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92 条记录 (耗时 0.026 秒)

    Testing device and method for an integrated circuit
    52.
    发明授权
    Testing device and method for an integrated circuit 有权
    一种集成电路的测试装置和方法

    公开(公告)号：US07471098B2

    公开(公告)日：2008-12-30

    申请号：US10975663

    申请日：2004-10-28

    申请人： Robert W. Warren, Jr. ,  Paul J. Huelskamp

    发明人： Robert W. Warren, Jr. ,  Paul J. Huelskamp

    IPC分类号： G01R31/02

    CPC分类号： G01R31/31723 ,  G01R31/2884 ,  G01R31/31703

    摘要： An apparatus and method are provided for testing integrated circuits. An integrated circuit arrangement is provided having first and second dice. Each die has circuitry for diagnostic testing in response to a diagnostic test signal. The circuitry further defines an input for receiving the diagnostic test signal and an output for transmitting results of the diagnostic testing for each of the dice. Interconnecting circuitry between the dice transmits the diagnostic test signal transmitted to the first die to the second die before the diagnostic testing is completed in the first die.

    摘要翻译： 提供了一种用于测试集成电路的装置和方法。 提供具有第一和第二骰子的集成电路装置。 每个管芯具有用于响应于诊断测试信号进行诊断测试的电路。 该电路进一步限定用于接收诊断测试信号的输入端和用于传送针对每个骰子的诊断测试结果的输出。 在诊断测试在第一个模具中完成之前，骰子之间的互连电路将传输到第一裸片的诊断测试信号发送到第二个裸片。

    Decoupling of analog input and digital output
    53.
    发明授权
    Decoupling of analog input and digital output 有权
    模拟输入和数字输出的去耦

    公开(公告)号：US07196644B1

    公开(公告)日：2007-03-27

    申请号：US10883633

    申请日：2004-07-01

    申请人： Kent D. Anderson ,  Gregory L. Silvus ,  Robert W. Warren, Jr.

    发明人： Kent D. Anderson ,  Gregory L. Silvus ,  Robert W. Warren, Jr.

    IPC分类号： H03M1/06

    CPC分类号： H04L25/14 ,  H04L1/0045 ,  H04L25/0292 ,  H04L25/03019 ,  H04L25/05 ,  H04L27/0002

    摘要： A signal processing system includes a receiver for receiving an analog signal. The system also includes an analog-to-digital converter (ADC) coupled to the receiver. At each of a series of time intervals, the ADC outputs sequential digital codes. Each digital code corresponds to a sampled analog value of the received analog signal at each sample interval. The system further includes a memory in which the sequential digital codes may be stored, and a processing circuit for converting the digital codes into a series of binary data bits. The conversion may be performed in a different sequence than the sequence in which the digital codes are stored in the memory.

    摘要翻译： 信号处理系统包括用于接收模拟信号的接收器。 该系统还包括耦合到接收器的模拟 - 数字转换器（ADC）。 在一系列时间间隔中，ADC输出顺序数字代码。 每个数字代码对应于在每个采样间隔处接收的模拟信号的采样模拟值。 该系统还包括可以存储顺序数字代码的存储器，以及用于将数字代码转换为一系列二进制数据位的处理电路。 转换可以以与数字代码存储在存储器中的顺序不同的顺序执行。

    High density multichip interconnect decal grid array with epoxy interconnects and transfer tape underfill
    54.
    发明授权
    High density multichip interconnect decal grid array with epoxy interconnects and transfer tape underfill 失效
    高密度多芯片互连贴片网格阵列，具有环氧互连和转移胶带底部填充

    公开(公告)号：US06435883B1

    公开(公告)日：2002-08-20

    申请号：US08936321

    申请日：1997-09-24

    申请人： Robert W. Warren

    发明人： Robert W. Warren

    IPC分类号： H01R1200

    CPC分类号： H01L23/49827 ,  H01L23/4985 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/321 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/063 ,  H01L2224/05599

    摘要： A grid array interconnect structure and method for interconnecting and removing a high density multichip interconnect decal, or grid array package, to and from a printed wiring board. The interconnect structure comprises conductive epoxy interconnects and nonconductive transfer tape that has adhesive disposed on both sides thereof. The transfer tape is applied to the back of the high density multichip interconnect decal or package. Conductive epoxy is disposed in pre-formed holes of the two-sided transfer tape and is partially cured to a semi-rigid condition to form the conductive epoxy interconnects. A mylar film may be applied to the exposed surface of the transfer tape. With the mylar film removed from the surface of the transfer tape, the decal or package is secured to the printed wiring board and a slight force is applied. This assembly is then cured. The decal or package may be removed and replaced without damage to the printed wiring board by reheating the assembly to soften the transfer tape and interconnects.

    摘要翻译： 一种网格阵列互连结构和方法，用于将高密度多芯片互连贴片或网格阵列封装互连并移出印刷电路板。 互连结构包括具有设置在其两侧的粘合剂的导电环氧树脂互连和非导电转移带。 转移带应用于高密度多芯片互连贴片或封装的背面。 导电环氧树脂设置在双面转印带的预先形成的孔中，并部分固化至半刚性状态以形成导电环氧树脂互连。 聚酯薄膜可以施加到转印带的暴露表面。 在从转印带表面除去聚酯薄膜的情况下，将贴花或包装固定在印刷线路板上，施加轻微的力。 然后将该组件固化。 贴纸或包装可以通过重新加热组件来软化转印带和互连，而不损坏印刷线路板而被更换。

    Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds
    55.
    发明授权
    Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds 失效
    使用高密度多芯互连贴片和三键菊花链楔形键的三维组件堆叠

    公开(公告)号：US5905639A

    公开(公告)日：1999-05-18

    申请号：US939835

    申请日：1997-09-29

    申请人： Robert W. Warren

    发明人： Robert W. Warren

    IPC分类号： H01L23/538 ,  H01L25/16 ,  H05K5/02 ,  H01L23/12

    CPC分类号： H01L23/5385 ,  H01L25/162 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107

    摘要： A three-dimensional circuit structure that interconnects an integrated circuit chip, along with additional active devices and passive components to a substrate by way of a high density multichip interconnect decal disposed on the integrated circuit chip. The three-dimensional circuit structure thus comprises the substrate, an integrated circuit attached to the top of the substrate, and the high density multichip interconnect decal attached to the integrated circuit. One or more passive components and relatively small active devices are attached to the top of the high density multichip interconnect decal. A plurality of three-bond, daisy-chained wedge bonds are used to interconnect the active devices and passive components to the substrate by way of the HDMI decal. Each wedge bond comprises a wire that initiates at an HDMI decal bond pad, an intermediate stitch bond at an integrated circuit bond pad, and terminates at a substrate bond pad.

    摘要翻译： 一种三维电路结构，其通过设置在集成电路芯片上的高密度多芯片互连贴片将集成电路芯片与附加的有源器件和无源部件连接到衬底。 因此，三维电路结构包括衬底，附着到衬底顶部的集成电路和附接到集成电路的高密度多芯片互连贴片。 一个或多个无源部件和相对小的有源器件连接到高密度多芯片互连贴片的顶部。 多个三键，菊花链楔形键用于通过HDMI贴花将有源器件和无源元件互连到衬底。 每个楔形键合包括在HDMI贴花焊盘处开始的导线，在集成电路接合焊盘处的中间缝合键，并终止于衬底接合焊盘。

    Pulsed alignment commutation state for sensorless motor start
    56.
    发明授权
    Pulsed alignment commutation state for sensorless motor start 失效
    无传感器电机启动的脉冲对准换向状态

    公开(公告)号：US5821715A

    公开(公告)日：1998-10-13

    申请号：US687738

    申请日：1996-07-26

    申请人： Eugene F. Plutowski ,  Robert W. Warren

    发明人： Eugene F. Plutowski ,  Robert W. Warren

    IPC分类号： H02P1/04 ,  H02P6/00 ,  H02P6/20

    CPC分类号： H02P1/04 ,  H02P6/20 ,  H02P6/28

    摘要： A start-up controller is programmed to reduce current to a motor during a coast phase of an alignment state of the motor. The alignment state is divided into a plurality of phases based on time elapsed from the start of the alignment phase and the controller reduces the current when the elapsed time is substantially between a start and end time that define the coast phase. Because reduced current is provided to the motor during the coast phase, the total power and thus the thermal load on control components for the motor is decreased while the time the motor requires to "settle" into alignment is only slightly increased.

    摘要翻译： 启动控制器被编程为在马达的对准状态的滑行阶段期间减小电动机的电流。 基于从对准相位开始起经过的时间，对准状态被分成多个相位，并且当经过时间基本上在限定海岸相位的开始和结束时间之间时，控制器减小电流。 由于在滑行阶段期间向电动机提供减小的电流，因此电动机控制部件的总功率和热负荷降低，而马达需要“沉降”成对准的时间仅略微增加。

    Systems and methods for mobile data storage and acquisition
    60.
    发明授权
    Systems and methods for mobile data storage and acquisition 有权
    移动数据存储和采集的系统和方法

    公开(公告)号：US08301195B2

    公开(公告)日：2012-10-30

    申请号：US12280787

    申请日：2007-06-25

    申请人： Robert W. Warren ,  Stephen N. Haddad ,  Fadi Afa Al-Refaee ,  Nikolai K. Bahram

    发明人： Robert W. Warren ,  Stephen N. Haddad ,  Fadi Afa Al-Refaee ,  Nikolai K. Bahram

    IPC分类号： H04B1/38

    CPC分类号： H04M1/6091 ,  H04L67/04 ,  H04L67/12 ,  Y02D30/40 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/146 ,  Y02D70/164 ,  Y02D70/168

    摘要： Various data acquisition, storage and/or distribution systems and devices are described herein. As one example, a mobile data acquisition and distribution device is described. The device includes a non-volatile storage medium, a wireless interface, and a processor. The non-volatile storage medium includes instructions executable by the processor to: receive a user data set, and to store the user data set to the non-volatile storage medium. The instructions are further executable by the processor to receive a request initiated through a remote user interface via the wireless interface. Where the request is to provide the user data set to a recipient device, the instructions are further executable by the processor to provide the user data set to the recipient device via the wireless interface.

    摘要翻译： 本文描述了各种数据采集，存储和/或分配系统和设备。 作为一个示例，描述了移动数据采集和分发设备。 该设备包括非易失性存储介质，无线接口和处理器。 非易失性存储介质包括可由处理器执行以下操作的指令：接收用户数据集，并将用户数据集存储到非易失性存储介质。 指令还可由处理器执行，以经由无线接口接收通过远程用户界面发起的请求。 在请求将用户数据集提供给接收方设备的地方，指令还可由处理器执行，以经由无线接口将用户数据集提供给接收方设备。