公开(公告)号：US07994484B2

    公开(公告)日：2011-08-09

    申请号：US12385059

    申请日：2009-03-30

    申请人： Keiichi Tanaka

    发明人： Keiichi Tanaka

    IPC分类号： G01N31/00 ,  A61N5/00

    CPC分类号： G03F7/70858 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/70716 ,  G03F7/70766 ,  G03F7/70783 ,  G03F7/70808 ,  G03F7/70816 ,  G03F7/70841 ,  H01J37/3174

    摘要： The present invention provides a stage apparatus wherein an object is disposed in an atmosphere with a gas pressure lower than atmospheric pressure, and the object can be driven with high accuracy. The stage apparatus that drives a reticle comprises: a vacuum chamber, which forms a space and has an opening; an integrated coarse and fine motion table, which has an electrostatic chuck that holds the object, that, when driven, moves the electrostatic chuck inside the space; a counter mass, which is disposed so that it covers the opening, that is capable of moving because of the reaction force produced when the integrated coarse and fine motion table is driven; and a vacuum cover, which forms a space that houses the counter mass; wherein the space and the space are set to prescribed gas pressures.

    摘要翻译： 本发明提供了一种舞台装置，其中物体设置在气压低于大气压的气氛中，并且可以高精度地驱动物体。 驱动掩模版的平台装置包括：真空室，其形成空间并具有开口; 具有固定物体的静电卡盘的集成的粗细动作台，驱动时将静电卡盘移动到空间内; 设置为使其覆盖开口的反质量块，其由于在驱动集成的粗细动作台时产生的反作用力而能够移动; 和真空盖，其形成容纳对置质量的空间; 其中所述空间和所述空间被设定为规定的气体压力。

    Method for examining a wafer with regard to a contamination limit and EUV projection exposure system
    43.
    发明授权
    Method for examining a wafer with regard to a contamination limit and EUV projection exposure system 有权
    关于污染极限和EUV投影曝光系统检查晶片的方法

    公开(公告)号：US07955767B2

    公开(公告)日：2011-06-07

    申请号：US12690571

    申请日：2010-01-20

    申请人： Andreas Dorsel ,  Stefan Schmidt

    发明人： Andreas Dorsel ,  Stefan Schmidt

    IPC分类号： G03F9/00 ,  G03C5/00

    CPC分类号： G03F7/70916 ,  G03F7/70425 ,  G03F7/70608 ,  G03F7/7075 ,  G03F7/70808 ,  G03F7/70866 ,  G03F7/70925 ,  G03F7/70983

    摘要： A method for examining at least one wafer (13) with regard to a contamination limit, in which the contamination potential of the resist (13a) of the wafer (13), which resist (13a) outgasses contaminating substances, is examined with regard to a contamination limit before the wafer (13) is exposed in an EUV projection exposure system (1). The method preferably includes: arranging the wafer (13) and/or a test disc coated with the same resist (13a) as the resist (13a) of the wafer (13) in a vacuum chamber (19), evacuating the vacuum chamber (19), and measuring the contamination potential of the contaminating substances outgassed from the wafer (13) in the evacuated vacuum chamber (19), and also comparing the contamination potential of the wafer (13) with a contamination limit. An EUV projection exposure system (1) for carrying out the method is also disclosed. By rejecting wafers having an especially high contamination risk, the contamination of optical elements in the projection exposure system (1) on wafer exposure may be distinctly reduced.

    摘要翻译： 关于污染极限检查至少一个晶片（13）的方法，其中关于抗污染物质（13a）的晶片（13）的抗蚀剂（13a）的污染潜力被检测为污染物质 晶片（13）在EUV投影曝光系统（1）中曝光之前的污染极限。 该方法优选地包括：将晶片（13）和/或涂覆有与晶片（13）的抗蚀剂（13a）相同的抗蚀剂（13a）的测试盘放置在真空室（19）中，抽真空室 19），并且测量从真空室（19）中的晶片（13）脱气的污染物质的污染潜力，并且还将晶片（13）的污染电位与污染极限进行比较。 还公开了一种用于执行该方法的EUV投影曝光系统（1）。 通过拒绝具有特别高的污染风险的晶片，可以明显减少投影曝光系统（1）中晶片曝光的光学元件的污染。

    Vacuum device, operation method for vacuum device, exposure system, and operation method for exposure system
    44.
    发明授权
    Vacuum device, operation method for vacuum device, exposure system, and operation method for exposure system 有权
    真空装置，真空装置的操作方法，曝光系统和曝光系统的操作方法

    公开(公告)号：US07948603B2

    公开(公告)日：2011-05-24

    申请号：US10569167

    申请日：2004-08-17

    申请人： Keiichi Tanaka

    发明人： Keiichi Tanaka

    IPC分类号： G03B27/52

    CPC分类号： G03F7/70808 ,  G03F7/70841

    摘要： The exposure apparatus 100 comprises a double shell structure which has an upper vacuum chamber 140 on the outside of the reticle chamber 135, and a lower vacuum chamber 160 on the outside of the wafer chamber 155. A cryo pump CP and a turbo molecular pump TMP/dry pump DP are connected in parallel to each of the chambers, i.e., the reticle chamber 135 and wafer chamber 155. During exposure operation and alignment of the exposure apparatus 100, only the cryo pump CP (vibration-free type vacuum pump) is operated; the turbo molecular pump TMP/dry pump DP (vibrating type vacuum pump) is stopped. As a result, it is possible to cut off the transmission of vibration from the vibrating type vacuum pump during exposure operation and alignment of the exposure apparatus, so that the precision of the stage devices 137 and 157 can be ensured to a much greater degree; accordingly, deterioration of the exposure performance can be reduced to a much greater extent.

    摘要翻译： 曝光装置100包括双层结构，其在分划板室135的外侧具有上真空室140，在晶片室155的外侧具有下真空室160.冷冻泵CP和涡轮分子泵TMP /干泵DP平行地连接到每个室，即标线室135和晶片室155.在曝光操作和曝光装置100的对准期间，只有低温泵CP（无振动型真空泵）是 操作; 涡轮分子泵TMP /干泵DP（振动式真空泵）停止。 结果，可以在曝光操作和曝光装置的对准期间切断来自振动式真空泵的振动的传递，从而可以更大程度地确保舞台装置137和157的精度; 因此，曝光性能的劣化可以更大程度地降低。

    Stage apparatus, exposure apparatus, and device fabricating method
    48.
    发明申请
    Stage apparatus, exposure apparatus, and device fabricating method 审中-公开
    舞台装置，曝光装置和装置制造方法

    公开(公告)号：US20100066992A1

    公开(公告)日：2010-03-18

    申请号：US12457914

    申请日：2009-06-25

    申请人： Kazuya ONO

    发明人： Kazuya ONO

    IPC分类号： G03B27/58

    CPC分类号： G03F7/70758 ,  G03F7/70691 ,  G03F7/70716 ,  G03F7/70775 ,  G03F7/70808 ,  G03F7/709 ,  H01L21/682

    摘要： The invention provides a stage apparatus that has a fixed part, which has a prescribed movement surface, and a first movable body, which is capable of moving along the movement surface in a plurality of directions that includes a first direction. The stage apparatus comprises: a substage that, in synchrony with the movement of the first movable body, moves in the first direction with respect to the movement surface; a first measuring apparatus, at least part of which is provided to the substage, that detects information related to the relative position between the substage and the movement surface in the first direction; and a second measuring apparatus at least part of which is provided to the substage, that detects information related to the relative position between the substage and the first movable body in a second direction, which are substantially orthogonal to the first direction and follow along the movement surface.

    摘要翻译： 本发明提供一种具有规定的移动面的固定部的台架装置和能够沿着包括第一方向的多个方向沿着移动面移动的第一移动体。 舞台装置包括：与第一可移动体的运动同步地移动相对于运动表面的第一方向移动的分段; 第一测量装置，其至少一部分设置到所述分段，其检测与所述第一方向上的所述分段和所述运动表面之间的相对位置有关的信息; 以及第二测量装置，其至少一部分设置在所述分段上，所述第二测量装置在与所述第一方向基本正交并跟随所述移动的第二方向上检测与所述子级与所述第一可移动体之间的相对位置相关的信息 表面。

    Coating and developing apparatus, coating and developing method, and storage medium
    49.
    发明授权
    Coating and developing apparatus, coating and developing method, and storage medium 有权
    涂装和显影设备，涂层和显影方法以及存储介质

    公开(公告)号：US07645081B2

    公开(公告)日：2010-01-12

    申请号：US12197682

    申请日：2008-08-25

    申请人： Yoshitaka Hara ,  Shingo Katsuki

    发明人： Yoshitaka Hara ,  Shingo Katsuki

    IPC分类号： G03D5/00 ,  G03B27/32 ,  B65H11/00 ,  B05C13/00

    CPC分类号： H01L21/67225 ,  G03F7/70525 ,  G03F7/7075 ,  G03F7/70808 ,  H01L21/6715 ,  H01L21/67745 ,  Y10S414/14

    摘要： Disclosed herein is a coating and developing apparatus 1 whose decreases in substrate-conveying accuracy can be suppressed. A processing block S2 of the coating and developing apparatus 1 includes multiple resist-film forming blocks G2, G3, and a developing block G1. A conveyance element 12 for substrate loading into the processing block S2 is provided to convey substrates W from a carrier C to the resist-film forming blocks G2, G3. Also, a conveyance element I for substrate loading into an exposure apparatus S4 is provided in an interface block S3 to load the substrates W into the exposure apparatus S4 and after unloading the substrates W from the exposure apparatus S4, convey the substrates W to the developing block G1. The processing block loading conveyance element 12 conveys the substrates W, one at a time, from the carrier C to each resist-film forming block G2, G3, sequentially and periodically, and the exposure apparatus loading conveyance element I loads the substrates W from each resist-film forming block G2, G3 into the exposure apparatus S4 in the sequence that each has been conveyed to the resist-film forming block G2, G3 by the processing block loading conveyance element 12.

    摘要翻译： 这里公开了可以抑制基板输送精度降低的涂布显影装置1。 涂布显影装置1的处理块S2包括多个抗蚀剂膜形成块G2，G3和显影块G1。 提供了用于将衬底装载到处理块S2中的传送元件12，用于将衬底W从载体C传送到抗蚀剂膜形成块G2，G3。 此外，在接口块S3中设置用于将曝光装置S4中的基板载置的输送元件I，将基板W装载到曝光装置S4中，在从曝光装置S4取出基板W之后，将基板W输送到显影 块G1。 处理块装载传送元件12依次和周期地将基板W一次一个地从载体C传送到每个抗蚀剂膜形成块G2，G3，并且曝光装置装载传送元件I从每个基板W装载基板W 抗蚀剂膜形成块G2，G3以通过处理块装载传送元件12被传送到抗蚀剂膜形成块G2，G3的顺序进入曝光装置S4。