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978 条记录 (耗时 0.027 秒)

    Piezoelectric vibrating reed, piezoelectric vibrator, oscillator, electronic device, radio-controlled clock, and method for manufacturing piezoelectric vibrating reed
    45.
    发明授权
    Piezoelectric vibrating reed, piezoelectric vibrator, oscillator, electronic device, radio-controlled clock, and method for manufacturing piezoelectric vibrating reed 有权
    压电振动片，压电振动器，振荡器，电子器件，无线电控制时钟及压电振动片制造方法

    公开(公告)号：US08384273B2

    公开(公告)日：2013-02-26

    申请号：US13323021

    申请日：2011-12-12

    申请人： Takashi Kobayashi

    发明人： Takashi Kobayashi

    IPC分类号： H03H9/17 ,  H01L41/053 ,  H01P1/18

    CPC分类号： H03H3/04 ,  G04R20/10 ,  H03H9/0542 ,  H03H9/1021 ,  H03H9/215 ,  H03H2003/0492 ,  Y10T29/42

    摘要： This invention is provided a piezoelectric vibrating reed which is capable of decreasing variation in the amount of etching reside as much as possible and suppressing influence of vibration loss on the vibration characteristics as much as possible. A piezoelectric vibrating reed comprising a vibrating section extensive in parallel in a longitudinal direction and a base to which the vibrating section is connected at this proximal end. The base comprises at least a first section and a second section defined from the side of the proximal end of the base long the longitudinal direction. The first section is wider in a transverse direction than the second section.

    摘要翻译： 本发明提供一种能够尽可能地减少蚀刻量变化的压电振动片，尽可能地抑制振动损失对振动特性的影响。 一种压电振动片，包括在纵向方向上平行延伸的振动部分和在该近端处连接有振动部分的基部。 所述底座包括至少第一部分和从所述基部的所述近端侧的长度方向限定的第二部分。 第一部分在横向上比第二部分宽。

    GLASS BODY CUTTING METHOD, PACKAGE MANUFACTURING METHOD, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIME PIECE
    47.
    发明申请
    GLASS BODY CUTTING METHOD, PACKAGE MANUFACTURING METHOD, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIME PIECE 审中-公开
    玻璃体切割方法，包装制造方法，包装，压电振动器，振荡器，电子设备和无线电控制时间片

    公开(公告)号：US20120247658A1

    公开(公告)日：2012-10-04

    申请号：US13429879

    申请日：2012-03-26

    申请人： Yasuo Kawada

    发明人： Yasuo Kawada

    IPC分类号： B32B38/04 ,  C03B33/02

    CPC分类号： C03B33/033 ,  C03B33/0222 ,  C03B33/037 ,  C03B33/076 ,  C03B33/0855 ,  G04R20/10 ,  H03H3/04 ,  H03H9/1021 ,  H03H2003/0492 ,  Y02P40/57 ,  Y10T156/1052 ,  Y10T225/12

    摘要： Disclosed is a glass body cutting method for cutting a glass body along a planned cutting line, the method including: a groove forming process of forming a groove on one surface of the glass body along the planned cutting line by irradiation of a laser light along the planned cutting line; an attachment process of attaching an adhesive sheet to the one surface to cover at least the groove, after the groove forming process; and a cutting process of cutting the glass body along the planned cutting line by applying a tear stress along the planned cutting line while pressing a cutting blade against the other surface of the glass body in a state where the glass body is disposed on a supporting section through the adhesive sheet, after the attachment process.

    摘要翻译： 本发明公开了一种沿着规划切割线切割玻璃体的玻璃体切割方法，其特征在于，包括：沿着所述规划切割线在所述玻璃体的一个面上沿着沿着所述切割线的激光的照射形成凹槽的槽形成工序 规划切割线; 在槽形成处理之后，将粘合片附着到所述一个表面以覆盖至少所述凹槽的附接过程; 以及在玻璃体设置在支撑部上的状态下，通过沿着规划切割线施加撕裂应力而切割玻璃体的切割过程，同时将切割刀片压靠在玻璃体的另一个表面上 通过粘合片，在附着过程之后。

    WAFER AND METHOD OF MANUFACTURING PACKAGE PRODUCT
    48.
    发明申请
    WAFER AND METHOD OF MANUFACTURING PACKAGE PRODUCT 审中-公开
    制造包装产品的方法和方法

    公开(公告)号：US20120228744A1

    公开(公告)日：2012-09-13

    申请号：US13411969

    申请日：2012-03-05

    申请人： Yasuo Kawada

    发明人： Yasuo Kawada

    IPC分类号： H01L27/06 ,  H01L21/78

    CPC分类号： H03H9/1021 ,  H01L2224/16225 ,  H03H3/04 ,  H03H9/0519 ,  H03H9/21 ,  H03H2003/026 ,  H03H2003/0478 ,  H03H2003/0492

    摘要： To provide a wafer in which out-gas emitted between wafers during bonding of the wafers can be easily discharged to the outside and the bonded wafers can be favorably cut to improve the yields, and a method of manufacturing a package product using the wafer. A groove portion is formed in a wafer for lid substrate along a plurality of imaginary straight lines passing through a center in a diameter direction of the wafer for lid substrate and extending in the diameter direction. The groove portion is divided into a plurality of groove portions in the diameter direction placed such that the groove portions are not in contact with each other.

    摘要翻译： 为了提供晶片，其中在晶片接合期间在晶片之间发射的气体可以容易地排放到外部，并且可以有利地切割结合的晶片以提高产量，以及使用该晶片制造封装产品的方法。 沿着通过盖基板的晶圆的直径方向的中心的多个假想直线，沿着直径方向延伸的方式，在用于盖基板的晶片中形成有槽部。 槽部被分割成直径方向的多个槽部，使得槽部彼此不接触。

    Contour resonator and method for adjusting contour resonator
    50.
    发明授权
    Contour resonator and method for adjusting contour resonator 有权
    轮廓谐振器和调整轮廓谐振器的方法

    公开(公告)号：US08242666B2

    公开(公告)日：2012-08-14

    申请号：US12528550

    申请日：2008-02-18

    申请人： Akinori Yamada

    发明人： Akinori Yamada

    IPC分类号： H01L41/06

    CPC分类号： H03H3/04 ,  H03H9/02102 ,  H03H9/19 ,  H03H2003/0428 ,  Y10T29/42

    摘要： A contour resonator is provided with a vibrating body formed from a flat plate in a square shape, excitation electrodes formed on both front and back surfaces of the vibrating body and regulating a resonance frequency, and temperature characteristic adjustment films formed on surfaces of the excitation electrodes and adjusting a temperature characteristic.

    摘要翻译： 轮廓谐振器具有由平板状的平板形成的振动体，形成在振动体的前表面和后表面上的调节谐振频率的激励电极以及形成在激励电极的表面上的温度特性调节膜 并调节温度特性。