摘要:
A thin film multi-layer wiring substrate comprising a plurality of wiring layers, each adjacent pair of wiring layers being separated by an insulating layer, wherein at least one of the wiring layers includes wiring formed by an inner conductor member and a conductor layer surrounding the periphery thereof through an insulating material.
摘要:
An optical deflector including an optical waveguide of a dielectric material having electrooptical effect; and a pair of electrodes opposed to each other across the optical waveguide. An electric field is applied between the opposed electrodes to change a refractive index of the dielectric material to thereby control a propagating direction of signal light propagating in the optical waveguide, wherein the dielectric material has a first refractive index in its initial state, has a second refractive index by application of an electric field of a first polarity, and retains as a third refractive index a refractive index obtained after the electric field has been removed. The dielectric material having the third refractive index has the first refractive index by the application of an electric field of a second polarity different from the first polarity and removal of the electric field.
摘要:
An optical waveguide structure capable of optically coupling a surface type optical device, such as a surface emitting laser diode or a photodiode, and a transmission medium, such as an optical fiber, located so that their light output surface and light input surface will form an angle of about 90° with each other simply and easily. The optical waveguide structure comprises a first clad section having a curved surface for gradually turning the direction in which light travels almost squarely and a groove formed in the curved surface along the direction in which light travels, a core section which is made from a transparent material with a refractive index higher than the refractive index of the first clad section and with which the groove is filled in, and a second clad section which covers an exposed surface of the core section and the curved surface of the first clad section and which is integrated with the first clad section.
摘要:
A multilayer printed wiring board includes a core member having a plurality of glass clothes impregnated with a resin. Each of the glass clothes is woven with glass yarns each of which includes a bundle of glass filaments. One or more buildup layers are laminated on one or each surface of the core member. The core member has an elastic modulus which is no less than 100 times that of the buildup layer at 240° C.
摘要:
An electrode connecting method of connecting a first electrode and a second electrode is disclosed. The respective bonding surfaces of the first and second electrodes are activated. Then, each of the first and second electrodes having the activated surfaces is coated with a coating member for maintaining an activated state. A solid state bond between the first electrode and the second electrode is formed by pressure welding the first electrode and the second electrode so that the first and second electrodes break through the coating members.
摘要:
A thermal analysis in heating a print-circuit board in a reflowing furnace is simulated by a processor using data required for the design and thermal analysis of the printed-circuit board that carries solder-bonded components. The result of simulation indicates the possibility of existence of unmelted solder bonds heated at peak temperature below a predetermined lower limit and solder bonds heated at temperature above a predetermined upper limit. On the basis of the result, the components that are likely to be heated at inapplicable temperature are redesigned so that they can actually be heated at temperature in the predetermined range. The modification of design is displayed.
摘要:
First and second ball forming plates are prepared. The cavities of the first plate and the cavities of the second plate 20 are filled with solder paste, respectively. The first plate and the second plate are placed in a facing relationship to each other and heated to form metal balls each of which corresponds to the total metal components of the solder paste in one cavity of the first plate and one cavity in the second plate. The metal balls are formed in the cavities of the lower plate 10. The metal balls are transferred from the cavities of the first plate to a device on which bumps are to be formed.
摘要:
This invention relates to an insulating material for a wiring substrate and to a method of producing a multi-layered wiring substrate, and is directed to put into practical application a multi-layered wiring substrate suitable for processing high speed signals. The production method of the multi-layered wiring substrate of this invention uses an insulating material prepared by allowing voids of a porous perfluorocarbon polymer film to be impregnated with a thermosetting resin containing a benzocyclobutene ring, and thermally setting the resin, and comprises laminating alternately a wiring layer and an insulating layer made of the insulating material for the wiring substrate on a rigid support substrate.
摘要:
A method of and apparatus for forming a volume type phase hologram comprising the steps of, after exposure of a holographic material comprising a polymeric matrix having a radiation active substance associated therewith to an interference pattern of radiation, dipping the pattern-wise exposed holographic material in a swelling solution consisting of a first solvent which can act as a good solvent for the polymer of the matrix and a second solvent which can act as a poor solvent for the polymer and has a higher boiling point than that of the first solvent, and then pulling the swollen holographic material up from the swelling solution, whereby uniformly developed holograms having a large size and high qualities can be easily produced by a simple production process.
摘要:
A method of and apparatus for forming a volume type phase hologram comprising the steps of, after exposure of a holographic material comprising a polymeric matrix having a radiation active substance associated therewith to an interference pattern of radiation, dipping the pattern-wise exposed holographic material in a swelling solution consisting of a first solvent which can act as a good solvent for the polymer of the matrix and a second solvent which can act as a poor solvent for the polymer and has a higher boiling point than that of the first solvent, and then pulling the swollen holographic material up from the swelling solution, whereby uniformly developed holograms having a large size and high qualities can be easily produced by a simple production process.