Abstract:
An optical pickup including a many-sided reflection prism formed as a single body with a plurality of reflection faces to guide a light beam incident through a transmission face in a horizontal direction perpendicular to a height direction by reducing a size of the light beam in the height direction, by using a difference in angles between the reflection faces, and to reflect the guided light beam in the height direction by one reflection face of an angle less than 45° with respect to the horizontal direction. By using the many-sided reflection prism, the height of an optical system can be reduced regardless of the wavelength used without reducing light beam size. Thereby, slim-sized optical pickups can be implemented.
Abstract:
A method of controlling a bank voltage (AIVC) through memory block selection information, said method comprising the steps of detecting an array block selection signal of an array block disposed distantly from an AIVC driver in response to an activated memory array block selection signal; and supplying a second bank voltage to a memory bank by driving a normal size driver and an oversize driver when detecting the array block selection signal for the distantly disposed array block.
Abstract:
A semiconductor memory device which includes a plurality of memory cell array blocks, each block including 2n partial blocks selectable in response to n address bits among a plurality of bits address. A partial block select signal generator is used for selecting ½n partial blocks of the 2n partial blocks in each of the plurality of memory cell array blocks by selecting the state of corresponding address bits among the n address bits. A method for repairing a semiconductor memory device which includes a plurality of memory cell array blocks and 2n partial blocks selected by the plurality of memory cell array blocks each responding to n address bits among a plurality of address bits, the method includes selecting only the ½n functional partial blocks of the 2n partial blocks in each of the plurality of memory cell array blocks by selecting the state of corresponding address bits among the n bits of address information.
Abstract:
A semiconductor memory device having reduced sensing noise and sensing current by reducing the number of cells activated by a word line is provided. The semiconductor memory device includes a memory cell array, which is segmented into a plurality of memory cell groups in a column direction, and a plurality of sub-word line drivers for selectively activating the sub-word line of a corresponding memory cell group in response to a group selection signal. The semiconductor memory device prevents sensing operation from occurring in a memory cell group which is not selected, while sensing operation is performed in a memory cell group which is selected by the group selection signal.
Abstract:
A synchronous dynamic random access memory capable of accessing data in a memory cell array therein in synchronism with a system clock from an external system such as a central processing unit (CPU). The synchronous DRAM receives an external clock and includes a plurality of memory banks each including a plurality of memory cells and operable in either an active cycle or a precharge cycle, a circuit for receiving a row address strobe signal and latching a logic level of the row address strobe signal in response to the clock, an address input circuit for receiving an externally generated address selecting one of the memory banks, and a circuit for receiving the latched logic level and the address from the address input circuit and for outputting an activation signal to the memory bank selected by the address and an inactivation signals to unselected memory banks when the latched logic level is a first logic level, so that the selected memory bank responsive to the activation signal operates in the active cycle while the unselected memory banks responsive to the inactivation signals operate in the precharge cycle.
Abstract:
A data input/output sensing circuit of a semiconductor memory device including a plurality of memory cells, the circuit comprises: input/output lines of the memory cell; data input/output terminals connected to outside of the memory cells; a single data input/output line connected between the input/output lines and the data input/output terminals; a sensing unit for sensing whether or not effective data is provided in the data input/output lines to thereby generate a sensing signal; an output driving unit for transmitting data of the data input/output lines to the data input/output terminals in response to the sensing signal; and a writing driving unit for inputting data of the data input/output terminals in response to the sensing signal.
Abstract:
An optical pick-up objective lens driving apparatus comprises a rectangular moving member mounted for movement relative to an iron-core member in rectilinear focusing and tracking directions, respectively. The moving member carries focusing and tracking coils, and a lens. Magnetic pieces are disposed at respective corners of the moving member in opposing spacial relationship to magnetic plates of the iron core member to create a restoring force which biases the moving member to a pre-set position. The lens is mounted over a center of weight of the moving member.
Abstract:
An internal voltage generating method performed in a semiconductor device, the internal voltage generating method including generating a plurality of initialization signals corresponding to a plurality of external power supply voltages; detecting a transition of a lastly-generated initialization signal from among the plurality of initialization signals and generating a detection signal; and generating a first internal voltage according to the detection signal.
Abstract:
A semiconductor device, memory device, system, and method of using a stacked structure for stably transmitting signals among a plurality of semiconductor layers is disclosed. The device includes at least a first semiconductor chip including a first temperature sensor circuit configured to output first temperature information related to the first semiconductor chip, and at least one through substrate via.
Abstract:
A multiport semiconductor memory device includes; first and second port units respectively coupled to first and second processors, first and second dedicated memory area accessed by first and second processors, respectively and implemented using DRAM cells, a shared memory area commonly accessed by the first and second processors via respective first and second port units and implemented using memory cells different from the DRAM cells implementing the first and second dedicated memory areas, and a port connection control unit controlling data path configuration between the shared memory area and the first and second port units to enable data communication between the first and second processors through the shared memory area.