公开(公告)号：US5386430A

公开(公告)日：1995-01-31

申请号：US92498

申请日：1993-07-16

申请人： Yasuo Yamagishi ,  Kanae Shimizu ,  Daisuke Mizutani ,  Tamotsu Owada ,  Yoshikatsu Ishizuki ,  Hideya Hashii

发明人： Yasuo Yamagishi ,  Kanae Shimizu ,  Daisuke Mizutani ,  Tamotsu Owada ,  Yoshikatsu Ishizuki ,  Hideya Hashii

IPC分类号： B23K26/00 ,  B23K26/03 ,  B23K26/06 ,  B23K26/38 ,  B23K26/40 ,  B23K101/42 ,  H01L21/768 ,  H01L23/522 ,  H05K1/02 ,  H05K3/00 ,  H01S3/22 ,  B05D3/06 ,  B29C37/00 ,  B23K

CPC分类号： B23K26/032 ,  B23K26/123 ,  B23K26/402 ,  H05K3/0035 ,  B23K2203/42 ,  H05K1/0269 ,  H05K2203/0207 ,  H05K2203/056 ,  H05K2203/163

摘要： An excimer laser ablation processing for forming via holes in a resin film by irradiation of an excimer laser wherein, the emission of light caused during the decomposition of the resin during the processing is detected, its intensity is measured, and the endpoint of the processing is judged or a comparison is made of the positions of light emission and the design positions for processing to examine for the presence of defects. Provision is made of a means for measuring the intensity and a means for judging the endpoint of the processing from the changes in the intensity of light emission during the processing.

摘要翻译： 一种准分子激光烧蚀处理，用于通过照射准分子激光器在树脂膜中形成通孔，其中检测在处理期间树脂分解期间引起的光的发射，测量其强度，并且处理的终点为 判断或比较发光的位置和处理的设计位置以检查是否存在缺陷。 提供了用于测量强度的装置和用于根据处理期间的发光强度的变化来判断处理的端点的装置。

公开(公告)号：US5349155A

公开(公告)日：1994-09-20

申请号：US5105

申请日：1993-01-15

申请人： Yasuo Yamagishi ,  Tamotsu Owada

发明人： Yasuo Yamagishi ,  Tamotsu Owada

IPC分类号： B23K26/06 ,  B23K26/38 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  B23K26/00

CPC分类号： B23K26/0624 ,  B23K26/066 ,  B23K26/382 ,  B23K26/386 ,  B23K26/40 ,  B23K26/402 ,  H01L21/4857 ,  H01L23/49822 ,  H05K1/0353 ,  B23K2201/42 ,  B23K2203/16 ,  B23K2203/42 ,  B23K2203/50 ,  B23K2203/52 ,  H01L2924/0002 ,  H01L2924/09701

摘要： This invention relates to an insulating material for a wiring substrate and to a method of producing a multi-layered wiring substrate, and is directed to put into practical application a multi-layered wiring substrate suitable for processing high speed signals. The production method of the multi-layered wiring substrate of this invention uses an insulating material prepared by allowing voids of a porous perfluorocarbon polymer film to be impregnated with a thermosetting resin containing a benzocyclobutene ring, and thermally setting the resin, and comprises laminating alternately a wiring layer and an insulating layer made of the insulating material for the wiring substrate on a rigid support substrate.

摘要翻译： 本发明涉及一种用于布线基板的绝缘材料和一种多层布线基板的制造方法，并且涉及实际应用中适用于处理高速信号的多层布线基板。 本发明的多层布线基板的制造方法使用通过使多孔全氟碳聚合物膜的空隙浸渍在含有苯并环丁烯环的热固性树脂中并将树脂热固化而制备的绝缘材料，并且包括交替层压 布线层和由刚性支撑基板上的用于布线基板的绝缘材料制成的绝缘层。

公开(公告)号：US07211899B2

公开(公告)日：2007-05-01

申请号：US10336728

申请日：2003-01-06

申请人： Osamu Taniguchi ,  Yasuo Yamagishi ,  Koji Omote

发明人： Osamu Taniguchi ,  Yasuo Yamagishi ,  Koji Omote

IPC分类号： H01L23/48

CPC分类号： H01L23/49827 ,  H01L23/15 ,  H01L23/481 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/0044 ,  H05K3/4605 ,  H05K2201/09827 ,  H05K2203/025

摘要： A circuit substrate comprises a glass substrate 16, through-holes 18 formed through the glass substrate 16 and via electrodes 20 buried in the through-holes 18. An opening width of the through-holes 18 is minimum inside the glass substrate and is increased toward both surfaces of the glass substrate 16. Accordingly, the detachment of the via electrodes 20 can be prevented without increasing the surface roughness of the inside walls of the through holes, and stresses generated in the core substrate can be mitigated.

摘要翻译： 电路基板包括玻璃基板16，通过玻璃基板16形成的通孔18和埋在通孔18中的通孔电极20。 通孔18的开口宽度在玻璃基板的内部是最小的，并且朝向玻璃基板16的两个表面增加。 因此，可以防止通孔电极20的分离，而不会增加通孔内壁的表面粗糙度，并且可以减轻芯基板中产生的应力。

公开(公告)号：US06768205B2

公开(公告)日：2004-07-27

申请号：US10084923

申请日：2002-03-01

申请人： Osamu Taniguchi ,  Tomoko Miyashita ,  Yasuo Yamagishi ,  Koji Omote ,  Yoshihiko Imanaka

发明人： Osamu Taniguchi ,  Tomoko Miyashita ,  Yasuo Yamagishi ,  Koji Omote ,  Yoshihiko Imanaka

IPC分类号： H01L2713

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49816 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13009 ,  H01L2224/16 ,  H01L2224/73257 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011

摘要： The objective of the present invention is to provide a reliable thin-film circuit substrate or via formed substrate that is provided with minute via plugs at a fine pitch. The objective is served by forming an insulation layer that functions as an etching stopper on a Si substrate, and then via holes are formed in the Si substrate, using a semiconductor process, until the etching stopper layer is exposed. Further, a thin-film circuit is formed on the insulation layer, and the insulation layer is removed at the via holes such that the thin-film circuit is exposed. As necessary, the thin film circuit is heat-treated, and then the via holes are filled with an electrically conductive material and vamp electrodes are formed.

摘要翻译： 本发明的目的是提供一种可靠的薄膜电路衬底或通孔形成的衬底，其以细间距设置有微通孔塞。 该目的通过在Si衬底上形成用作蚀刻阻挡层的绝缘层，然后使用半导体工艺在Si衬底中形成通孔，直到暴露出蚀刻阻挡层。 此外，在绝缘层上形成薄膜电路，并且在通孔处去除绝缘层，使薄膜电路露出。 根据需要，对薄膜电路进行热处理，然后用导电材料填充通孔，并形成鞋面电极。

公开(公告)号：US06580169B2

公开(公告)日：2003-06-17

申请号：US10191533

申请日：2002-07-10

申请人： Seiki Sakuyama ,  Yasuo Yamagishi ,  Masataka Mizukoshi

发明人： Seiki Sakuyama ,  Yasuo Yamagishi ,  Masataka Mizukoshi

IPC分类号： H01L2348

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1532 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0266 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0574 ,  H05K2203/0577 ,  H05K2203/0769

摘要： The present invention relates to a method for forming bumps on a substrate provided with electrode pads. The method includes providing a mask having openings corresponding to the electrode pads, filling each of the openings with a solder paste, and heat treating the solder paste, wherein the solder paste includes solder powder. Preferably, the solder powder contains no more than 10 wt % of particles whose diameter is greater than the thickness of the mask and no more than 1.5 times this thickness. Preferably, the solder powder contains no more than 10 wt % of particles whose diameter is not less than 40% the diameter of the opening portions, or no less than 30 wt % of particles whose diameter is 40 to 100% the thickness of the mask.

公开(公告)号：US06504966B2

公开(公告)日：2003-01-07

申请号：US10077342

申请日：2002-02-15

申请人： Masayuki Kato ,  Akio Sugama ,  Koji Tsukamoto ,  Masatoshi Ishii ,  Kishio Yokouchi ,  Yasuo Yamagishi ,  Motoyuki Nishizawa ,  Tsuyoshi Aoki

发明人： Masayuki Kato ,  Akio Sugama ,  Koji Tsukamoto ,  Masatoshi Ishii ,  Kishio Yokouchi ,  Yasuo Yamagishi ,  Motoyuki Nishizawa ,  Tsuyoshi Aoki

IPC分类号： G02B626

CPC分类号： G02F1/295 ,  G02B6/125 ,  G02B2006/12104 ,  G02B2006/12114 ,  G02B2006/12145 ,  G02F1/313

摘要： A prism pair is employed as an optical deflecting element. The prism pair is constructed by a slab waveguide, and first and second upper electrodes and first and second lower electrodes arranged on and under the slab waveguide. These electrodes are shaped into a wedge shape (e.g., triangular shape), and change the refractive index of a part of the slab waveguide by utilizing the electrooptic effect to change the propagation direction of light.

摘要翻译： 棱镜对被用作光学偏转元件。 棱镜对由平板波导构成，第一和第二上电极以及设置在平板波导上和下方的第一和第二下电极。 这些电极成形为楔形（例如，三角形），并且通过利用电光效应来改变平板波导的一部分的折射率以改变光的传播方向。

公开(公告)号：US06319810B1

公开(公告)日：2001-11-20

申请号：US08659356

申请日：1996-06-06

申请人： Masayuki Ochiai ,  Yasuo Yamagishi ,  Ichiro Yamaguchi ,  Masahiro Yoshikawa ,  Koki Otake ,  Masataka Mizukoshi ,  Yuuji Watanabe

发明人： Masayuki Ochiai ,  Yasuo Yamagishi ,  Ichiro Yamaguchi ,  Masahiro Yoshikawa ,  Koki Otake ,  Masataka Mizukoshi ,  Yuuji Watanabe

IPC分类号： H01L2144

CPC分类号： H01L24/12 ,  B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/48

摘要： Method for forming solder bumps on a first member such as a semiconductor chip having electrode pads formed thereon. A flat plate having holes is prepared and the holes are filled with solder paste by squeezing. The flat plate is then overlapped with the first member with the flat plate above the first plate. The flat plate and the first member are heated to a temperature higher than the melting point of the solder alloy in the solder paste. Therefore, solder bumps having identical sizes and uniform structures can be obtained.

摘要翻译： 在诸如其上形成有电极焊盘的半导体芯片的第一部件上形成焊料凸块的方法。 准备具有孔的平板，并通过挤压填充焊膏。 然后平板与第一构件重叠，平板在第一板上。 平板和第一构件被加热到高于焊膏中的焊料合金的熔点的温度。 因此，可以获得具有相同尺寸和均匀结构的焊料凸块。

公开(公告)号：US6140286A

公开(公告)日：2000-10-31

申请号：US865125

申请日：1997-05-30

申请人： Keiji Watanabe ,  Masayuki Ochiai ,  Yasuo Yamagishi ,  Ei Yano ,  Nobuo Igusa ,  Isamu Takachi

发明人： Keiji Watanabe ,  Masayuki Ochiai ,  Yasuo Yamagishi ,  Ei Yano ,  Nobuo Igusa ,  Isamu Takachi

IPC分类号： B08B3/08 ,  B23K1/00 ,  B23K1/20 ,  C11D7/24 ,  C11D7/26 ,  C11D7/32 ,  C11D7/50 ,  C11D7/60 ,  C11D11/00 ,  C23G5/02 ,  C23G5/024 ,  C23G5/032 ,  C23G5/04 ,  H05K3/26 ,  C11D9/04 ,  C03C23/00 ,  C23G1/02

CPC分类号： C11D7/262 ,  B23K1/203 ,  C11D11/0047 ,  C11D7/261 ,  C11D7/263 ,  C11D7/264 ,  C11D7/266 ,  C11D7/3227 ,  C11D7/5022 ,  C11D7/5027 ,  C23G5/024 ,  C23G5/032 ,  C23G5/04 ,  H05K3/26 ,  C11D7/24 ,  C11D7/265 ,  H05K2203/0257 ,  H05K2203/0783 ,  H05K2203/086 ,  H05K2203/1518

摘要： The defluxing agent for flux residue after soldering contains an acid (preferably an organic acid, and particularly an acid stronger than abietic acid; for example, acrylic acid, acetic acid, propionic acid, benzoic acid) and an organic solvent (for example, xylene, benzyl acetate, methyl .alpha.-hydroxyisobutyrate, cyclohexanone, methyl .beta.-methoxyisobutyrate), and if necessary it further contains a monohydric alcohol, a surfactant and a corrosion inhibitor. Rinsing is preferably performed after the cleaning, using a solvent which is miscible with the defluxing agent, in order to completely remove the acid. There is also disclosed a cleaning apparatus which may be generally used for this and other cleaning.

摘要翻译： 焊接后的助焊剂残渣的脱焊剂含有酸（优选为有机酸，特别是比松香酸强的酸），例如丙烯酸，乙酸，丙酸，苯甲酸）和有机溶剂（例如二甲苯 ，乙酸苄酯，α-羟基异丁酸甲酯，环己酮，β-甲氧基异丁酸甲酯），如果需要，它还含有一元醇，表面活性剂和缓蚀剂。 优选在使用与脱流剂混溶的溶剂进行清洗之后进行冲洗以完全除去酸。 还公开了一般可用于这种和其他清洁的清洁装置。

公开(公告)号：US06050479A

公开(公告)日：2000-04-18

申请号：US987134

申请日：1997-12-08

申请人： Keiji Watanabe ,  Masayuki Ochiai ,  Yasuo Yamagishi ,  Ei Yano ,  Nobuo Igusa ,  Isamu Takachi

发明人： Keiji Watanabe ,  Masayuki Ochiai ,  Yasuo Yamagishi ,  Ei Yano ,  Nobuo Igusa ,  Isamu Takachi

IPC分类号： B08B3/08 ,  B23K1/00 ,  B23K1/20 ,  C11D7/24 ,  C11D7/26 ,  C11D7/32 ,  C11D7/50 ,  C11D7/60 ,  C11D11/00 ,  C23G5/02 ,  C23G5/024 ,  C23G5/032 ,  C23G5/04 ,  H05K3/26 ,  B23K28/00 ,  B08B3/00 ,  C23G1/02

CPC分类号： C11D7/262 ,  B23K1/203 ,  C11D11/0047 ,  C11D7/261 ,  C11D7/263 ,  C11D7/264 ,  C11D7/266 ,  C11D7/3227 ,  C11D7/5022 ,  C11D7/5027 ,  C23G5/024 ,  C23G5/032 ,  C23G5/04 ,  H05K3/26 ,  C11D7/24 ,  C11D7/265 ,  H05K2203/0257 ,  H05K2203/0783 ,  H05K2203/086 ,  H05K2203/1518

摘要： The defluxing agent for flux residue after soldering contains an acid (preferably an organic acid, and particularly an acid stronger than abietic acid; for example, acrylic acid, acetic acid, propionic acid, benzoic acid) and an organic solvent (for example, xylene, benzyl acetate, methyl .alpha.-hydroxyisobutyrate, cyclohexanone, methyl .beta.-methoxyisobutyrate), and if necessary it further contains a monohydric alcohol, a surfactant and a corrosion inhibitor. Rinsing is preferably performed after the cleaning, using a solvent which is miscible with the defluxing agent, in order to completely remove the acid. There is also disclosed a cleaning apparatus which may be generally used for this and other cleaning.

摘要翻译： 焊接后的助焊剂残渣的脱焊剂含有酸（优选为有机酸，特别是比松香酸强的酸），例如丙烯酸，乙酸，丙酸，苯甲酸）和有机溶剂（例如二甲苯 ，乙酸苄酯，α-羟基异丁酸甲酯，环己酮，β-甲氧基异丁酸甲酯），如果需要，它还含有一元醇，表面活性剂和缓蚀剂。 优选在使用与脱流剂混溶的溶剂进行清洗之后进行冲洗以完全除去酸。 还公开了一般可用于这种和其他清洁的清洁装置。

公开(公告)号：US5633121A

公开(公告)日：1997-05-27

申请号：US662299

申请日：1996-06-12

申请人： Takahisa Namiki ,  Yasuo Yamagishi ,  Ei Yano

发明人： Takahisa Namiki ,  Yasuo Yamagishi ,  Ei Yano

IPC分类号： G01N21/88 ,  G01B11/06 ,  G01N21/956 ,  G01R31/28 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18 ,  H05K3/38 ,  G03F7/00

CPC分类号： G01B11/0633 ,  G01R31/2805 ,  H05K3/0079 ,  H05K3/385 ,  H05K2203/0315 ,  H05K2203/0392 ,  H05K2203/1157 ,  H05K2203/162

摘要： The surface of a copper layer in a circuit board is irradiated with a beam, and the degree of progress of oxidation of the surface of the copper layer is determined by taking advantage of the resultant reflected beam (for example, an intensity or a hue of a reflected beam). Then, the step of coating a resist is carried out only when the thickness of the copper oxide film is not more than about 10 nm. Alternatively, the step of coating a resist may be carried out after removal or reduction of the oxide film or cladding of the oxide film with copper.The present invention enables occurrence of peeling of the resist or dive of plating to be prevented in the step of effecting selective etching or plating of a copper layer in a circuit board using a resist pattern as a mask.

摘要翻译： 用光束照射电路板中的铜层的表面，并且通过利用所得到的反射光束（例如，强度或色调的强度或色调来确定铜层的表面的氧化进程的程度） 反射光束）。 然后，只有当氧化铜膜的厚度不大于约10nm时，才进行涂覆抗蚀剂的步骤。 或者，涂布抗蚀剂的步骤可以在用铜去除或还原氧化膜或氧化膜的包层之后进行。 在使用抗蚀剂图案作为掩模的电路板中进行铜层的选择性蚀刻或镀覆的步骤中，本发明能够防止抗蚀剂的剥离或电镀的潜在的发生。