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    Method of making circuitized substrate with internal optical pathway
    51.
    发明申请
    Method of making circuitized substrate with internal optical pathway 有权
    制造具有内部光通路的电路化基板的方法

    公开(公告)号：US20090092353A1

    公开(公告)日：2009-04-09

    申请号：US11907006

    申请日：2007-10-09

    申请人： Benson Chan ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  Mark D. Poliks

    发明人： Benson Chan ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  Mark D. Poliks

    IPC分类号： G02B6/122

    CPC分类号： G02B6/1221 ,  G02B6/132 ,  G02B6/136 ,  G02B6/4214 ,  G02B6/4246 ,  H05K1/0274

    摘要： A circuitized substrate (e.g., PCB) including an internal optical pathway as part thereof such that the substrate is capable of transmitting and/or receiving both electrical and optical signals. The substrate includes an angular reflector on one of the cladding layers such that optical signals passing through the optical core will impinge on the angled reflecting surfaces of the angular reflector and be reflected up through an opening (including one with optically transparent material therein), e.g., to a second circuitized substrate also having at least one internal optical pathway as part thereof, to thus interconnect the two substrates optically. A method of making the substrate is also provided.

    摘要翻译： 包括作为其一部分的内部光学路径的电路化衬底（例如，PCB），使得衬底能够传输和/或接收电信号和光信号。 衬底包括在一个包覆层上的角反射器，使得穿过光学核心的光信号将撞击角形反射器的成角度的反射表面，并通过开口（包括其中具有光学透明材料的一个）反射，例如 涉及另外还具有至少一个内部光学路径作为其一部分的第二电路化基板，从而光学地连接两个基板。 还提供了制造基板的方法。

    Circuitized substrate with internal cooling structure and electrical assembly utilizing same
    52.
    发明授权
    Circuitized substrate with internal cooling structure and electrical assembly utilizing same 失效
    具有内部冷却结构的电路化基板和利用其的电气组件

    公开(公告)号：US07738249B2

    公开(公告)日：2010-06-15

    申请号：US11976468

    申请日：2007-10-25

    申请人： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

    发明人： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

    IPC分类号： H05K7/20

    CPC分类号： H05K1/0206 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/44 ,  H05K2201/064 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00

    摘要： An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation. The thermal cooling structure is adapted for having cooling fluid pass there-through during operation of the assembly. A method of making the substrate is also provided.

    摘要翻译： 一种电气组件，其包括电路化衬底，其包括以层叠取向交替取向的第一多个电介质和导电电路层，结合到所述电介质层之一的热冷结构和安装在所述电路化衬底上的至少一个电气部件。 电路化衬底包括位于其中的多个导电和导热通孔，选择的导热通孔热耦合到电气部件并延伸穿过第一多个电介质和导电电路层，并且 热耦合到热冷却结构，这些选择的导热通孔中的每一个在组装操作期间提供从电气部件到热冷却结构的热路径。 热冷却结构适于在组件的操作期间使冷却流体通过。 还提供了制造基板的方法。

    Circuitized substrate with internal cooling structure and electrical assembly utilizing same
    55.
    发明申请
    Circuitized substrate with internal cooling structure and electrical assembly utilizing same 失效
    具有内部冷却结构的电路化基板和利用其的电气组件

    公开(公告)号：US20090109624A1

    公开(公告)日：2009-04-30

    申请号：US11976468

    申请日：2007-10-25

    申请人： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

    发明人： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

    IPC分类号： H05K7/20 ,  H05K3/20

    CPC分类号： H05K1/0206 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/44 ,  H05K2201/064 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00

    摘要： An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation. The thermal cooling structure is adapted for having cooling fluid pass there-through during operation of the assembly. A method of making the substrate is also provided.

    摘要翻译： 一种电气组件，其包括电路化衬底，其包括以层叠取向交替取向的第一多个电介质和导电电路层，结合到所述电介质层之一的热冷结构和安装在所述电路化衬底上的至少一个电气部件。 电路化衬底包括位于其中的多个导电和导热通孔，选择的导热通孔热耦合到电气部件并延伸穿过第一多个电介质和导电电路层，并且 热耦合到热冷却结构，这些选择的导热通孔中的每一个在组装操作期间提供从电气部件到热冷却结构的热路径。 热冷却结构适于在组件的操作期间使冷却流体通过。 还提供了制造基板的方法。

    Method of making circuitized substrate with internal optical pathway using photolithography
    58.
    发明授权
    Method of making circuitized substrate with internal optical pathway using photolithography 失效
    使用光刻法制造具有内部光学路径的电路化衬底的方法

    公开(公告)号：US07713767B2

    公开(公告)日：2010-05-11

    申请号：US11907004

    申请日：2007-10-09

    申请人： Benson Chan ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  Mark D. Poliks

    发明人： Benson Chan ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  Mark D. Poliks

    IPC分类号： H01L21/77 ,  H01L21/00 ,  G02B6/02 ,  G02B6/12 ,  G03G15/00

    CPC分类号： G02B6/43 ,  G02B6/132 ,  G02B6/136 ,  H05K1/0274

    摘要： A method of making a circuitized substrate (e.g., PCB) including at least one and possibly several internal optical pathways as part thereof such that the resulting substrate will be capable of transmitting and/or receiving both electrical and optical signals. The method involves forming at least one opening between a side of the optical core and an adjacent upstanding member such that the opening is defined by at least one angular sidewall. Light passing through the optical core material (or into the core from above) is reflected off this angular sidewall. The medium (e.g., air) within the opening thus also serves as a reflecting medium due to its own reflective index in comparison to that of the adjacent optical core material. The method utilizes many processes used in conventional PCB manufacturing, thereby keeping costs to a minimum. The formed substrate is capable of being both optically and electrically coupled to one or more other substrates possessing similar capabilities, thereby forming an electro-optical assembly of such substrates.

    摘要翻译： 一种制造电路化衬底（例如PCB）的方法，其包括至少一个可能的几个内部光学路径作为其一部分，使得所得到的衬底将能够传输和/或接收电信号和光信号。 该方法包括在光学核心的一侧和相邻的直立构件之间形成至少一个开口，使得开口由至少一个角形侧壁限定。 通过光学芯材料（或从上方进入芯体）的光从该角形侧壁反射。 因此，开口内的介质（例如空气）由于其相对于相邻的光学芯材料的反射率而与反射介质一样起作用。 该方法利用了常规PCB制造中使用的许多工艺，从而将成本降至最低。 所形成的基底能够光学和电耦合到具有相似能力的一个或多个其它基底，从而形成这种基底的电光学组件。

    Dielectric structure and method of formation
    60.
    发明授权
    Dielectric structure and method of formation 失效
    介电结构和形成方法

    公开(公告)号：US06699350B2

    公开(公告)日：2004-03-02

    申请号：US10217616

    申请日：2002-08-12

    申请人： Anilkumar C. Bhatt ,  Stephen J. Fuerniss ,  Roy H. Magnuson ,  Voya R. Markovich

    发明人： Anilkumar C. Bhatt ,  Stephen J. Fuerniss ,  Roy H. Magnuson ,  Voya R. Markovich

    IPC分类号： B32B3100

    CPC分类号： B32B7/04 ,  B32B27/26 ,  B32B27/32 ,  B32B2250/40 ,  B32B2305/72 ,  H05K3/0023 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/09509 ,  H05K2201/09536 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/28 ,  Y10T428/31511

    摘要： A method for forming a dielectric structure. A first layer is formed, wherein the first layer includes a first fully cured photoimageable dielectric (PID) material. A sticker lays is nonadhesively formed on the first layer, wherein the sticker layer includes a partially cured PID material. A second layer is nonadhesively formed on the sticker layer, wherein the second layer includes a second fully cured PID material, wherein the sticker layer is nonadhesively sandwiched between the first layer and the second layer such that the sticker layer is in non-adhesive contact with the first layer and in non-adhesive contact with the second layer, and wherein the sticker layer is capable of remaining in non-adhesive contact with the first layer and the second layer until the sticker layer is subsequently subjected to additional curing.

    摘要翻译： 一种形成电介质结构的方法。 形成第一层，其中第一层包括第一完全固化的可光成像的电介质（PID）材料。 在第一层上非粘性地形成贴纸，其中贴纸层包括部分固化的PID材料。 第二层非粘性地形成在粘合剂层上，其中第二层包括第二完全固化的PID材料，其中粘合层非粘性地夹在第一层和第二层之间，使得粘合剂层与 所述第一层与所述第二层非粘合接触，并且其中所述粘合剂层能够保持与所述第一层和所述第二层的非粘合性接触，直到所述粘合剂层随后进行另外的固化。