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    Electronic device console with natural draft cooling
    3.
    发明授权
    Electronic device console with natural draft cooling 有权
    具有自然通风冷却功能的电子设备控制台

    公开(公告)号：US09226426B2

    公开(公告)日：2015-12-29

    申请号：US13551693

    申请日：2012-07-18

    申请人： Paul F. Bodenweber ,  Jon A. Casey ,  Chenzhou Lian ,  Kathryn C. Rivera ,  Kamal K. Sikka

    发明人： Paul F. Bodenweber ,  Jon A. Casey ,  Chenzhou Lian ,  Kathryn C. Rivera ,  Kamal K. Sikka

    IPC分类号： G07F17/32 ,  H05K7/20

    CPC分类号： H05K1/0203 ,  H05K7/20127 ,  Y10T29/49002

    摘要： An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.

    摘要翻译： 电子设备控制台包括容纳芯片封装的控制台主体和从控制台主体延伸的导管。 管道的内部容积与控制台主体的内部容积流体连通。 第一个排气口位于管道的远端。 第二个通风口位于控制台的墙壁上。 控制台可以以第一方向和第二方向定向。 当控制台在第一方向上定向时，管道用作烟囱用于芯片封装的自然对流冷却。 当控制台朝向第二方位时，控制台主体用作烟囱用于芯片封装的自然对流冷却。

    Thermoelectric devices and methods for making the same
    5.
    发明授权
    Thermoelectric devices and methods for making the same 失效
    热电器件及其制造方法

    公开(公告)号：US6121539A

    公开(公告)日：2000-09-19

    申请号：US141481

    申请日：1998-08-27

    申请人： Gregory M. Johnson ,  Jon A. Casey ,  Scott R. Dwyer ,  David C. Long ,  Kevin M. Prettyman

    发明人： Gregory M. Johnson ,  Jon A. Casey ,  Scott R. Dwyer ,  David C. Long ,  Kevin M. Prettyman

    IPC分类号： H01L23/38 ,  H01L35/32 ,  H01L35/28

    CPC分类号： H01L23/38 ,  H01L35/32 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/09701

    摘要： Thermoelectric devices having enhanced thermal characteristics are fabricated using multilayer ceramic (MLC) technology methods. Aluminum nitride faceplates with embedded electrical connections provide the electrical series configuration for alternating dissimilar semiconducting materials. Embedded electrical connections are formed by vias and lines in the faceplate. Methods are employed for forming tunnels through lamination and etching. A portion of the dissimilar materials are then melted within the tunnels to form a bond. Thermal conductivity of the faceplate is enhanced by adding electrically isolated vias to one surface, filled with high thermal conductivity metal paste. A low thermal conductivity material is also introduced between the two high thermal conductivity material faceplates. Alternating semiconducting materials are introduced within the varying thermal conductivity layers by punching vias within greensheets of predetermined thermal conductivity and filling with n-type and p-type paste. Alternating semiconducting materials may also be patterned in linear or radial fanout patterns through screening techniques and lamination of wire structures. A liquid channel within the faceplate is used to enhance thermal energy transfer. Thermoelectric devices are physically incorporated within the IC package using MLC technology.

    摘要翻译： 具有增强的热特性的热电装置使用多层陶瓷（MLC）技术方法制造。 具有嵌入式电连接的氮化铝面板为交替的不同的半导体材料提供了电气串联配置。 嵌入式电气连接由面板中的通孔和线形成。 采用层压法和蚀刻法形成隧道的方法。 然后将不同材料的一部分在隧道内熔化以形成粘结。 通过向一个表面添加电隔离的通孔，填充高导热性金属膏，增强了面板的导热性。 在两个高导热材料面板之间也引入低导热材料。 交替的半导体材料通过在预定导热率的孔内冲压通孔并填充n型和p型浆料而在不同的导热层内引入。 交替的半导体材料还可以通过屏蔽技术和线结构的层叠来以线性或径向扇出图案图案化。 面板内的液体通道用于增强热能传递。 使用MLC技术将热电器件物理地并入IC封装。

    Low-K dielectric material system for IC application
    9.
    发明授权
    Low-K dielectric material system for IC application 有权
    低K电介质材料系统用于IC应用

    公开(公告)号：US07015581B2

    公开(公告)日：2006-03-21

    申请号：US11037995

    申请日：2005-01-18

    申请人： Jon A. Casey ,  Daniel C. Edelstein

    发明人： Jon A. Casey ,  Daniel C. Edelstein

    IPC分类号： H01L23/48 ,  H01L21/4763

    CPC分类号： H01L21/02129 ,  H01L21/02142 ,  H01L21/02164 ,  H01L21/02203 ,  H01L21/02318 ,  H01L21/02343 ,  H01L21/31625 ,  H01L21/31695 ,  H01L21/7682

    摘要： A low-k dielectric for use as an interlayer for an interconnect structure is provided. The dielectric of the present invention is an alkaline boron silicate glass which when formulated in certain compositional ranges can undergo spinodal decomposition when processed using certain thermal profiles. Spinodal decomposition is a chemical and physical separation of the silicate glass into a distinct interpenetrating microstructure which contains a substantially pure silicon dioxide network and a boron-rich network. The dimension (i.e., scale), and the amount of separation can be controlled through compositional and thermal control during the processing of the silicate glass.

    摘要翻译： 提供了用作互连结构的中间层的低k电介质。 本发明的电介质是碱性硼硅酸盐玻璃，当在某些组成范围内配制时，当使用某些热分布进行加工时，可以发生旋节分解。 晶间分解是将硅酸盐玻璃化学和物理分离成独特的互穿微结构，其包含基本上纯的二氧化硅网络和富含硼的网络。 通过在硅酸盐玻璃的加工过程中的组合和热控制可以控制尺寸（即刻度）和分离量。