公开(公告)号：US08304869B2

公开(公告)日：2012-11-06

申请号：US12185061

申请日：2008-08-01

申请人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

IPC分类号： H01L23/495 ,  H01L21/44

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49531 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An integrated circuit package on package system includes: providing a lead having a wire-bonded die with a bond wire connected thereto; mounting a fan-in interposer over the wire-bonded die and the bond wire; connecting the fan-in interposer to the lead with the bond wires; and encapsulating the wire-bonded die, bond wires, and the fan-in interposer with an encapsulation leaving a portion of the fan-in interposer exposed.

摘要翻译： 包装系统上的集成电路封装包括：提供具有与其连接的接合线的引线接合管芯的引线; 将插入式插入器安装在引线接合芯片和接合线上; 使用接合线将风扇插入插座连接到引线; 并且用封装封装引线接合的管芯，接合引线和风扇插入器，从而使风扇插入件的一部分露出。

公开(公告)号：US20120241928A1

公开(公告)日：2012-09-27

申请号：US13070291

申请日：2011-03-23

申请人： Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

发明人： Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

IPC分类号： H01L25/07 ,  H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49558 ,  H01L23/49861 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit packaging system and method of manufacture thereof includes: leads and a paddle; a first encapsulant molded between the leads and the paddle, the first encapsulant thinner than the leads; a non-conductive layer over the paddle; and conductive traces directly on the leads, the first encapsulant, and the non-conductive layer.

摘要翻译： 集成电路封装系统及其制造方法包括：引线和桨; 模制在引线和桨之间的第一密封剂，第一密封剂比引线更薄; 在桨上的非导电层; 导电迹线直接在引线，第一密封剂和非导电层上。

公开(公告)号：US08273602B2

公开(公告)日：2012-09-25

申请号：US12046430

申请日：2008-03-11

申请人： Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Jose Alvin Caparas

发明人： Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Jose Alvin Caparas

IPC分类号： H01L21/00

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49531 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/48 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system comprising: fabricating a package base including: forming a lead frame, coupling a first integrated circuit device under the lead frame, coupling a second integrated circuit device over the first integrated circuit device, and molding an enclosure on the lead frame, the first integrated circuit device, and the second integrated circuit device for forming an integration port; and coupling a third integrated circuit device on the integration port.

摘要翻译： 一种集成电路封装系统，包括：制造封装基座，包括：形成引线框架，将引线框架下方的第一集成电路器件耦合到第一集成电路器件上的第二集成电路器件，以及将引线框架上的外壳模制成型 ，第一集成电路器件和用于形成集成端口的第二集成电路器件; 并在集成端口上耦合第三集成电路器件。

公开(公告)号：US08216883B2

公开(公告)日：2012-07-10

申请号：US13023329

申请日：2011-02-08

申请人： Zigmund Ramirez Camacho ,  Dioscoro A. Merilo ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Dioscoro A. Merilo ,  Lionel Chien Hui Tay

IPC分类号： H01L21/58

CPC分类号： H01L23/49541 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/49568 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing a semiconductor package system includes: providing a leadframe, having an open center, with leads adjacent to a peripheral edge of the leadframe; making a die support pad, formed without tie bars, separately from the leadframe; providing a coverlay tape for positioning the support pad centered within the leadframe; attaching a semiconductor die to the die support pad through a die attach adhesive, the semiconductor die being spaced from the leads; and connecting a bonding pad on the semiconductor die to one of the leads using a bonding wire.

摘要翻译： 一种用于制造半导体封装系统的方法，包括：提供具有开放中心的引线框架，其具有与引线框架的周边边缘相邻的引线; 制成与引线框分开形成的没有连接条的模具支撑垫; 提供用于将所述支撑垫定位在所述引线框内的中心的覆盖带; 通过管芯附着粘合剂将半导体管芯附接到管芯支撑焊盘，半导体管芯与引线间隔开; 以及使用接合线将半导体管芯上的接合焊盘连接到引线之一。

公开(公告)号：US20120139121A1

公开(公告)日：2012-06-07

申请号：US12961490

申请日：2010-12-06

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Dioscoro A. Merilo ,  Emmanuel Espiritu

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Dioscoro A. Merilo ,  Emmanuel Espiritu

IPC分类号： H01L21/50 ,  H01L23/52

CPC分类号： H01L23/49582 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead having a horizontal ridge at a lead top side; forming a connection layer having an inner pad and an outer pad directly on the lead top side, the inner pad having an inner pad bottom surface; mounting an integrated circuit over the inner pad; applying a molding compound, having a molding bottom surface, over the integrated circuit, the inner pad, and the outer pad; and applying a dielectric directly on the molding bottom surface and the inner pad bottom surface.

摘要翻译： 一种集成电路封装系统的制造方法，包括：在引线顶侧形成具有水平脊的引线; 在所述引线顶侧上直接形成具有内焊盘和外焊盘的连接层，所述内焊盘具有内焊盘底面; 在内垫上安装集成电路; 将具有成型底面的模塑料涂覆在集成电路上，内衬垫和外垫上; 并将电介质直接施加在模制底表面和内垫底表面上。

公开(公告)号：US08193037B1

公开(公告)日：2012-06-05

申请号：US12961490

申请日：2010-12-06

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Dioscoro A. Merilo ,  Emmanuel Espiritu

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Dioscoro A. Merilo ,  Emmanuel Espiritu

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L23/49582 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead having a horizontal ridge at a lead top side; forming a connection layer having an inner pad and an outer pad directly on the lead top side, the inner pad having an inner pad bottom surface; mounting an integrated circuit over the inner pad; applying a molding compound, having a molding bottom surface, over the integrated circuit, the inner pad, and the outer pad; and applying a dielectric directly on the molding bottom surface and the inner pad bottom surface.

摘要翻译： 一种集成电路封装系统的制造方法，包括：在引线顶侧形成具有水平脊的引线; 在所述引线顶侧上直接形成具有内焊盘和外焊盘的连接层，所述内焊盘具有内焊盘底面; 在内垫上安装集成电路; 将具有成型底面的模塑料涂覆在集成电路上，内衬垫和外垫上; 并将电介质直接施加在模制底表面和内垫底表面上。

公开(公告)号：US20120074548A1

公开(公告)日：2012-03-29

申请号：US12890491

申请日：2010-09-24

申请人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49548 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/013 ,  H01L2924/01046 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent the package paddle, the lead having a lead overhang protruding from a lead non-horizontal side and a lead ridge protruding from the lead non-horizontal side; mounting an integrated circuit over the package paddle; connecting an electrical connector to the lead and the integrated circuit; and forming an encapsulation over the integrated circuit, the lead, and the package paddle, the encapsulation under the lead overhang.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成封装焊盘; 在所述封装焊盘附近形成引线，所述引线具有从引线非水平侧突出的引线突出端和从所述引线非水平侧突出的引线脊; 在封装桨上安装集成电路; 将电连接器连接到引线和集成电路; 以及在集成电路，引线和封装焊盘上形成封装，引线突出处的封装。

公开(公告)号：US20120068363A1

公开(公告)日：2012-03-22

申请号：US12884102

申请日：2010-09-16

申请人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

IPC分类号： H01L23/482 ,  H01L21/02 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L21/4832 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a package paddle group having a first package paddle electrically isolated from a second package paddle; attaching an integrated circuit device on the first package paddle and the second package paddle; forming a standoff terminal adjacent the package paddle group and electrically connected to the integrated circuit device; connecting a paddle connector to the integrated circuit device and the first package paddle and another paddle connector to the integrated circuit device and the second package paddle; and forming an encapsulation over the integrated circuit device, the first package paddle, the second package paddle, and the standoff terminal, the encapsulation exposing a portion of the first package paddle, the second package paddle, and the standoff terminal.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成具有与第二封装焊盘电隔离的第一封装焊盘的封装焊盘组; 将集成电路装置附接在所述第一封装焊盘和所述第二封装焊盘上; 形成与所述封装焊盘组相邻并且与所述集成电路器件电连接的支座端子; 将桨式连接器连接到集成电路器件和第一封装焊盘，以及将另一个焊盘连接器连接到集成电路器件和第二封装焊盘; 以及在所述集成电路器件，所述第一封装焊盘，所述第二封装焊盘和所述支座端子之间形成封装，所述封装暴露所述第一封装焊盘的一部分，所述第二封装焊盘和所述支座端子。

公开(公告)号：US20120068318A1

公开(公告)日：2012-03-22

申请号：US12884073

申请日：2010-09-16

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49582 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having a hole, a recess, and a pad, the hole over the recess; mounting an integrated circuit to the package paddle; forming a lead having a bottom surface coplanar with a bottom surface of the pad, the lead isolated from the package paddle; attaching connectors directly on the integrated circuit, the lead, and the package paddle; and forming an encapsulation covering the integrated circuit and within the hole and the recess.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有孔，凹槽和垫的封装桨，该凹槽上方的孔; 将集成电路安装到封装焊盘上; 形成具有与所述垫的底表面共面的底表面的引线，所述引线与所述封装焊盘隔离; 将连接器直接连接在集成电路，引线和封装焊盘上; 以及形成覆盖所述集成电路并且在所述孔和所述凹部内的封装。

公开(公告)号：US08120150B2

公开(公告)日：2012-02-21

申请号：US11857402

申请日：2007-09-18

申请人： Guruprasad Badakere Govindaiah ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Guruprasad Badakere Govindaiah ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/44

CPC分类号： H01L23/49503 ,  H01L23/495 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An integrated circuit package system includes: forming a die-attach paddle, a terminal pad, and an external interconnect with the external interconnect below the terminal pad; connecting an integrated circuit die with the terminal pad and the external interconnect; and forming an encapsulation, having a first side and a second side at an opposing side to the first side, surrounding the integrated circuit die with the terminal pad exposed at the first side and the external interconnect extending below the second side.

摘要翻译： 集成电路封装系统包括：在端子焊盘下方形成管芯附接焊盘，端子焊盘和与外部互连的外部互连; 将集成电路管芯与端子焊盘和外部互连连接; 并且形成封装件，其具有与所述第一侧相对的一侧的第一侧和第二侧，围绕所述集成电路管芯，所述端子焊盘在所述第一侧暴露并且所述外部互连件延伸到所述第二侧的下方。