公开(公告)号：US08274047B2

公开(公告)日：2012-09-25

申请号：US12537414

申请日：2009-08-07

申请人： Yoshihiko Naito ,  Norio Kimura ,  Kenji Terao ,  Masahiro Hatakeyama ,  Masamitsu Itoh

发明人： Yoshihiko Naito ,  Norio Kimura ,  Kenji Terao ,  Masahiro Hatakeyama ,  Masamitsu Itoh

IPC分类号： G01N23/00

CPC分类号： G01N23/203 ,  G01N2223/652

摘要： A substrate surface inspection method inspects for a defect on a substrate including a plurality of materials on a surface thereof. The inspection method comprises: irradiating the surface of the substrate with an electron beam, a landing energy of the electron beam set such that a contrast between at least two types of materials of the plurality of materials is within a predetermined range; detecting electrons generated by the substrate to acquire a surface image of the substrate, with a pattern formed thereon from the at least two types of materials eliminated or weakened; and detecting the defect from the acquired surface image by detecting as the defect an object image having a contrast by which the object image can be distinguished from a background image in the surface image. Defects present on the substrate surface can be detected easily and precisely by using a cell inspection.

摘要翻译： 基板表面检查方法检查在其表面上包括多种材料的基板上的缺陷。 检查方法包括：用电子束照射基板的表面，电子束的着陆能量设定为使得多种材料中的至少两种类型的材料之间的对比度在预定范围内; 检测由所述基板产生的电子以获得所述基板的表面图像，其中从所述至少两种类型的材料形成在其上的图案被消除或削弱; 并且通过将所述对象图像与所述表面图像中的背景图像区分开来的对比度检测作为缺陷来检测来自所获取的表面图像的缺陷。 通过使用细胞检查，可以容易且准确地检测出存在于基板表面上的缺陷。

公开(公告)号：US20120076322A1

公开(公告)日：2012-03-29

申请号：US13311260

申请日：2011-12-05

申请人： Norio Kimura ,  Shigeo Masai ,  Yasuhiro Nakanosai

发明人： Norio Kimura ,  Shigeo Masai ,  Yasuhiro Nakanosai

IPC分类号： H04B15/00

CPC分类号： H04R19/016 ,  H01L2224/48137 ,  H04R19/005 ,  H04R2410/03

摘要： There is provided a microphone that can suppress vibration noise stemming from mechanical vibrations and that outputs a collective signal having superior quality.There is provided a microphone comprising a first capacitance section M1 having a first movable electrode 101 and a second electrode 102 disposed opposite the first electrode 101 and a second capacitance section M2 that has a first movable electrode 111 and a second electrode 112 disposed opposite the first electrode 111; a first amplifier 201 that amplifies a signal from the first electrode 101 of the first capacitance section M1 and a signal from the second electrode 112 of the second capacitance section M2; and a second amplifier 202 that amplifies a signal from the second electrode 102 of the first capacitance section M1 and a signal from the first electrode 111 of the second capacitance section M2.

摘要翻译： 提供了可以抑制由机械振动引起的振动噪声并且输出具有优良品质的集体信号的麦克风。 提供了一种麦克风，包括具有第一可移动电极101和与第一电极101相对设置的第二电极102的第一电容部分M1和具有与第一电极101相对设置的第一可移动电极111和第二电极112的第二电容部分M2 电极111; 第一放大器201，放大来自第一电容部M1的第一电极101的信号和来自第二电容部M2的第二电极112的信号; 以及放大来自第一电容部分M1的第二电极102的信号和来自第二电容部分M2的第一电极111的信号的第二放大器202。

公开(公告)号：US20110304092A1

公开(公告)日：2011-12-15

申请号：US13067381

申请日：2011-05-27

申请人： Mamoru Kambayashi ,  Motoya Sano ,  Hideki Tobinaga ,  Shinya Kitaoka ,  Atsushi Kanaya ,  Norio Kimura ,  Michitaka Suzuki ,  Yoshito Suzuki

发明人： Mamoru Kambayashi ,  Motoya Sano ,  Hideki Tobinaga ,  Shinya Kitaoka ,  Atsushi Kanaya ,  Norio Kimura ,  Michitaka Suzuki ,  Yoshito Suzuki

IPC分类号： B65H7/02 ,  B65H7/20

CPC分类号： B65H3/0684 ,  B65H3/5261 ,  B65H5/025 ,  B65H2402/31 ,  B65H2404/2693 ,  B65H2511/20 ,  B65H2515/34 ,  B65H2220/02 ,  B65H2220/11

摘要： An automatic document feeder includes a separating and feeding unit which has a separating member and a paper feeding member coming into contact with the separating member at a predetermined separating pressure, and separates and feeds an original sheet by sheet from a bundle of originals placed on an original placing table; a conveying unit which conveys the original separated by the separating and feeding unit toward a scanning position; a separating pressure switching unit which applies and releases the separating pressure and which is controlled by a control unit to release the separating pressure after a leading edge of a preceding sheet of the original has passed through the separating and feeding unit and to apply the separating pressure before a sheet of original separated and fed next to the preceding sheet of original is fed from the bundle of original to the separating and feeding unit.

摘要翻译： 自动进稿器包括分离和进给单元，该分离和进给单元具有分离构件和供纸构件，其以预定的分离压力与分离构件接触，并且将原始的一张一张的纸张从放置在 原始放置表; 传送单元，其将由分离和进给单元分离的原稿传送到扫描位置; 分离压力切换单元，其施加并释放所述分离压力，并且由所述原件的前边缘的前缘通过所述分离和供给单元之后由控制单元控制以释放所述分离压力，并施加所述分离压力 在将原稿分离并供给的原稿的一张原稿从原稿束馈送到分离和进给单元之前。

公开(公告)号：US07387717B2

公开(公告)日：2008-06-17

申请号：US10631726

申请日：2003-08-01

申请人： Junji Kunisawa ,  Mitsuko Odagaki ,  Natsuki Makino ,  Koji Mishima ,  Kenji Nakamura ,  Hiroaki Inoue ,  Norio Kimura ,  Tetsuo Matsuda ,  Hisashi Kaneko ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Manabu Tsujimura ,  Toshiyuki Morita

发明人： Junji Kunisawa ,  Mitsuko Odagaki ,  Natsuki Makino ,  Koji Mishima ,  Kenji Nakamura ,  Hiroaki Inoue ,  Norio Kimura ,  Tetsuo Matsuda ,  Hisashi Kaneko ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Manabu Tsujimura ,  Toshiyuki Morita

IPC分类号： C25D7/12

CPC分类号： H01L21/6719 ,  C25D7/123 ,  C25D17/001 ,  C25D17/12 ,  C25D17/14 ,  H01L21/2885 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/6723 ,  H01L21/76877 ,  H01L21/76879 ,  H01L2924/0002 ,  H05K3/423 ,  H01L2924/00

摘要： A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36. An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.

摘要翻译： 用于衬底的电镀方法和装置将诸如铜的金属填充到形成在半导体衬底中的精细互连图案中。 该装置具有基板保持部分36，其水平地保持并旋转基板，其表面被面向上。 密封材料90接触表面的周缘部分，以水密的方式密封该部分。 阴极电极88在与基板接触时通过电流。 阴极部38与基板保持部36一体地旋转。电极臂部30在阴极部38的上方，水平且垂直地移动，阳极98面朝下。 将电镀液注入被镀表面与接近待镀表面的阳极98之间的空间中。 因此，电镀处理和附带的处理可以通过单个单元进行。

公开(公告)号：US20070272645A1

公开(公告)日：2007-11-29

申请号：US11572526

申请日：2005-07-28

申请人： Kazumasa Ito ,  Mitsuo Tashiro ,  Norio Kimura ,  Nobuyasu Endo

发明人： Kazumasa Ito ,  Mitsuo Tashiro ,  Norio Kimura ,  Nobuyasu Endo

IPC分类号： A61J11/00

CPC分类号： A61J11/02 ,  A61J11/0015 ,  A61J11/005 ,  A61J11/006 ,  A61J11/0065 ,  A61J11/04 ,  A61J11/045

摘要： An artificial nipple can include a nipple body portion connected to a mounting structure that is configured for mounting the nipple on an infant feeding bottle 11. A mammary papilla leading end portion 140 can be disposed at the leading end portion of a mammary papilla portion 130 and have a leading end opening portion 141. The wall from the nipple body portion to the mammary papilla leading end portion is made of a soft material. The inner layer on the inner side of the wall is formed of a shape holding layer made of a material having a rigidity capable of holding the wall shape. The outer layer on the surface side of the wall is formed of a tongue abutting layer having a smooth face for allowing a peristalsis motion by a tongue. Between the shape holding layer and the tongue abutting layer there is disposed a deformation absorbing layer which is made of a material having a lower rigidity than that of the material of the shape holding layer and the tongue abutting layer. The deformation absorbing layer can be made thicker than the shape holding layer and the tongue abutting layer.

摘要翻译： 人造乳头可以包括连接到安装结构的乳头主体部分，其被配置为将乳头安装在婴儿喂养瓶11上。 乳房乳头前端部140可以设置在乳头乳头部130的前端部，并且具有前端开口部141。 从乳头主体部分到乳房乳头前端部的壁由软质材料制成。 壁内侧的内层由具有能够保持壁形状的刚性的材料形成的形状保持层形成。 壁的表面侧的外层由具有平滑面的舌接触层形成，用于允许舌头的蠕动运动。 在形状保持层和舌片抵接层之间设置变形吸收层，该变形吸收层由具有比形状保持层和舌接触层的材料刚性低的材料制成。 变形吸收层可以形成为比形状保持层和舌片抵接层更厚。

公开(公告)号：US07279408B2

公开(公告)日：2007-10-09

申请号：US11254790

申请日：2005-10-21

申请人： Hiroaki Inoue ,  Norio Kimura ,  Xinming Wang ,  Moriji Matsumoto ,  Makoto Kanayama

发明人： Hiroaki Inoue ,  Norio Kimura ,  Xinming Wang ,  Moriji Matsumoto ,  Makoto Kanayama

IPC分类号： H01L21/44

CPC分类号： H01L21/76843 ,  C23C18/1608 ,  C23C18/1632 ,  C23C18/1653 ,  C23C18/32 ,  C23C18/48 ,  C23C18/50 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/7684 ,  H01L21/76849 ,  H01L21/76864 ,  H01L21/76874 ,  H01L21/76877 ,  H01L21/76883 ,  H01L23/53238 ,  H01L23/53252 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to a semiconductor device and a method for manufacturing the same. The semiconductor device has an embedded interconnect structure in which an electric conductor, such as copper or silver, is embedded in fine recesses formed in a surface of a semiconductor substrate, and also has a protective film formed on surfaces of exposed interconnects that define the interconnect structure, to protect the interconnects. The protective film has a flattened surface.

摘要翻译： 半导体器件及其制造方法技术领域本发明涉及半导体器件及其制造方法。 半导体器件具有嵌入式互连结构，其中诸如铜或银的电导体嵌入形成在半导体衬底的表面中的细小凹槽中，并且还具有形成在暴露的互连件的表面上的保护膜，所述互连限定了互连 结构，保护互连。 保护膜具有平坦的表面。

公开(公告)号：US07208074B2

公开(公告)日：2007-04-24

申请号：US10742390

申请日：2003-12-22

申请人： Koji Mishima ,  Junji Kunisawa ,  Natsuki Makino ,  Norio Kimura ,  Hiroaki Inoue ,  Kenji Nakamura ,  Moriji Matsumoto ,  Takahiro Nanjo ,  Mitsuko Odagaki

发明人： Koji Mishima ,  Junji Kunisawa ,  Natsuki Makino ,  Norio Kimura ,  Hiroaki Inoue ,  Kenji Nakamura ,  Moriji Matsumoto ,  Takahiro Nanjo ,  Mitsuko Odagaki

IPC分类号： C25C28/00 ,  C25D5/10

CPC分类号： H01L21/67109 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67778 ,  H01L21/681

摘要： A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded and unloaded, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.

摘要翻译： 基板处理装置以限定在半导体基板中的精细互连图案或沟槽中填充诸如铜等的金属。 基板处理装置具有用于放置基板盒以装载和卸载基板的装载/卸载单元，用于处理基板的基板处理单元，以及用于在装载/卸载单元和卸载单元之间传送基板的传送机器人 底物处理单元。 装载/卸载单元，基板处理单元和传送机器人安装在单个设施中。 装载/卸载单元具有可水平旋转的旋转台​​，用于将基板盒定位在检测装载/卸载单元中的基板盒的位置，并用传送机器人从基板盒移除基板。

公开(公告)号：US07055535B2

公开(公告)日：2006-06-06

申请号：US10629678

申请日：2003-07-30

申请人： Junji Kunisawa ,  Norio Kimura ,  Kenya Ito ,  Akira Fukunaga ,  Yuuki Inoue ,  Hiroshi Tomita ,  Soichi Nadahara ,  Motoyuki Sato

发明人： Junji Kunisawa ,  Norio Kimura ,  Kenya Ito ,  Akira Fukunaga ,  Yuuki Inoue ,  Hiroshi Tomita ,  Soichi Nadahara ,  Motoyuki Sato

IPC分类号： B08B3/08 ,  B25B11/00 ,  H01L21/306

CPC分类号： H01L21/6838 ,  Y10S134/902 ,  Y10T279/11

摘要： A holding unit holds a substrate to enable a surface of the substrate to be processed. The unit has a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a bevel portion and/or a back surface of the wafer to be processed.

摘要翻译： 保持单元保持基板以使得能够处理基板的表面。 该单元具有与基板的表面的周边部分接触并吸附基板的真空吸附构件。 处理装置稳定地保持晶片，并且允许晶片的边缘，斜面部分和/或背面被处理。

公开(公告)号：US06969305B2

公开(公告)日：2005-11-29

申请号：US10357473

申请日：2003-02-04

申请人： Norio Kimura ,  Tadakazu Sone ,  Tomohiko Akatsuka ,  Tatsuya Sasaki

发明人： Norio Kimura ,  Tadakazu Sone ,  Tomohiko Akatsuka ,  Tatsuya Sasaki

IPC分类号： B24B49/16 ,  B24B53/007 ,  B24B53/017 ,  B24B1/00

CPC分类号： B24B53/017 ,  B24B49/16

摘要： A polishing apparatus for polishing a substrate comprises a turntable having a polishing surface, a substrate holder for holding a substrate and bringing the substrate into contact under pressure with the polishing surface, a dresser including a dresser tool adapted to be brought into contact under a pressure with the polishing surface to dress or condition the polishing surface and a pressure device connected to the dresser for moving the dresser between a raised position where the dresser is spaced away from the polishing surface and a dressing position where the dresser rests on the polishing surface such that the dresser tool is in contact with the polishing surface under a pressure exerted by the weight of the dresser itself, the dresser comprising a follow-up mechanism allowing each one of dressing element to move up and down relative to a flange portion so as to follow a contour of the polishing surface of the turntable.

摘要翻译： 用于抛光衬底的抛光装置包括具有抛光表面的转盘，用于保持衬底并使衬底在压力下与抛光表面接触的衬底保持器，包括修整器工具的修整器，其适于在压力下接触 抛光表面用于打磨或调理抛光表面，以及连接到修整器的压力装置，用于在修整器与抛光表面间隔开的升高位置和修整器搁置在抛光表面上的修整位置之间移动修整器， 修整器工具在由修整器本身的重量施加的压力下与抛光表面接触，该修整器包括随动装置，其允许每个修整元件相对于凸缘部分上下移动，以便 遵循转盘抛光表面的轮廓。

公开(公告)号：USRE38854E1

公开(公告)日：2005-10-25

申请号：US10142980

申请日：2002-05-13

申请人： Masamichi Nakashiba ,  Norio Kimura ,  Isamu Watanabe ,  Kaori Yoshida

发明人： Masamichi Nakashiba ,  Norio Kimura ,  Isamu Watanabe ,  Kaori Yoshida

IPC分类号： B24B5/00 ,  B24B37/04 ,  B24B49/16

CPC分类号： B24B37/042 ,  B24B37/30 ,  B24B49/16

摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.