公开(公告)号：US11711904B2

公开(公告)日：2023-07-25

申请号：US17497042

申请日：2021-10-08

Applicant: Crestron Electronics, Inc.

Inventor： William P Rehak ,  Albert Pedoeem ,  Alec J Magrini ,  Sanjay Upasani

IPC: H05K7/20

CPC classification number: H05K7/20154 ,  H05K7/20145 ,  H05K7/20445

Abstract: Apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are only in a portion of a first panel that faces a first direction. Air exhaust holes are only in a portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.

公开(公告)号：US20230229213A1

公开(公告)日：2023-07-20

申请号：US17880602

申请日：2022-08-03

Applicant: Wei-Ting Chen ,  Tzu-Chien Lai ,  I-Hsuan Tsai ,  Chien Chiu ,  I-Lung Chen ,  Tsai-Sheng Yang

Inventor： Wei-Ting Chen ,  Tzu-Chien Lai ,  I-Hsuan Tsai ,  Chien Chiu ,  I-Lung Chen ,  Tsai-Sheng Yang

IPC: G06F1/20 ,  H05K7/20 ,  G06F1/16

CPC classification number: G06F1/206 ,  G06F1/203 ,  G06F1/1616 ,  G06F1/1666 ,  G06F1/1681 ,  H05K7/20154 ,  H05K7/20172 ,  H05K7/20209

Abstract: An electronic device includes a first body including a first part and a second part hinged to each other, a second body, and a hinge structure hinged between an edge of the second body and the second part. The first part has a recess. When the second body is unfolded relative to the first body from a folded state to a first unfolded state, the hinge structure pushes against the first part to rotate the first part relative to the second part. When the second body is continuously unfolded relative to the first body from the first unfolded state to a second unfolded state, the edge of the second body pushes against the first part, so that the first part continues to rotate relative to the second part. When the second body is in the folded state, the hinge structure is at least partially accommodated in the recess.

公开(公告)号：US11690195B2

公开(公告)日：2023-06-27

申请号：US17018235

申请日：2020-09-11

Applicant: ABB Schweiz AG

Inventor： Thomas Kendzia, III ,  Christopher Alan Belcastro ,  Taylor Miller

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/467

CPC classification number: H05K7/20154 ,  H01L23/3672 ,  H01L23/467 ,  H05K7/20145 ,  H05K7/20909

Abstract: A cooling system for power semiconductor switches is provided. The cooling system includes a heat sink that is pressed against the power semiconductor switch. A plenum is also provided with an opening through a wall thereof which is aligned with the heat sink. A fan draws air through or around the heat sink and through the plenum wall opening and the plenum in order to cool the power semiconductor switch.

公开(公告)号：US11681340B2

公开(公告)日：2023-06-20

申请号：US17121565

申请日：2020-12-14

Applicant: NVIDIA CORPORATION

Inventor： David Haley ,  Xiang Sun ,  Gabriele Gorla ,  Andrew Bell ,  Boris Landwehr

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  H05K7/2039 ,  H05K7/20154 ,  G06F2200/201

Abstract: A graphics subsystem includes a printed circuit board (PCB), a set of one or more fans, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU and configured to extend beyond an edge of the PCB, thereby occupying a larger portion of the width of the graphics subsystem compared to the PCB. A first fan is disposed partially or fully beyond the edge of the PCB and is configured to direct air through the portion of the heat sink that extends beyond the edge of the PCB, along a first airflow path, and out of the graphics subsystem. A second fan is configured to direct air through the heat sink, along a second airflow path, towards the GPU.

公开(公告)号：US20230170714A1

公开(公告)日：2023-06-01

申请号：US18061578

申请日：2022-12-05

Applicant: MILWAUKEE ELECTRIC TOOL CORPORATION

Inventor： Wyatt R. Silha ,  Cameron R. Schulz ,  Kyle C. Fassbender ,  Zhi Wei Meng

IPC: H02J7/00 ,  H05K1/18 ,  H01M10/44 ,  H05K7/20 ,  H05K1/02

CPC classification number: H02J7/0042 ,  H05K1/18 ,  H01M10/44 ,  H02J7/0047 ,  H05K7/20154 ,  H05K1/0295 ,  H02J7/00047 ,  H02J7/0013 ,  H02J7/00309 ,  H02J7/0045 ,  H05K7/20209 ,  H05K2201/10106 ,  H05K2201/066 ,  H05K2201/10522

Abstract: A battery charger may include a printed circuit board (PCB) having a first portion supporting alternating current (AC) electrical components and a second portion supporting direct current (DC) electrical components; an indicator including a light-emitting diode (LED) supported on the first portion of the PCB and operable to emit light; and an isolating member positioned on the first portion between the AC electrical components and the LED. A trace on the PCB may be electrically connected to the second portion of the PCB, the trace extending from the second portion and along the first portion, and the LED may be electrically connected to and receiving DC power through the trace, the LED being selectively positioned along a length of the trace. The LED may be positioned more than about 8 mm from the AC electrical components.

公开(公告)号：US20230164960A1

公开(公告)日：2023-05-25

申请号：US17986640

申请日：2022-11-14

Applicant: Carrier Corporation

Inventor： Kiran Kumar Akula ,  Zoila Malespin ,  Mohamad Nasab ,  Vijay Lakshmi Bondapalli

IPC: H05K7/20

CPC classification number: H05K7/209 ,  H05K7/20154 ,  H05K7/20909

Abstract: A heat sink for cooling at least one power electronics device in a coil unit includes a base plate having a first portion and a second portion. The second portion is arranged vertically beneath the first portion. A plurality of fins extends from a surface of the base plate. The plurality of fins is located at the second portion of the base plate. A height of the plurality of fins measured perpendicular to the surface varies across a width of the base plate.

公开(公告)号：US20190037738A1

公开(公告)日：2019-01-31

申请号：US16132536

申请日：2018-09-17

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Don Le ,  Ware Bedell

IPC: H05K7/20 ,  G02F1/1335

CPC classification number: H05K7/20972 ,  F28F3/00 ,  G02F1/133382 ,  G02F1/133385 ,  G02F1/133615 ,  G02F2001/133342 ,  G02F2201/36 ,  H05K7/20154 ,  H05K7/20963

Abstract: Disclosed herein is an electronic display assembly having a thermally conductive housing and an image assembly. The image assembly is positioned within the thermally conductive housing and behind a transparent plate assembly. An inlet opening and outlet opening are formed by gaps located between opposing edges of the image assembly and the housing. A space between the image assembly and the plate assembly forms a channel. Thermally conductive plates extend from near the image assembly within each of the inlet opening and outlet opening to contact the housing. Heat from the image assembly is conductively transferred to the housing by the thermally conductive plates. A fan may be positioned to circulate cooling air through the channel via the inlet and outlet openings and apertures in the thermally conductive plates.

公开(公告)号：US20190008077A1

公开(公告)日：2019-01-03

申请号：US16013184

申请日：2018-06-20

Applicant: FUJITSU LIMITED

Inventor： Minoru Ishinabe

IPC: H05K7/20

CPC classification number: H05K7/20781 ,  H05K7/20154 ,  H05K7/20236 ,  H05K7/20263 ,  H05K7/20272 ,  H05K7/20736 ,  H05K7/20836

Abstract: A cooling device includes, a liquid immersion tank having an opening in a top thereof, in which an electronic circuitry including a heat generating circuit is immersed in a second coolant, a lid fitted into the opening, and a cooler, into which a cooled first coolant is input through a first pipe, and from which the first coolant is output through a second pipe, the cooler being located between a liquid level of the second coolant and a lower surface of the lid that faces the liquid level.

公开(公告)号：US20190006802A1

公开(公告)日：2019-01-03

申请号：US16019850

申请日：2018-06-27

Applicant: LOTES CO., LTD.

Inventor： Ted Ju ,  Chin Chi Lin

IPC: H01R24/78 ,  H01R43/02 ,  H01R13/66 ,  H01R13/516 ,  H05K7/20

CPC classification number: H01R24/78 ,  G06F1/20 ,  H01R13/46 ,  H01R13/516 ,  H01R13/6658 ,  H01R24/60 ,  H01R43/0256 ,  H05K7/20154 ,  H05K7/2039 ,  H05K7/20918

Abstract: An assembly includes: a socket connector, having an insulating seat, multiple mating terminals and a metal shell provided outside the insulating seat; at least one first thermal conduction member located outside the metal shell; and a plug connector, including: a circuit board; at least one chip provided on the circuit board; a mating joint electrically connected to one end of the circuit board and having an insulating body, multiple conductive terminals, and a shielding shell provided outside the insulating body; and at least one second thermal conduction member having a conducting portion thermally conductive with the chip and a protruding portion located outside the shielding shell. When the mating joint is mated with the socket connector, the mating terminals are in contact with the conductive terminals to form an electrical connection, and the protruding portion is in contact with the first thermal conduction member to perform thermal conduction.

公开(公告)号：US20180310396A1

公开(公告)日：2018-10-25

申请号：US15962207

申请日：2018-04-25

Applicant: Ryo Kobayashi ,  Tomoyoshi Kobayashi

Inventor： Ryo Kobayashi ,  Tomoyoshi Kobayashi

IPC: H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K1/181 ,  H05K1/184 ,  H05K7/20154 ,  H05K7/20409 ,  H05K7/20445 ,  H05K7/20918 ,  H05K2201/066 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K2201/10628

Abstract: A circuit board module includes: a first electronic component of a surface mounting type; a second electronic component of an insertion mounting type including a lead terminal; a circuit board; and a heat transfer body provided in the circuit board. The first electronic component is mounted on a front surface of the circuit board so as to overlap the heat transfer body in a board thickness direction. The heat transfer body is provided so as to transfer heat generated in the first electronic component to a back surface side of the circuit board. The second electronic component is mounted on a back surface of the circuit board. The second electronic component and the heat transfer body are thermally connected to a heat radiation body provided on the back surface side of the circuit board.