公开(公告)号：US20180315897A1

公开(公告)日：2018-11-01

申请号：US15965415

申请日：2018-04-27

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Tomokazu MARUYAMA ,  Tetsuya ISHIKAWA

IPC: H01L33/50 ,  H01L33/36 ,  H01L33/60 ,  H01L33/62 ,  H01L33/34 ,  H01L33/56

CPC classification number: H01L33/486 ,  H01L33/62

Abstract: A light-emitting device includes a substrate comprising a base member, a first wiring, a second wiring, and a via hole; at least one light-emitting element electrically connected to and disposed on the first wiring; and a covering member having light reflectivity and covering a lateral surface of the light-emitting element and a front surface of the substrate. The base member defines a plurality of depressed portions separated from the via hole in a front view and opening on a back surface and a bottom surface of the base member. The substrate includes a third wiring covering at least one of inner walls of the plurality of depressed portions and electrically connected to the second wiring. A depth of each of the plurality of depressed portions defined from the back surface toward the front surface is larger on a bottom surface side than on an upper surface side of the base member.

公开(公告)号：US20180033936A1

公开(公告)日：2018-02-01

申请号：US15703591

申请日：2017-09-13

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Akira HORI

IPC: H01L33/64 ,  H01L33/60 ,  H01L33/62 ,  H01L33/32 ,  H01L33/50 ,  H01L33/56

CPC classification number: H01L33/647 ,  H01L25/0753 ,  H01L33/32 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/16225

Abstract: A light emitting device includes a substrate, a light emitting element, a sealing member, a light transmissive member and a heat dissipation terminal. The substrate includes an insulating base material which has a concave portion with an inner curved surface. The sealing member is in contact with at least a part of a side surface of the light emitting element and is formed substantially in the same plane as the substrate on a mounting surface. The light transmissive member covers an upper surface of the light emitting element and a part of an upper surface of the sealing member, side surfaces of the light transmissive member being covered with the sealing member. The heat dissipation terminal is arranged generally in the center on a second main surface of the substrate and that has a recess portion as viewed along a direction normal to the second main surface.

公开(公告)号：US20170229624A1

公开(公告)日：2017-08-10

申请号：US15495822

申请日：2017-04-24

Applicant: NICHIA CORPORATION

Inventor： Suguru BEPPU ,  Yoichi BANDO ,  Hiroto TAMAKI ,  Takuya NAKABAYASHI

IPC: H01L33/60 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/50 ,  H01L2224/73253 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

公开(公告)号：US20170213946A1

公开(公告)日：2017-07-27

申请号：US15427711

申请日：2017-02-08

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L23/49541 ,  H01L21/4842 ,  H01L24/97 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lead frame includes at least one row of a plurality of unit regions arranged in a first direction. Each of the unit regions includes: a first lead; a second lead; and an isolation region configured to isolate the first lead from the second lead, the isolation region including a bent portion that is located at an end part of the second lead. The first lead has an extending portion extending along the end part of the second lead. The plurality of unit regions includes a first unit region, and a second unit region that is adjacent to the first unit region in the first direction. The first lead of the first unit region is connected to the first lead or second lead of the second unit region via the extending portion.

公开(公告)号：US20160247979A1

公开(公告)日：2016-08-25

申请号：US15143700

申请日：2016-05-02

Applicant: NICHIA CORPORATION

Inventor： Shimpei SASAOKA ,  Takuya NAKABAYASHI

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L33/38 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/18301 ,  H05K1/0313 ,  H01L2924/00014

Abstract: A molded package includes a recess, leads, and a molded resin part. The leads include a first lead and a second lead. A part of the recess is defined by a side wall formed from the molded resin part. At least one of the leads includes an upper-surface portion exposed from a bottom surface of the recess. The at least one of the leads includes a groove formed on an upper surface thereof partially below the side wall. The first lead includes an additional groove provided on an upper surface thereof along a side of the first lead positioned opposite a side of the second lead.

Abstract translation: 模制包装包括凹部，引线和模制树脂部件。 引线包括第一引线和第二引线。 凹部的一部分由由模制树脂部分形成的侧壁限定。 引线中的至少一个包括从凹部的底表面露出的上表面部分。 所述引线中的至少一个包括形成在所述侧壁部分下方的上表面上的凹槽。 第一引线包括设置在其上表面上的沿着与第二引线的侧面相对定位的第一引线的一侧的附加槽。

公开(公告)号：US20150340578A1

公开(公告)日：2015-11-26

申请号：US14716535

申请日：2015-05-19

Applicant: NICHIA CORPORATION

Inventor： Hiroto TAMAKI ,  Takuya NAKABAYASHI

IPC: H01L33/62 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/16225

Abstract: A light emitting device including; a base body having a base material that includes a first main face that has a lengthwise direction and a short-side direction that is perpendicular to the lengthwise direction, a second main face on the opposite side from the first main face, a first end face that extends in the lengthwise direction, and a second end face that extends in the short-side direction, and connection terminals that are provided on the first main face of the base material; and a light emitting element that is installed on the first main face and is connected to the connection terminals, the first end face of the base material has a recess that is contiguous with the first main face and the second end face and/or is contiguous with the second main face and the second end face, a length of the recess in a lengthwise direction is greater than a depth in a short-side direction, and the connection terminals are provided extending over the recess.

Abstract translation: 一种发光器件，包括： 具有基材的基体，该基材具有长度方向和与长度方向垂直的短边方向的第一主面，与第一主面相反一侧的第二主面，第一端面 沿长边方向延伸的第二端面和沿短边方向延伸的第二端面，以及设置在基材的第一主面上的连接端子; 以及发光元件，其安装在所述第一主面上并连接到所述连接端子，所述基材的第一端面具有与所述第一主面和所述第二端面邻接的凹部和/或连续的凹部 与第二主面和第二端面相对，凹部的长度方向的长度大于短边方向的深度，连接端子设置在凹部的上方。

公开(公告)号：US20140252574A1

公开(公告)日：2014-09-11

申请号：US14196778

申请日：2014-03-04

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Yoshitaka BANDO ,  Hiroto TAMAKI

IPC: H01L23/495

CPC classification number: H01L23/49537 ,  H01L21/4828 ,  H01L23/49503 ,  H01L23/49544 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49582 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A lead frame of high quality which can endure direct bonding to the electrodes of a semiconductor element and a metal member, and a semiconductor device of high reliability which utilizing the lead frame. The lead frame includes a pair of lead frame portions which are arranged spaced apart from and opposite to each other to be electrically connected to a pair of electrodes of a semiconductor element respectively, and a pair of support bars which are arranged spaced apart from the lead portions and extending from a side of either one of the lead portions to a side of the other lead portion.

Abstract translation: 可以承受与半导体元件和金属构件的电极的直接接合的高质量的引线框架，以及利用引线框架的高可靠性的半导体器件。 引线框架包括一对引线框架部分，它们彼此间隔开并相对设置，以分别与半导体元件的一对电极电连接;以及一对支撑杆，其与引线间隔开设置 部分并且从引导部分中的任一个的一侧延伸到另一个引线部分的一侧。

公开(公告)号：US20240234645A9

公开(公告)日：2024-07-11

申请号：US18401587

申请日：2023-12-31

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Tomokazu MARUYAMA ,  Tetsuya ISHIKAWA

IPC: H01L33/50 ,  H01L33/34 ,  H01L33/36 ,  H01L33/48 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/50 ,  H01L33/34 ,  H01L33/36 ,  H01L33/486 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

Abstract: A light-emitting device includes a substrate comprising a base member, a first wiring, a second wiring, and a via hole; at least one light-emitting element electrically connected to and disposed on the first wiring; and a covering member having light reflectivity and covering a lateral surface of the light-emitting element and a front surface of the substrate. The base member defines a plurality of depressed portions separated from the via hole in a front view and opening on a back surface and a bottom surface of the base member. The substrate includes a third wiring covering at least one of inner walls of the plurality of depressed portions and electrically connected to the second wiring. A depth of each of the plurality of depressed portions defined from the back surface toward the front surface is larger on a bottom surface side than on an upper surface side of the base member.

公开(公告)号：US20240159952A1

公开(公告)日：2024-05-16

申请号：US18507017

申请日：2023-11-10

Applicant: NICHIA CORPORATION

Inventor： Seitaro AKAGAWA ,  Takuya NAKABAYASHI ,  Masato OKUDA ,  Yasunori SHINOMIYA

IPC: F21V8/00

CPC classification number: G02B6/0023

Abstract: A planar light source includes a support member; a light guide member including a first surface located proximate to an upper surface of the support member, a second surface opposite to the first surface, and a through hole extending from the first surface to the second surface; a light source unit including a light-emitting element and a wavelength conversion member that covers an upper surface and a lateral surface of the light-emitting element and disposed on the support member at a position of the through hole; a light-transmissive member disposed between the light source unit and the light guide member in the through hole; and a light adjustment member disposed on the light source unit and the light-transmissive member. An upper surface of the wavelength conversion member of the light source unit is located higher than the second surface of the light guide member.

公开(公告)号：US20230082182A1

公开(公告)日：2023-03-16

申请号：US18057006

申请日：2022-11-18

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Toru HASHIMOTO

IPC: F21V9/30 ,  F21V8/00 ,  G02F1/13357

Abstract: A planar light source includes a light guide member having a through hole, a light source, a first light adjusting member, a second light adjusting member, and a light transmissive member. The first light adjusting member having reflectivity and transmissivity with respect to light from the light source is disposed on or above an upper face of the light source in the through hole. The second light adjusting member having reflectivity and transmissivity with respect to the light from the light source is disposed above and apart from the first light adjusting member. The first light transmissive member having a higher transmissivity with respect to the light from the light source than the transmissivities of the first and second light adjusting members is disposed between the first light adjusting member and the second light adjusting member, and between a lateral face of the light source and the light guide member.