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公开(公告)号：US20080142934A1
公开(公告)日：2008-06-19
申请号：US11610304
申请日：2006-12-13
IPC分类号： H01L23/495
CPC分类号： H01L23/49565 , H01L23/49541 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes an elevated edge leadframe array, isolating leadframes of the elevated edge leadframe array, validating integrated circuit die attached to the leadframes, and forming integrated circuit packages including the integrated circuit die.
摘要翻译： 集成电路封装系统包括升高的边缘引线框架阵列，隔离升高的边缘引线框阵列的引线框架，验证附接到引线框架的集成电路管芯，以及形成包括集成电路管芯的集成电路封装。
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公开(公告)号：US08633578B2
公开(公告)日：2014-01-21
申请号：US13196279
申请日：2011-08-02
IPC分类号： H01L23/02
CPC分类号： H01L23/3128 , H01L22/32 , H01L23/3135 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06565 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/32145 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system with laminate base includes: a base package including: a laminate substrate strip, an integrated circuit on the laminate substrate strip, a molded cover over the integrated circuit and the laminate substrate strip, and a strip test of the base package; a bare die on the base package; the bare die electrically connected to the laminate substrate strip; and the bare die and the base package encapsulated.
摘要翻译： 一种具有层压基座的集成电路封装系统，包括：基座封装，包括：叠层基板条，叠层基板条上的集成电路，集成电路上的模制盖和叠层基板条，以及基板封装 ; 在基础包上裸露的裸片; 所述裸模与所述层叠基板条电连接; 并封装了裸芯片和基底封装。
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53.发明授权Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof 有权集成电路封装系统，具有整体内部引线和焊盘及其制造方法公开(公告)号：US08633062B2
公开(公告)日：2014-01-21
申请号：US12823079
申请日：2010-06-24
IPC分类号： H01L21/00 , H01L23/495
CPC分类号： H01L23/49548 , H01L23/49503 , H01L23/552 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4943 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit package system includes: forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle.
摘要翻译： 一种制造集成电路封装系统的方法包括：在所述板和所述外引线之间形成桨，外引线和内引线; 形成所述桨叶的非垂直桨叶边缘和所述内部导杆的面向所述非垂直桨叶边缘的非垂直前缘; 并将集成电路管芯封装在所述桨上。
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公开(公告)号：US07868471B2
公开(公告)日：2011-01-11
申请号：US11854934
申请日：2007-09-13
申请人： Zigmund Ramirez Camacho , Arnel Trasporto , Jeffrey D. Punzalan , Abelardo Hadap Advincula, Jr.
发明人： Zigmund Ramirez Camacho , Arnel Trasporto , Jeffrey D. Punzalan , Abelardo Hadap Advincula, Jr.
IPC分类号： H01L23/495
CPC分类号： H01L23/49551 , H01L23/3135 , H01L23/49575 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package-in-package system includes: forming an integrated circuit package system including: connecting a first integrated circuit die and a lead, and forming an inner encapsulation covering the first integrated circuit die and a portion of the lead; mounting a second integrated circuit die to the integrated circuit package system; connecting the second integrated circuit die and the lead; and forming a package encapsulation covering the integrated circuit package system and the second integrated circuit die with the lead exposed.
摘要翻译： 集成电路封装包装系统包括：形成集成电路封装系统，包括：连接第一集成电路管芯和引线，以及形成覆盖所述第一集成电路管芯和所述引线的一部分的内部封装; 将第二集成电路管芯安装到所述集成电路封装系统; 连接第二集成电路管芯和引线; 以及形成覆盖所述集成电路封装系统的封装封装和所述引线暴露的所述第二集成电路管芯。
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公开(公告)号：US07671463B2
公开(公告)日：2010-03-02
申请号：US11277991
申请日：2006-03-30
CPC分类号： H01L23/49503 , H01L23/3107 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/4911 , H01L2924/00014 , H01L2924/01014 , H01L2924/01031 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An integrated circuit package system is provided forming a ring above a paddle and an external interconnect, mounting an integrated circuit die on the paddle, connecting the integrated circuit die and the external interconnect, the external interconnect and the ring, and the ring and the integrated circuit die, and encapsulating the integrated circuit die, the ring, and a portion of the external interconnect and the paddle.
摘要翻译： 提供了一种集成电路封装系统，其形成在桨上方的环和外部互连件，将集成电路管芯安装在桨上，连接集成电路管芯和外部互连，外部互连和环以及环和集成 并且封装集成电路管芯，环以及外部互连和桨的一部分。
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公开(公告)号：US07563647B2
公开(公告)日：2009-07-21
申请号：US11456532
申请日：2006-07-10
IPC分类号： H01L21/00 , H01R43/00 , H01L23/495
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L2224/10175 , H01L2224/16 , H01L2224/16245 , H01L2924/3841 , Y10T29/49121 , Y10T29/49169 , Y10T29/49181
摘要： An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.
摘要翻译： 提供具有互连支持的集成电路封装系统，包括提供集成电路，在集成电路上形成电互连，形成具有芯片支撑的接触焊盘，以及通过电互连将集成电路耦合到接触焊盘， 集成电路在芯片上的支持。
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公开(公告)号：US07400049B2
公开(公告)日：2008-07-15
申请号：US11307683
申请日：2006-02-16
IPC分类号： H01L23/28
CPC分类号： H01L23/4334 , H01L21/568 , H01L23/3135 , H01L23/49568 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided forming an external interconnect from a padless lead frame, encapsulating a heat sink and the external interconnect, mounting an integrated circuit die on the heat sink, and encapsulating the integrated circuit die, the heat sink, and the external interconnect.
摘要翻译： 提供一种集成电路封装系统，其形成来自无引脚引线框架的外部互连，封装散热器和外部互连，将集成电路管芯安装在散热器上，以及封装集成电路管芯，散热器和外部 互连。
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公开(公告)号：US20080017960A1
公开(公告)日：2008-01-24
申请号：US11459325
申请日：2006-07-21
IPC分类号： H01L23/02
CPC分类号： H01L23/3128 , H01L22/32 , H01L23/3135 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06565 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/32145 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system with laminate base is provided including forming a base package including, forming a laminate substrate strip, mounting an integrated circuit on the laminate substrate strip, forming a molded cover over the integrated circuit and the laminate substrate strip, and performing a strip test of the base package; attaching a bare die to the base package; connecting electrically the bare die to the laminate substrate strip; and encapsulating the bare die and the base package.
摘要翻译： 提供了一种具有层叠基底的集成电路封装系统，包括形成基底封装，包括形成层压衬底条，将集成电路安装在层叠衬底条上，在集成电路和叠层衬底条上形成模制盖， 基础包装的剥离试验; 将裸模附接到基底包装; 将裸模电连接到层压基板条上; 并封装裸芯片和基底封装。
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公开(公告)号：US07274089B2
公开(公告)日：2007-09-25
申请号：US11162682
申请日：2005-09-19
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L21/4828 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/27013 , H01L2224/29007 , H01L2224/29191 , H01L2224/29198 , H01L2224/2929 , H01L2224/29339 , H01L2224/2939 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2224/8385 , H01L2924/00014 , H01L2924/01047 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/0715 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system including an integrated circuit die and a lead frame with a trenched die pad. The integrated circuit die is mounted to the trenched die pad.
摘要翻译： 一种集成电路封装系统，包括集成电路管芯和具有沟槽管芯焊盘的引线框架。 集成电路管芯安装到沟槽焊盘上。
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60.发明授权公开(公告)号：US08129827B2
公开(公告)日：2012-03-06
申请号：US11855114
申请日：2007-09-13
申请人： Zigmund Ramirez Camacho , Jeffrey D. Punzalan , Jairus Legaspi Pisigan , Abelardo Jr Hadap Advincula
发明人： Zigmund Ramirez Camacho , Jeffrey D. Punzalan , Jairus Legaspi Pisigan , Abelardo Jr Hadap Advincula
IPC分类号： H01L23/02
CPC分类号： H01L23/3135 , H01L23/3107 , H01L23/49541 , H01L23/49575 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L2224/05571 , H01L2224/05573 , H01L2224/16145 , H01L2224/16245 , H01L2224/32225 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1029 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes: forming an external interconnect; connecting an integrated circuit die and the external interconnect; forming a package encapsulation, having a recess, covering the integrated circuit die with a portion of the external interconnect exposed by the recess; and connecting an integrated circuit device and the external interconnect in the recess.
摘要翻译： 集成电路封装系统包括：形成外部互连; 连接集成电路管芯和外部互连; 形成具有凹部的封装封装，用所述凹部暴露的外部互连部分覆盖所述集成电路管芯; 并将集成电路器件和外部互连件连接在凹槽中。
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