SEMICONDUCTOR DEVICE AND METHOD FOR MEASURING CURRENT OF SEMICONDUCTOR DEVICE
    51.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MEASURING CURRENT OF SEMICONDUCTOR DEVICE 审中-公开
    用于测量半导体器件的电流的半导体器件和方法

    公开(公告)号:US20160054362A1

    公开(公告)日:2016-02-25

    申请号:US14830817

    申请日:2015-08-20

    Abstract: A current measurement method with which an extremely low current can be measured is provided. In the method, a charge written to a first terminal of a capacitor through a transistor under test is retained, data on the correspondence between a potential V of the first terminal of the capacitor and Time t is generated, and a stretched exponential function represented by Formula (a1) is fitted to the data to determine parameters of Formula (a1). The derivative of Formula (a1) with respect to time gives a stretched exponential function describing an off-state current of the transistor under test. The potential of the first terminal of the capacitor is measured using an on-state current of a transistor whose gate is connected to the first terminal of the capacitor. V FN  ( t ) = α ×  - ( t τ ) β ( a   1 )

    Abstract translation: 提供了可以测量极低电流的电流测量方法。 在该方法中,保持通过被测晶体管向电容器的第一端子写入的电荷,产生电容器的第一端子的电位V与时间t之间的对应关系的数据,以及由 公式(a1)拟合到数据中以确定公式(a1)的参数。 式(a1)相对于时间的导数给出描述被测晶体管截止电流的拉伸指数函数。 使用其栅极连接到电容器的第一端子的晶体管的导通状态电流来测量电容器的第一端子的电位。 V FN(t)=α× - (tτ)&bgr; (一个1)

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    53.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20150340509A1

    公开(公告)日:2015-11-26

    申请号:US14819772

    申请日:2015-08-06

    Abstract: An object is to provide a semiconductor device including an oxide semiconductor film, which has stable electrical characteristics and high reliability. A stack of first and second material films is formed by forming the first material film (a film having a hexagonal crystal structure) having a thickness of 1 nm to 10 nm over an insulating surface and forming the second material film having a hexagonal crystal structure (a crystalline oxide semiconductor film) using the first material film as a nucleus. As the first material film, a material film having a wurtzite crystal structure (e.g., gallium nitride or aluminum nitride) or a material film having a corundum crystal structure (α-Al2O3, α-Ga2O3, In2O3, Ti2O3, V2O3, Cr2O3, or α-Fe2O3) is used.

    Abstract translation: 本发明的目的是提供一种具有稳定的电气特性和高可靠性的氧化物半导体膜的半导体装置。 通过在绝缘表面上形成厚度为1nm至10nm的第一材料膜(具有六方晶体结构的膜)形成第一和第二材料膜的叠层,并形成具有六方晶系结构的第二材料膜( 使用第一材料膜作为核的结晶氧化物半导体膜)。 作为第一材料膜,具有纤锌矿晶体结构的材料膜(例如氮化镓或氮化铝)或具有刚玉晶体结构的材料膜(α-Al 2 O 3,α-Ga 2 O 3,In 2 O 3,Ti 2 O 3,V 2 O 3,Cr 2 O 3,或 α-Fe 2 O 3)。

    VOLTAGE REGULATOR CIRCUIT
    55.
    发明申请
    VOLTAGE REGULATOR CIRCUIT 有权
    电压调节器电路

    公开(公告)号:US20150236163A1

    公开(公告)日:2015-08-20

    申请号:US14628439

    申请日:2015-02-23

    Abstract: A transistor includes a gate, a source, and a drain, the gate is electrically connected to the source or the drain, a first signal is input to one of the source and the drain, and an oxide semiconductor layer whose carrier concentration is 5×1014/cm3 or less is used for a channel formation layer. A capacitor includes a first electrode and a second electrode, the first electrode is electrically connected to the other of the source and the drain of the transistor, and a second signal which is a clock signal is input to the second electrode. A voltage of the first signal is stepped up or down to obtain a third signal which is output as an output signal through the other of the source and the drain of the transistor.

    Abstract translation: 晶体管包括栅极,源极和漏极,栅极电连接到源极或漏极,第一信号被输入到源极和漏极中的一个,以及载流子浓度为5× 1014 / cm3以下用于沟道形成层。 电容器包括第一电极和第二电极,第一电极电连接到晶体管的源极和漏极中的另一个,并且作为时钟信号的第二信号被输入到第二电极。 第一信号的电压被升高或降低以获得通过晶体管的源极和漏极中的另一个输出作为输出信号的第三信号。

    OXIDE SEMICONDUCTOR STACKED FILM AND SEMICONDUCTOR DEVICE
    56.
    发明申请
    OXIDE SEMICONDUCTOR STACKED FILM AND SEMICONDUCTOR DEVICE 审中-公开
    氧化物半导体堆叠薄膜和半导体器件

    公开(公告)号:US20150048368A1

    公开(公告)日:2015-02-19

    申请号:US14527076

    申请日:2014-10-29

    Abstract: An oxide semiconductor stacked film which does not easily cause a variation in electrical characteristics of a transistor and has high stability is provided. Further, a transistor which includes the oxide semiconductor stacked film in its channel formation region and has stable electrical characteristics is provided. An oxide semiconductor stacked film includes a first oxide semiconductor layer, a second oxide semiconductor layer, and a third oxide semiconductor layer which are sequentially stacked and each of which contains indium, gallium, and zinc. The content percentage of indium in the second oxide semiconductor layer is higher than that in the first oxide semiconductor layer and the third oxide semiconductor layer, and the absorption coefficient of the oxide semiconductor stacked film, which is measured by the CPM, is lower than or equal to 3×10−3/cm in an energy range of 1.5 eV to 2.3 eV.

    Abstract translation: 提供了不容易引起晶体管的电特性变化并且具有高稳定性的氧化物半导体层叠膜。 此外,提供了在其沟道形成区域中包括氧化物半导体层叠膜并且具有稳定的电特性的晶体管。 氧化物半导体层叠膜包括依次堆叠并且各自含有铟,镓和锌的第一氧化物半导体层,第二氧化物半导体层和第三氧化物半导体层。 第二氧化物半导体层中的铟的含量百分比高于第一氧化物半导体层和第三氧化物半导体层中的铟的含量百分比,并且通过CPM测量的氧化物半导体层叠膜的吸收系数低于或等于 在1.5eV至2.3eV的能量范围内等于3×10-3 / cm。

    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    58.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    制造半导体器件的方法

    公开(公告)号:US20140357018A1

    公开(公告)日:2014-12-04

    申请号:US14459548

    申请日:2014-08-14

    Abstract: To provide a method for manufacturing a thin film transistor in which contact resistance between an oxide semiconductor layer and source and drain electrode layers is small, the surfaces of the source and drain electrode layers are subjected to sputtering treatment with plasma and an oxide semiconductor layer containing In, Ga, and Zn is formed successively over the source and drain electrode layers without exposure of the source and drain electrode layers to air.

    Abstract translation: 为了提供一种制造薄膜晶体管的方法,其中氧化物半导体层和源极和漏极电极层之间的接触电阻很小,源极和漏极电极层的表面用等离子体和含有氧化物半导体层的氧化物半导体层进行溅射处理 In,Ga和Zn依次形成在源极和漏极电极层上,而不会将源极和漏极电极层暴露于空气。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    59.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20140231802A1

    公开(公告)日:2014-08-21

    申请号:US14264301

    申请日:2014-04-29

    Abstract: The semiconductor device includes a driver circuit portion including a driver circuit and a pixel portion including a pixel. The pixel includes a gate electrode layer having a light-transmitting property, a gate insulating layer, a source electrode layer and a drain electrode layer each having a light-transmitting property provided over the gate insulating layer, an oxide semiconductor layer covering top surfaces and side surfaces of the source electrode layer and the drain electrode layer and provided over the gate electrode layer with the gate insulating layer therebetween, a conductive layer provided over part of the oxide semiconductor layer and having a lower resistance than the source electrode layer and the drain electrode layer, and an oxide insulating layer in contact with part of the oxide semiconductor layer.

    Abstract translation: 半导体器件包括驱动器电路部分,其包括驱动器电路和包括像素的像素部分。 像素包括具有透光性的栅极电极层,栅极绝缘层,源极电极层和漏极电极层,其各自具有设置在栅极绝缘层上的透光性,覆盖顶表面的氧化物半导体层和 源极电极层和漏极电极层的侧面,并且在栅电极层之间设置有栅极绝缘层,导电层设置在氧化物半导体层的一部分上,并且具有比源极电极层和漏极 电极层和与氧化物半导体层的一部分接触的氧化物绝缘层。

    OXIDE SEMICONDUCTOR STACKED FILM AND SEMICONDUCTOR DEVICE
    60.
    发明申请
    OXIDE SEMICONDUCTOR STACKED FILM AND SEMICONDUCTOR DEVICE 有权
    氧化物半导体堆叠薄膜和半导体器件

    公开(公告)号:US20140034946A1

    公开(公告)日:2014-02-06

    申请号:US13953428

    申请日:2013-07-29

    Abstract: An oxide semiconductor stacked film which does not easily cause a variation in electrical characteristics of a transistor and has high stability is provided. Further, a transistor which includes the oxide semiconductor stacked film in its channel formation region and has stable electrical characteristics is provided. An oxide semiconductor stacked film includes a first oxide semiconductor layer, a second oxide semiconductor layer, and a third oxide semiconductor layer which are sequentially stacked and each of which contains indium, gallium, and zinc. The content percentage of indium in the second oxide semiconductor layer is higher than that in the first oxide semiconductor layer and the third oxide semiconductor layer, and the absorption coefficient of the oxide semiconductor stacked film, which is measured by the CPM, is lower than or equal to 3×10−3/cm in an energy range of 1.5 eV to 2.3 eV.

    Abstract translation: 提供了不容易引起晶体管的电特性变化并且具有高稳定性的氧化物半导体层叠膜。 此外,提供了在其沟道形成区域中包括氧化物半导体层叠膜并且具有稳定的电特性的晶体管。 氧化物半导体层叠膜包括依次堆叠并且各自含有铟,镓和锌的第一氧化物半导体层,第二氧化物半导体层和第三氧化物半导体层。 第二氧化物半导体层中的铟的含量百分比高于第一氧化物半导体层和第三氧化物半导体层中的铟的含量百分比,并且通过CPM测量的氧化物半导体层叠膜的吸收系数低于或等于 在1.5eV至2.3eV的能量范围内等于3×10-3 / cm。

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