公开(公告)号：US5047837A

公开(公告)日：1991-09-10

申请号：US388943

申请日：1989-08-03

申请人： Makoto Kitano ,  Takahiro Daikoku ,  Sueo Kawai ,  Ichio Shimizu ,  Kazuo Yamazaki ,  Asao Nishimura ,  Hideo Miura ,  Akihiro Yaguchi

发明人： Makoto Kitano ,  Takahiro Daikoku ,  Sueo Kawai ,  Ichio Shimizu ,  Kazuo Yamazaki ,  Asao Nishimura ,  Hideo Miura ,  Akihiro Yaguchi

IPC分类号： H01L23/34 ,  H01L23/367 ,  H01L23/495

CPC分类号： H01L23/49568 ,  H01L23/3672 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815

摘要： A packaged semiconductor device having heat transfer leads carrying a semiconductor chip directly or indirectly through a chip pad and extended to the exterior of the plastic or ceramics seal of the package, and a heat transfer cap held in surface contact with the extended heat transfer leads and covering upper side of the package. The heat generated in the semiconductor chip is transmitted to the upper side of the package and to the printed circuit board only through metallic parts so that the heat transfer is enhanced to remarkably reduce thermal resistance, thus enabling packaging of a semiconductor chip having a large heat generation rate.

摘要翻译： 一种封装的半导体器件，其具有直接或间接通过芯片焊盘并延伸到封装的塑料或陶瓷密封件的外部的半导体芯片的传热引线，以及与扩展的传热引线保持表面接触的传热盖， 覆盖包装的上侧。 在半导体芯片中产生的热量仅通过金属部件传输到封装的上侧和印刷电路板，从而增强了传热，显着降低了热阻，从而能够封装具有大的热量的半导体芯片 发电率。

公开(公告)号：US4942452A

公开(公告)日：1990-07-17

申请号：US158673

申请日：1988-02-22

申请人： Makoto Kitano ,  Sueo Kawai ,  Asao Nishimura ,  Hideo Miura ,  Akihiro Yaguchi ,  Chikako Kitabayashi ,  Ichio Shimizu ,  Toshio Hatsuda ,  Toshinori Ozaki ,  Toshio Hattori ,  Souji Sakata

发明人： Makoto Kitano ,  Sueo Kawai ,  Asao Nishimura ,  Hideo Miura ,  Akihiro Yaguchi ,  Chikako Kitabayashi ,  Ichio Shimizu ,  Toshio Hatsuda ,  Toshinori Ozaki ,  Toshio Hattori ,  Souji Sakata

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/12

CPC分类号： H01L24/32 ,  H01L23/49503 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/351

摘要： A lead frame and a semiconductor device wherein a through hole is formed in the center of a semiconductor chip-mounting surface of a chip pad at the center of the lead frame, the through hole being tapered or being one which corresponds to a surface area that is greater on the surface of the chip-mounting surface of the chip pad than on the surface of the side opposite to the chip-mounting surface thereof. This prevents the occurrence of cracks in the sealing plastic portion in the step of reflow soldering of the lead frame to the substrate.

公开(公告)号：US20120279495A1

公开(公告)日：2012-11-08

申请号：US13521630

申请日：2011-01-18

申请人： Makoto Kitano ,  Kenji Sato ,  Kentaro Nariai ,  Tatsuya Oka ,  Michikazu Hara ,  Daizo Yamaguchi

发明人： Makoto Kitano ,  Kenji Sato ,  Kentaro Nariai ,  Tatsuya Oka ,  Michikazu Hara ,  Daizo Yamaguchi

IPC分类号： C13K13/00 ,  B01J19/18

CPC分类号： B01F7/18 ,  B01F13/0255 ,  B01J27/053 ,  C13K1/02 ,  C13K13/002

摘要： A solid-acid-catalyzed saccharification device (A) includes a catalytic reaction vessel (3) configured to contain a polysaccharide feedstock with water and a solid-acid catalyst (X2) as a liquid mixture (X3) to monosaccharify the polysaccharide using the solid-acid catalyst (X2), an agitation device (4) configured to agitate the liquid mixture (X3) in the catalytic reaction vessel (3), an oxidation-reduction electrometer (5) configured to measure the redox potential of the liquid mixture (X3) in the catalytic reaction vessel (3), and a pH meter (6) configured to measure the pH of the liquid mixture (X3) in the catalytic reaction vessel (3). According to the solid-acid-catalyzed saccharification device (A), it is possible to accurately follow the reaction state of a saccharification process of a feedstock using a solid acid catalyst.

摘要翻译： 固体酸催化糖化装置（A）包括催化反应容器（3），其配置为含有多糖原料与水和固体酸催化剂（X2）作为液体混合物（X3），以使用固体单糖化多糖 - 酸催化剂（X2），用于搅拌催化反应容器（3）中的液体混合物（X3）的搅拌装置（4），配置成测量液体混合物的氧化还原电位的氧化还原静电计（5） X3）和pH计（6），其被配置成测量催化反应容器（3）中的液体混合物（X3）的pH值。 根据固体酸催化的糖化装置（A），可以使用固体酸催化剂精确地跟踪原料的糖化过程的反应状态。

公开(公告)号：US20120255900A1

公开(公告)日：2012-10-11

申请号：US13514480

申请日：2010-12-09

申请人： Noriyoshi Osawa ,  Makoto Kitano ,  Kenji Sato

发明人： Noriyoshi Osawa ,  Makoto Kitano ,  Kenji Sato

IPC分类号： B01D17/028 ,  B01D47/06

CPC分类号： B01D17/045 ,  C10G33/06

摘要： This oil-water separation device includes: a supply port (3b) for oily water; a flow passage that causes oily water (X4, X7) supplied from the supply port to flow so that a flow component in a horizontal direction is a main flow component; a floated oil recovery port (F) provided above an upper portion of the flow passage and also at a position spaced from a start end of the flow passage; and a settled oil recovery port (T) provided beneath the flow passage. According to the oil-water separation device, it is possible to separate an oil component from oily water that contains an oil component with higher viscosity.

摘要翻译： 该油水分离装置包括：用于油性水的供给口（3b） 使从所述供给口供给的油性水（X4，X7）流动的流路使得水平方向的流动成分为主流量成分; 浮动油回收口（F），设置在流路的上部的上方，并且在与流路的起始端隔开的位置; 以及设置在流路下方的沉降式油回收口（T）。 根据油水分离装置，可以将油成分与含有较高粘度的油性成分的油性水分离。

公开(公告)号：US06984459B1

公开(公告)日：2006-01-10

申请号：US09630407

申请日：2000-08-01

申请人： Takanobu Noguchi ,  Shuji Doi ,  Makoto Kitano

发明人： Takanobu Noguchi ,  Shuji Doi ,  Makoto Kitano

IPC分类号： H05B33/14 ,  C09K11/06 ,  C08G61/02

CPC分类号： H01L51/0038 ,  C09K11/06 ,  H01L51/0035 ,  H01L51/0039 ,  H01L51/0043 ,  H01L51/5012 ,  Y10S428/917

摘要： Provided is a polymeric fluorescent substance containing specific proportion of a repeating unit comprising 2 to 5 arylene groups or heterocyclic compound groups. The polymeric fluorescent substance has strong fluorescence, and can be suitably used as a polymer for high performance polymer LED and a dye for laser.

摘要翻译： 提供了含有特定比例的包含2至5个亚芳基或杂环化合物基团的重复单元的聚合物荧光物质。 聚合物荧光物质具有强烈的荧光，可适用于高性能聚合物LED和激光用染料的聚合物。

公开(公告)号：US20050170202A1

公开(公告)日：2005-08-04

申请号：US10518713

申请日：2003-06-25

申请人： Kohei Tamao ,  Shigehiro Yamaguchi ,  Makoto Kitano ,  Satoshi Kobayashi ,  Chizu Sekine

发明人： Kohei Tamao ,  Shigehiro Yamaguchi ,  Makoto Kitano ,  Satoshi Kobayashi ,  Chizu Sekine

IPC分类号： C08G61/12 ,  C09K11/06 ,  H01L51/30 ,  H01L51/50 ,  H05B33/14 ,  C08G79/08 ,  H01B1/12

CPC分类号： H01L51/0036 ,  C08G61/123 ,  C09K11/06 ,  C09K2211/1491 ,  H01L51/0035 ,  H01L51/0079 ,  H01L51/5012 ,  H05B33/14 ,  Y10S428/917 ,  Y10T428/10

摘要： A polymer characterized by comprising repeating units represented by the following formula (1) and having a number-average molecular weight, in terms of polystyrene, of 103 to 108. (In the formula, R1 represents hydrogen, alkyl, alkoxy, alkylthio, aryl, aryloxy, arylthio, arylalkyl, arylalkoxy, arylalkylthio, arylalkenyl, arylalkynyl, amino, substituted amino, silyl, substituted silyl, silyloxy, substituted silyloxy, monovalent heterocyclic group, or halogeno; and rings D and E each represents an optionally substituted aromatic ring.)

摘要翻译： 一种聚合物，其特征在于包括由下式（1）表示的重复单元，其聚苯乙烯换算的数均分子量为10 -3至10 8。 （式中，R 1表示氢，烷基，烷氧基，烷硫基，芳基，芳氧基，芳硫基，芳基烷基，芳基烷氧基，芳基烷硫基，芳基烯基，芳基炔基，氨基，取代的氨基，甲硅烷基，取代的甲硅烷基， 取代的甲硅烷氧基，一价杂环基或卤素;环D和E各自表示任选取代的芳环）

公开(公告)号：US20050157466A1

公开(公告)日：2005-07-21

申请号：US11079264

申请日：2005-03-15

申请人： Rintaro Minamitani ,  Makoto Kitano ,  Noriyuki Ashiwake ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Tsuyoshi Nakagawa

发明人： Rintaro Minamitani ,  Makoto Kitano ,  Noriyuki Ashiwake ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Tsuyoshi Nakagawa

IPC分类号： F28D15/02 ,  F01P11/06 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20 ,  H05K5/00

CPC分类号： G06F1/203 ,  F01P2011/066 ,  F28D15/0266 ,  G06F2200/201 ,  Y10S165/905

摘要： A liquid cooling system which is utilizable in a personal computer includes a pump for supplying a cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a passage for circulating the cooling liquid passing through the heat radiation pipe into the pump. The heat radiation pipe is made of material having a corrosion resistance that is higher than that of the heat receiving jacket.

公开(公告)号：US06841269B2

公开(公告)日：2005-01-11

申请号：US10326061

申请日：2002-12-23

申请人： Makoto Kitano ,  Takanobu Noguchi ,  Toshihiro Ohnishi ,  Fumi Yamaguchi ,  Takenori Osada

发明人： Makoto Kitano ,  Takanobu Noguchi ,  Toshihiro Ohnishi ,  Fumi Yamaguchi ,  Takenori Osada

IPC分类号： C08G77/26 ,  C08G77/54 ,  C09K11/06 ,  G03G5/07 ,  H01L51/30 ,  H01L51/50 ,  H05B33/14 ,  H05B33/12

CPC分类号： H05B33/14 ,  C08G77/26 ,  C08G77/54 ,  C09K11/06 ,  G03G5/078 ,  H01L51/0035 ,  H01L51/0038 ,  H01L51/0043 ,  H01L51/0059 ,  H01L51/0081 ,  H01L51/0094 ,  H01L51/5012 ,  H01L2251/308 ,  Y10S428/917 ,  Y10T428/31663

摘要： A hole transporting polymer having a specific Si-containing repeating unit represented by a formula (1) and specific molecular weight, an excellent hole transporting property, and superior durability and film-forming properties, and the organic EL device, using the bole transporting polymer having excellent light emitting characteristics are disclosed.

摘要翻译： 具有由式（1）表示的特定的含Si重复单元和特定分子量，优异的空穴传输性和优异的耐久性和成膜性的空穴传输聚合物和使用所述bole传输聚合物的有机EL器件 具有优异的发光特性。

公开(公告)号：US06791194B1

公开(公告)日：2004-09-14

申请号：US09493210

申请日：2000-01-28

申请人： Akira Nagai ,  Shuji Eguchi ,  Masahiko Ogino ,  Masanori Segawa ,  Toshiak Ishii ,  Nobutake Tsuyuno ,  Hiroyoshi Kokaku ,  Rie Hattori ,  Makoto Morishima ,  Ichiro Anjoh ,  Kunihiro Tsubosaki ,  Chuichi Miyazaki ,  Makoto Kitano ,  Mamoru Mita ,  Norio Okabe

发明人： Akira Nagai ,  Shuji Eguchi ,  Masahiko Ogino ,  Masanori Segawa ,  Toshiak Ishii ,  Nobutake Tsuyuno ,  Hiroyoshi Kokaku ,  Rie Hattori ,  Makoto Morishima ,  Ichiro Anjoh ,  Kunihiro Tsubosaki ,  Chuichi Miyazaki ,  Makoto Kitano ,  Mamoru Mita ,  Norio Okabe

IPC分类号： H01L2348

CPC分类号： H01L24/50 ,  H01L23/3107 ,  H01L23/4951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10329 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00

摘要： A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200-250° C.).

摘要翻译： 通过在半导体封装结构中设置用于吸收安装基板和半导体元件之间的热膨胀差的缓冲体，即使使用有机材料来安装基板，也可获得具有优异的连接可靠性的半导体器件。 使用薄膜材料作为用于缓冲由安装基板和半导体元件之间的热膨胀差异产生的热应力的本体。 膜材料在回流温度范围（200-250℃）中的弹性模量至少为1MPa。

公开(公告)号：US06696588B2

公开(公告)日：2004-02-24

申请号：US10062665

申请日：2002-02-05

申请人： Masato Ueda ,  Isao Yahagi ,  Makoto Kitano

发明人： Masato Ueda ,  Isao Yahagi ,  Makoto Kitano

IPC分类号： C07F708

CPC分类号： H05B33/12 ,  C07F7/1804 ,  C09K11/06 ,  H01L51/0042 ,  H01L51/0052 ,  H01L51/0054 ,  H01L51/0055 ,  H01L51/0059 ,  H01L51/006 ,  H01L51/0061 ,  H01L51/0065 ,  H01L51/0067 ,  H01L51/0068 ,  H01L51/0071 ,  H01L51/0072 ,  H01L51/0081 ,  H01L51/0094 ,  H01L51/5206 ,  H01L2251/308 ,  Y10T428/31663

摘要： The invention provides a novel silicon-containing compound having an oxidation potential of 0.3 to 1.5 V on the basis of a standard hydrogen electrode, wherein at least one alkoxy group is bonded to a silicon atom and at least one aromatic amine group is also bonded to the silicon atom. An organic electroluminescence device having excellent mechanical and electric contact between an electrode and an organic layer is also provided by treating the surface of an anode with using a surface-treating agent comprising the above silicon-containing compound.

摘要翻译： 本发明提供了一种基于标准氢电极具有0.3至1.5V的氧化电位的新型含硅化合物，其中至少一个烷氧基与硅原子键合，并且至少一个芳族胺基也与 硅原子。通过使用包含上述含硅化合物的表面处理剂处理阳极的表面，还提供了在电极和有机层之间具有优异的机械和电接触的有机电致发光器件。