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1.发明授权公开(公告)号：US08129827B2
公开(公告)日：2012-03-06
申请号：US11855114
申请日：2007-09-13
申请人： Zigmund Ramirez Camacho , Jeffrey D. Punzalan , Jairus Legaspi Pisigan , Abelardo Jr Hadap Advincula
发明人： Zigmund Ramirez Camacho , Jeffrey D. Punzalan , Jairus Legaspi Pisigan , Abelardo Jr Hadap Advincula
IPC分类号： H01L23/02
CPC分类号： H01L23/3135 , H01L23/3107 , H01L23/49541 , H01L23/49575 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L2224/05571 , H01L2224/05573 , H01L2224/16145 , H01L2224/16245 , H01L2224/32225 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1029 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes: forming an external interconnect; connecting an integrated circuit die and the external interconnect; forming a package encapsulation, having a recess, covering the integrated circuit die with a portion of the external interconnect exposed by the recess; and connecting an integrated circuit device and the external interconnect in the recess.
摘要翻译： 集成电路封装系统包括：形成外部互连; 连接集成电路管芯和外部互连; 形成具有凹部的封装封装，用所述凹部暴露的外部互连部分覆盖所述集成电路管芯; 并将集成电路器件和外部互连件连接在凹槽中。
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公开(公告)号：US08258614B2
公开(公告)日：2012-09-04
申请号：US11938371
申请日：2007-11-12
申请人： Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Abelardo Jr. Hadap Advincula , Lionel Chien Hui Tay
发明人： Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Abelardo Jr. Hadap Advincula , Lionel Chien Hui Tay
IPC分类号： H01L23/06
CPC分类号： H01L25/03 , H01L21/561 , H01L23/13 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L25/105 , H01L25/50 , H01L2224/05553 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/14 , H01L2924/1515 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit package system comprising: providing a substrate having a cavity; sealing a package over the cavity of the substrate; and forming an encapsulant over the package and a portion of the substrate substantially preventing the encapsulant from forming in the cavity.
摘要翻译： 一种集成电路封装系统，包括：提供具有空腔的衬底; 将封装密封在衬底的空腔上; 以及在所述封装上形成密封剂，并且所述衬底的一部分基本上防止所述密封剂在所述空腔中形成。
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公开(公告)号：US08067825B2
公开(公告)日：2011-11-29
申请号：US11863700
申请日：2007-09-28
申请人： Abelardo Jr. Hadap Advincula , Zigmund Ramirez Camacho , Henry Descalzo Bathan , Jairus Legaspi Pisigan
发明人： Abelardo Jr. Hadap Advincula , Zigmund Ramirez Camacho , Henry Descalzo Bathan , Jairus Legaspi Pisigan
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/49503 , H01L24/28 , H01L24/29 , H01L24/31 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/05554 , H01L2224/2919 , H01L2224/29288 , H01L2224/29339 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2224/83 , H01L2924/00014 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/0665 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes providing die; forming leads adjacent the die; forming a die paddle adjacent the leads with the die thereover; and forming a cavity for isolating one of the die and a die attach segment of the die paddle.
摘要翻译： 集成电路封装系统包括提供裸片; 在模具附近形成引线; 在其上与模具形成邻近引线的芯片; 以及形成用于隔离所述管芯和所述管芯焊盘的管芯附接部分中的一个的腔。
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4.发明授权公开(公告)号：US08278148B2
公开(公告)日：2012-10-02
申请号：US11854989
申请日：2007-09-13
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2224/85001 , H01L2224/92247 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An integrated circuit package system is provided including forming a leadframe having a frame and a die paddle having leads thereon. The leads are held with respect to the die paddle. The leads are separated from the die paddle, and a die is attached to the die paddle. Bond wires are bonded between the leads and the die. The die and bond wires are encapsulated. The leadframe is singulated to separate the frame and the die paddle.
摘要翻译： 提供了一种集成电路封装系统，包括形成具有框架的引线框架和在其上具有引线的管芯焊盘。 导线相对于芯片被保持。 引线与管芯分离，并且管芯附接到管芯焊盘。 接合线结合在引线和芯片之间。 管芯和接合线被封装。 引导框架被单独分离框架和模具桨。
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公开(公告)号：US07915724B2
公开(公告)日：2011-03-29
申请号：US11864826
申请日：2007-09-28
申请人： Jong-Woo Ha , Koo Hong Lee , Soo Won Lee , JuHyun Park , Zigmund Ramirez Camacho , Jeffrey D. Punzalan , Lionel Chien Hui Tay , Jairus Legaspi Pisigan
发明人： Jong-Woo Ha , Koo Hong Lee , Soo Won Lee , JuHyun Park , Zigmund Ramirez Camacho , Jeffrey D. Punzalan , Lionel Chien Hui Tay , Jairus Legaspi Pisigan
CPC分类号： H01L23/3121 , H01L24/48 , H01L24/73 , H01L25/03 , H01L2224/05568 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/06558 , H01L2924/00014 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit packaging system including: forming a base structure, having an opening; mounting a base structure device in the opening; attaching an integrated circuit device over the base structure device; and molding an encapsulant on the base structure, the base structure device, and the integrated circuit device.
摘要翻译： 一种集成电路封装系统，包括：形成具有开口的基座结构; 将基座结构装置安装在开口中; 将集成电路装置连接在所述基座结构装置上; 以及在所述基座结构，所述基座结构装置和所述集成电路装置上模制密封剂。
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公开(公告)号：US20090085177A1
公开(公告)日：2009-04-02
申请号：US11862406
申请日：2007-09-27
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49541 , H01L21/4832 , H01L23/49548 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/05554 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48095 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83 , H01L2224/92247 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10162 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： An integrated circuit package system includes providing an integrated circuit die; attaching the integrated circuit die over a lead grid having lead blocks; and connecting a die interconnect to the integrated circuit die and the lead blocks.
摘要翻译： 集成电路封装系统包括提供集成电路管芯; 将集成电路管芯连接在具有引线块的引线格栅上; 以及将管芯互连件连接到集成电路管芯和引线块。
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公开(公告)号：US20090085178A1
公开(公告)日：2009-04-02
申请号：US11864826
申请日：2007-09-28
申请人： Jong-Woo Ha , Koo Hong Lee , Soo Won Lee , JuHyun Park , Zigmund Ramirez Camacho , Jeffrey D. Punzalan , Lionel Chien Hui Tay , Jairus Legaspi Pisigan
发明人： Jong-Woo Ha , Koo Hong Lee , Soo Won Lee , JuHyun Park , Zigmund Ramirez Camacho , Jeffrey D. Punzalan , Lionel Chien Hui Tay , Jairus Legaspi Pisigan
IPC分类号： H01L23/495 , H01L23/02
CPC分类号： H01L23/3121 , H01L24/48 , H01L24/73 , H01L25/03 , H01L2224/05568 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/06558 , H01L2924/00014 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit packaging system including: forming a base structure, having an opening; mounting a base structure device in the opening; attaching an integrated circuit device over the base structure device; and molding an encapsulant on the base structure, the base structure device, and the integrated circuit device.
摘要翻译： 一种集成电路封装系统，包括：形成具有开口的基座结构; 将基座结构装置安装在开口中; 将集成电路装置连接在所述基座结构装置上; 以及在所述基座结构，所述基座结构装置和所述集成电路装置上模制密封剂。
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8.发明申请公开(公告)号：US20090072412A1
公开(公告)日：2009-03-19
申请号：US11855114
申请日：2007-09-13
CPC分类号： H01L23/3135 , H01L23/3107 , H01L23/49541 , H01L23/49575 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L2224/05571 , H01L2224/05573 , H01L2224/16145 , H01L2224/16245 , H01L2224/32225 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1029 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes: forming an external interconnect; connecting an integrated circuit die and the external interconnect; forming a package encapsulation, having a recess, covering the integrated circuit die with a portion of the external interconnect exposed by the recess; and connecting an integrated circuit device and the external interconnect in the recess.
摘要翻译： 集成电路封装系统包括：形成外部互连; 连接集成电路管芯和外部互连; 形成具有凹部的封装封装，用所述凹部暴露的外部互连部分覆盖所述集成电路管芯; 并将集成电路器件和外部互连件连接在凹槽中。
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公开(公告)号：US20080303123A1
公开(公告)日：2008-12-11
申请号：US12134179
申请日：2008-06-05
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/49541 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/49433 , H01L2224/73265 , H01L2924/00014 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An integrated circuit package system includes: providing a lead terminal; forming a dummy lead near the lead terminal; positioning a base integrated circuit adjacent the lead terminal and the dummy lead; connecting a die connector to the base integrated circuit and the dummy lead; mounting a stackable integrated circuit over the base integrated circuit; and connecting another of the die connector to the stackable integrated circuit and the dummy lead.
摘要翻译： 集成电路封装系统包括：提供引线端子; 在引线端子附近形成虚拟引线; 将基座集成电路定位在引线端子和虚拟引线附近; 将管芯连接器连接到基底集成电路和虚拟引线; 在基础集成电路上安装可堆叠集成电路; 并将另一个模具连接器连接到可堆叠集成电路和虚拟引线。
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公开(公告)号：US08148825B2
公开(公告)日：2012-04-03
申请号：US12134179
申请日：2008-06-05
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/49541 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/49433 , H01L2224/73265 , H01L2924/00014 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An integrated circuit package system includes: providing a lead terminal; forming a dummy lead near the lead terminal; positioning a base integrated circuit adjacent the lead terminal and the dummy lead; connecting a die connector to the base integrated circuit and the dummy lead; mounting a stackable integrated circuit over the base integrated circuit; and connecting another of the die connector to the stackable integrated circuit and the dummy lead.
摘要翻译： 集成电路封装系统包括：提供引线端子; 在引线端子附近形成虚拟引线; 将基座集成电路定位在引线端子和虚拟引线附近; 将管芯连接器连接到基底集成电路和虚拟引线; 在基础集成电路上安装可堆叠集成电路; 并将另一个模具连接器连接到可堆叠集成电路和虚拟引线。
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