公开(公告)号：US07183494B2

公开(公告)日：2007-02-27

申请号：US10829060

申请日：2004-04-20

Applicant: Su-Tsai Lu ,  Shu-Ming Chang ,  Shyh-Ming Chang ,  Yao-Sheng Lin ,  Yuan-Chang Huang

Inventor： Su-Tsai Lu ,  Shu-Ming Chang ,  Shyh-Ming Chang ,  Yao-Sheng Lin ,  Yuan-Chang Huang

IPC: H05K1/02

CPC classification number: B32B15/08 ,  B32B7/12 ,  B32B9/005 ,  B32B15/20 ,  B32B27/281 ,  B32B27/283 ,  B32B2457/08 ,  B32B2457/14 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/8123 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3011 ,  Y10T428/24917 ,  Y10T428/31667 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the metal pads, a buffer layer coated on the protection layer and the metal pads, a first metal layer covered on the buffer layer, and a second substrate with electrodes and a bonding layer thereon. The first metal layer, the electrodes and the bonding layer are bonded to form the bonding structure. Direct bonding can be performed through surface activation or heat pressure. The method uses fewer steps and is more reliable. The temperature required for bonding the structure is lower. The bonding density between the contacted surfaces is increased to a fine pitch. The quality at the bonding points is increased because fewer contaminations between the contacted surfaces are generated.

Abstract translation: 提供具有缓冲层的接合结构及其形成方法。 接合结构包括其上具有金属焊盘的第一衬底，覆盖在衬底表面上的保护层，形成在金属焊盘上的第一粘合金属层，涂覆在保护层上的缓冲层和金属焊盘，第一金属 覆盖在缓冲层上的第二基板和其上具有电极和接合层的第二基板。 第一金属层，电极和接合层被接合以形成接合结构。 可以通过表面活化或热压直接粘合。 该方法使用较少的步骤并且更可靠。 粘结结构所需的温度较低。 接触表面之间的结合密度增加到细间距。 增加接合点的质量，因为产生了接触表面之间的较少的污染物。

公开(公告)号：US20050250303A1

公开(公告)日：2005-11-10

申请号：US11183590

申请日：2005-07-18

Applicant: Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

Inventor： Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

IPC: H01L21/56 ,  H05K1/02 ,  H05K3/30 ,  H01L21/50

CPC classification number: H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/305 ,  H01L2224/13111 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An IC chip/substrate assembly bonded together by a non-conductive adhesive and a method for forming the assembly. The assembly consists of an IC chip that has bumps formed on an active surface, a substrate that has bond pads formed on a top surface, wherein at least one of the IC chip and the substrate has dummy bumps formed in-between the bumps or the bond pads, and a non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads.

Abstract translation: 通过非导电粘合剂粘合在一起的IC芯片/基板组件和用于形成组件的方法。 该组件由在有源表面上形成的凸块的IC芯片，具有形成在顶面上的接合焊盘的基板构成，其中IC芯片和基板中的至少一个具有形成在凸块之间或 接合焊盘和设置在IC芯片和基板之间的非导电粘合剂，其与与焊盘电连通的凸块面对面地连接在一起。

公开(公告)号：US06605491B1

公开(公告)日：2003-08-12

申请号：US10152468

申请日：2002-05-21

Applicant: Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

Inventor： Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

IPC: H01L2144

CPC classification number: H01L24/29 ,  H01L21/563 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13111 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/0665 ,  H01L2924/00

Abstract: A method for bonding an IC chip by a non-conductive adhesive that contains between about 5 weight % and about 25 weight % of a non-conductive filler is described. The filler particles in the filler material must have a hardness that is higher, and preferably at least two times higher, than the metal material forming the bump. Moreover, the filler particles must be non-electrically conductive such that electrical shorts between a plurality of bumps on the IC chip do not occur. The concentration of the filler in the adhesive must be high enough so as to reduce the CTE of the adhesive to match that of the IC chip and the substrate, and low enough so as not to impede the electrical communication between the bumps on the IC chip and the bond pads on the substrate.

Abstract translation: 描述了通过非导电粘合剂粘合IC芯片的方法，其包含约5重量％至约25重量％的非导电填料。 填充材料中的填料颗粒必须具有比形成凸块的金属材料高的硬度，优选至少两倍的硬度。 此外，填料颗粒必须是非导电的，使得不会发生IC芯片上的多个凸点之间的电短路。 填料在粘合剂中的浓度必须足够高，以便减少粘合剂的CTE与IC芯片和基材的CTE相匹配，并且足够低，以免阻碍IC芯片上的凸块之间的电连通 和衬底上的接合焊盘。

公开(公告)号：US06249051B1

公开(公告)日：2001-06-19

申请号：US08428775

申请日：1995-04-24

Applicant: Shyh-Ming Chang ,  Chih-Chiang Chu ,  Yu-Chi Lee

Inventor： Shyh-Ming Chang ,  Chih-Chiang Chu ,  Yu-Chi Lee

IPC: H01L2352

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3431 ,  H05K3/3436 ,  H05K2201/0212 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A bonded structure comprising the physical and electrical connections between an integrated circuit element and substrate using a composite bump comprised of a single polymer body of low Young's Modulus, a conductive barrier metal coating covering the polymer body and a soldering metal coating covering the conductive barrier metal coating. When the bonded structure is formed the composite bump is deformed and the low Young's Modulus of the polymer body allows a very reliable bonded structure with very low bonding force. Due to the low Young's Modulus there is little stress tending to break the solder joint after the bonded structure is formed. The bond is formed using a soldering process so that the soldering metal forms a conductive adhesive between the composite bumps and either the substrate input/output pads or the integrated circuit element input/output pads.

Abstract translation: 一种结合结构，其包括使用由低杨氏模量的单一聚合物主体组成的复合凸块的集成电路元件和基板之间的物理和电连接，覆盖聚合物主体的导电阻挡金属涂层和覆盖导电阻挡金属的焊接金属涂层 涂层。 当形成接合结构时，复合凸块变形，并且聚合物主体的低杨氏模量允许具有非常低的结合力的非常可靠的结合结构。 由于低的杨氏模量，在结合结构形成之后，很少有应力打破焊点。 使用焊接工艺形成接合，使得焊接金属在复合凸块与衬底输入/输出焊盘或集成电路元件输入/输出焊盘之间形成导电粘合剂。

公开(公告)号：US5749997A

公开(公告)日：1998-05-12

申请号：US578929

申请日：1995-12-27

Applicant: Pao-Yun Tang ,  Shyh-Ming Chang ,  Yu-Chi Lee ,  Su-Yu Fang

Inventor： Pao-Yun Tang ,  Shyh-Ming Chang ,  Yu-Chi Lee ,  Su-Yu Fang

IPC: C09J9/02 ,  H01L21/60 ,  H01L21/68 ,  H05K3/30 ,  H01L23/485 ,  H01R4/04

CPC classification number: H01L21/568 ,  C09J9/02 ,  H01L21/6835 ,  H01L24/12 ,  H01L24/29 ,  H01L24/83 ,  H01L24/86 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  Y10T29/49121 ,  Y10T29/49128

Abstract: This invention provides a bonded structure and a method of forming the bonded structure for joining a lead array to the conducting bonding pads of an integrated circuit element. The invention uses an anisotropic conductive film with tape automated bonding to form the bonded structure. The invention also uses integrated circuit elements having composite bumps as input/output pads. The composite bumps comprise a polymer body covered by a conductive metal coating. The invention provides a low cost method of tape automated bonding which uses lower temperature and pressure in the bonding process and provides a bond which is automatically encapsulated after the bonding has been completed. The lower temperature and pressure improve the dimensional stability of the elements of the bonded structure and the automatic encapsulation provides improved reliability.

Abstract translation: 本发明提供一种接合结构和形成用于将引线阵列接合到集成电路元件的导电接合焊盘的接合结构的方法。 本发明使用具有带自动键合的各向异性导电膜来形成结合结构。 本发明还使用具有复合凸块的集成电路元件作为输入/输出焊盘。 复合凸块包括被导电金属涂层覆盖的聚合物体。 本发明提供了一种低成本的带式自动接合方法，其在接合过程中使用较低的温度和压力，并且提供了在接合完成之后自动封装的接合。 较低的温度和压力提高了粘结结构元件的尺寸稳定性，自动封装提高了可靠性。