公开(公告)号：US06423174B1

公开(公告)日：2002-07-23

申请号：US08668291

申请日：1996-06-21

Applicant: Jon A. Casey ,  Govindarajan Natarajan ,  Robert W. Pasco ,  Vincent P. Peterson

Inventor： Jon A. Casey ,  Govindarajan Natarajan ,  Robert W. Pasco ,  Vincent P. Peterson

IPC: B32B3120

CPC classification number: B32B18/00 ,  B32B37/0023 ,  B32B2038/042 ,  B32B2309/12 ,  B32B2315/02 ,  C04B35/10 ,  C04B35/581 ,  C04B35/6455 ,  C04B2235/658 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/62 ,  C04B2237/64 ,  H01L21/4807

Abstract: The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a coated membrane sheet is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves during the lamination process. After the lamination process, the coated membrane is conveniently removed without causing damage to the cavity shelves or paste pull-outs.

Abstract translation: 本发明一般涉及一种用于在半导体衬底中形成空腔的新装置和方法，而不需要使用插入件。 更具体地，本发明包括一种用于在半导体衬底中制造空腔的装置和方法，其中在层压之前将涂覆的膜片放置在空腔上方并使其符合空腔的轮廓，从而防止凹陷或损坏， 层压过程中的腔架。 在层压处理之后，方便地去除涂覆的膜，而不会损坏腔架或糊状物拉出。

公开(公告)号：US06413339B1

公开(公告)日：2002-07-02

申请号：US09470457

申请日：1999-12-22

Applicant: Govindarajan Natarajan ,  Jon A. Casey ,  Martin E. Klepeis ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Robert A. Rita ,  Subhash L. Shinde

Inventor： Govindarajan Natarajan ,  Jon A. Casey ,  Martin E. Klepeis ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Robert A. Rita ,  Subhash L. Shinde

IPC: B32B3116

CPC classification number: C04B35/2683 ,  C04B35/64 ,  H01F1/0027 ,  H01F41/0253 ,  Y10T156/1056 ,  Y10T156/1057

Abstract: The present invention relates generally to a new metal/magnetic-ceramic laminate with through-holes and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area ceramic laminate magnet with a significant number of holes, integrated metal plate(s) and co-sintered electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display (MMD), and electron beam source, and methods of manufacture thereof.

Abstract translation: 本发明一般涉及具有通孔的新的金属/磁陶瓷层压体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积陶瓷层压体磁体的新方法，用于电子和电子束控制的集成金属板和共烧结电极。 本发明还涉及磁矩阵显示器（MMD）和电子束源，及其制造方法。

公开(公告)号：US6015517A

公开(公告)日：2000-01-18

申请号：US057306

申请日：1998-04-08

Applicant: Jon A. Casey

Inventor： Jon A. Casey

IPC: B22F3/10 ,  B22F3/11 ,  C04B35/638 ,  C04B35/64 ,  C04B38/06 ,  B29C65/00

CPC classification number: B22F3/1021 ,  B22F3/1121 ,  C04B35/638 ,  C04B35/64 ,  C04B38/06 ,  C04B38/068 ,  C04B2111/00267 ,  C04B2111/00482 ,  C04B2111/00793

Abstract: A ceramic contact sheet and setter tile with controlled porosity is introduced, along with the method for making the same. The amount of porosity is controlled by the volume percentage, particle size, and particle shape of a fugitive phase which can be added to the original refractory material slurry used to fabricate setter tiles and contact sheets. The fugitive phase can be used independently to introduce porosity in setter tiles and contact sheets or in conjunction with partial densification. Since porosity is not solely dependent upon partial sintering, higher porosity levels can be achieved with less impact on subsequent mechanical properties of the resultant refractory material.

Abstract translation: 引入了具有受控孔隙率的陶瓷接触片和固定器片及其制造方法。 孔隙度的量由易位相的体积百分比，粒度和颗粒形状控制，这可以添加到用于制造安装器瓦片和接触片材的原始耐火材料浆料中。 逸散相可以独立地用于在固化剂砖和接触片中引入孔隙率，或与部分致密化相结合。 由于孔隙度不仅仅取决于部分烧结，所以可以实现较高的孔隙率水平，而对所得到的耐火材料的随后的机械性能的影响较小。

公开(公告)号：US5870823A

公开(公告)日：1999-02-16

申请号：US756362

申请日：1996-11-27

Applicant: Raschid J. Bezama ,  Jon A. Casey ,  John B. Pavelka ,  Glenn A. Pomerantz

Inventor： Raschid J. Bezama ,  Jon A. Casey ,  John B. Pavelka ,  Glenn A. Pomerantz

IPC: H01L23/473 ,  H05K3/22 ,  H05K3/46

CPC classification number: H01L23/473 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/09701 ,  H01L2924/15312 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49158 ,  Y10T29/49163

Abstract: Disclosed is an electronic packaging substrate which includes a sintered ceramic body having at least one internal layer of wiring and at least one cooling channel internal to and integral with the sintered ceramic body for cooling a heat-generating electronic device placed on the sintered body. Also disclosed is a method of making the electronic packaging substrate.

Abstract translation: 公开了一种电子封装基板，其包括具有至少一个布线内层和至少一个内部并与烧结陶瓷体一体的冷却通道的烧结陶瓷体，用于冷却放置在烧结体上的发热电子器件。 还公开了制造电子封装基板的方法。

公开(公告)号：US5480503A

公开(公告)日：1996-01-02

申请号：US175727

申请日：1993-12-30

Applicant: Jon A. Casey ,  David B. Goland ,  Dinesh Gupta ,  Lester W. Herron ,  James N. Humenik ,  Thomas E. Lombardi ,  John U. Knickerbocker ,  Robert J. Sullivan ,  James R. Wylder

Inventor： Jon A. Casey ,  David B. Goland ,  Dinesh Gupta ,  Lester W. Herron ,  James N. Humenik ,  Thomas E. Lombardi ,  John U. Knickerbocker ,  Robert J. Sullivan ,  James R. Wylder

IPC: H01L21/48 ,  H01L21/68 ,  H01L23/538 ,  H05K1/03 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  B32B31/04 ,  B32B31/12 ,  B32B31/26 ,  B32B31/28

CPC classification number: H01L21/568 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/5383 ,  H01L23/5385 ,  H05K3/20 ,  H05K3/4061 ,  H05K3/4617 ,  H05K3/4629 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  Y10T156/1056 ,  Y10T156/1142 ,  Y10T29/49126 ,  Y10T29/49128

Abstract: Process for producing circuitized greensheets including multi-layer ceramic sub-laminates and composites comprising thin ceramic greensheets carrying and thin, fine line patterned conductive metal layers. The invention comprises releasably-supporting the thin greensheets on a temporary carrier support having an ablatable release layer, preferably over a patterned conductive layer, and filling the vias with conductive metal paste, whereby the thin greensheets are supported against warpage and distortion. The supported greensheets are formed as single layers, pairs and stacks thereof, as desired, and thereafter separated from the temporary support for use.

Abstract translation: 用于生产包括多层陶瓷亚层压板和复合材料的电路化滤纸的方法，该复合材料包括载有薄的陶瓷片材和薄的精细线图案化的导电金属层。 本发明包括在具有可消融脱模层的临时载体支撑件上可释放地支撑薄片，优选地在图案化的导电层之上，并且用导电金属浆料填充该通孔，从而支撑薄的薄片以防止翘曲和变形。 支撑的格子根据需要形成为单层，成对和堆叠，然后与临时支撑件分离使用。

公开(公告)号：US5264399A

公开(公告)日：1993-11-23

申请号：US874916

申请日：1992-04-28

Applicant: Jon A. Casey ,  Sylvia M. DeCarr

Inventor： Jon A. Casey ,  Sylvia M. DeCarr

IPC: C04B35/16 ,  C03C14/00 ,  C04B35/80 ,  C04B38/00 ,  H05K1/03 ,  C03C4/16 ,  C03C10/08 ,  C03C10/12

CPC classification number: C03C14/002 ,  C03C2214/02 ,  C03C2214/20 ,  H05K1/0306

Abstract: A ceramic composite body which includes high purity amorphous silica fibers in a ceramic matrix. The ceramic matrix may be a glass ceramic material, a borosilicate glass material or mixtures thereof.

Abstract translation: 陶瓷复合体，其包括陶瓷基体中的高纯度无定形二氧化硅纤维。 陶瓷基体可以是玻璃陶瓷材料，硼硅酸盐玻璃材料或其混合物。

公开(公告)号：US4885038A

公开(公告)日：1989-12-05

申请号：US858488

申请日：1986-05-01

Applicant: Herbert R. Anderson, Jr. ,  Renuka S. Divakaruni ,  Joseph M. Dynys ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  Raj N. Master ,  Jon A. Casey

Inventor： Herbert R. Anderson, Jr. ,  Renuka S. Divakaruni ,  Joseph M. Dynys ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  Raj N. Master ,  Jon A. Casey

IPC: H05K3/46 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/28

CPC classification number: H01L21/4867 ,  H01L21/4846 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/28 ,  H05K3/4611 ,  H05K3/4629

Abstract: The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.

Abstract translation: 本发明提供了一种制造其中具有铜基导体的多层陶瓷结构的方法，其中可以调节铜基导体的烧结开始以接近或匹配结构的陶瓷部分。 此外，提供了方法，其中用于形成结构陶瓷部分的聚合物粘合剂树脂可以使用含氧环境除去或燃烧，其中氧含量大于200ppm，而不会氧化铜 的导体。