Non-volatile semiconductor memory device and writing method thereof
    55.
    发明授权
    Non-volatile semiconductor memory device and writing method thereof 有权
    非挥发性半导体存储器件及其写入方法

    公开(公告)号:US07339827B2

    公开(公告)日:2008-03-04

    申请号:US11147243

    申请日:2005-06-08

    摘要: In connection with rise and fall of a word line bias, the present invention adopts a procedure such that a diffusion region voltage Vs on a memory transistor side is changed, and after the voltage Vs passes a certain intermediate value Vsx, a gate voltage Vmg of the memory transistor is changed. Alternatively, there is adopted a procedure such that the gate voltage Vmg of the memory transistor is changed, and after the voltage Vmg passes a certain intermediate value Vmgx, the diffusion layer voltage Vs on the memory transistor side is changed. The values of Vsx and Vmgx are determined from the magnitude of the electric field in a gate insulating film not causing FN tunneling electron injection that causes a change in threshold voltage and the magnitude of a potential barrier against holes not causing BTBT hot hole injection.

    摘要翻译: 关于字线偏差的上升和下降,本发明采用使存储晶体管侧的扩散区电压Vs变化的过程,在电压Vs经过一定的中间值Vsx之后,栅极电压Vmg为 存储晶体管被改变。 或者,采用使存储晶体管的栅极电压Vmg改变的过程,并且在电压Vmg经过一定的中间值Vmgx之后,存储晶体管侧的扩散层电压Vs被改变。 Vsx和Vmgx的值由栅极绝缘膜中不引起FN隧穿电子注入的电场的大小确定,导致阈值电压的变化以及针对未引起BTBT热空穴注入的孔的势垒的大小。

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    56.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 失效
    半导体器件及其制造方法

    公开(公告)号:US20080048249A1

    公开(公告)日:2008-02-28

    申请号:US11773842

    申请日:2007-07-05

    IPC分类号: H01L29/792 H01L21/336

    摘要: An interface between a bottom oxide film and a silicon nitride film in a neighborhood of a bottom part of a select gate is located at a position as high as or higher than that of an interface between a silicon substrate (p-type well) and a gate insulating film (d≧0) Further, the gate insulating film and the bottom oxide film are successively and smoothly jointed in the neighborhood of the bottom part of the select gate. By this configuration, localization in a distribution of electrons injected into the silicon nitride film in the writing is mitigated and electrons to be left unerased by hot-hole erasing are reduced. Therefore, not only the increase ratio of the electrons left unerased in the writing can be reduced, but also the problem in which the threshold voltage does not decrease to the predetermined voltage in the deletion can be suppressed.

    摘要翻译: 在选择栅极的底部附近的底部氧化物膜和氮化硅膜之间的界面位于硅衬底(p型阱)和硅衬底(p型阱)之间的界面的高度或更高的位置 栅极绝缘膜(d> = 0)此外,栅极绝缘膜和底部氧化物膜在选择栅极的底部附近连续平滑地接合。 通过这种配置,减轻了在写入中注入到氮化硅膜中的电子分布中的定位,并且减少了通过热孔擦除而未被消除的电子。 因此,不仅可以减少在写入时未加电的电子的增加比例,还可以抑制在删除中阈值电压不降低到预定电压的问题。

    Semiconductor device and method of manufacturing the same
    57.
    发明授权
    Semiconductor device and method of manufacturing the same 失效
    半导体装置及其制造方法

    公开(公告)号:US07709315B2

    公开(公告)日:2010-05-04

    申请号:US11773842

    申请日:2007-07-05

    IPC分类号: H01L21/8238

    摘要: An interface between a bottom oxide film and a silicon nitride film in a neighborhood of a bottom part of a select gate is located at a position as high as or higher than that of an interface between a silicon substrate (p-type well) and a gate insulating film (d≧0) Further, the gate insulating film and the bottom oxide film are successively and smoothly jointed in the neighborhood of the bottom part of the select gate. By this configuration, localization in a distribution of electrons injected into the silicon nitride film in the writing is mitigated and electrons to be left unerased by hot-hole erasing are reduced. Therefore, not only the increase ratio of the electrons left unerased in the writing can be reduced, but also the problem in which the threshold voltage does not decrease to the predetermined voltage in the deletion can be suppressed.

    摘要翻译: 在选择栅极的底部附近的底部氧化物膜和氮化硅膜之间的界面位于硅衬底(p型阱)和硅衬底(p型阱)之间的界面的高度或更高的位置 栅极绝缘膜(d≥0)此外,栅极绝缘膜和底部氧化物膜在选择栅极的底部附近依次平滑地接合。 通过这种配置,减轻了在写入中注入到氮化硅膜中的电子分布中的定位,并且减少了通过热孔擦除而未被消除的电子。 因此,不仅可以减少在写入时未加电的电子的增加比例,还可以抑制在删除中阈值电压不降低到预定电压的问题。

    Semiconductor LED, opto-electronic integrated circuits (OEIC), and method of fabricating OEIC
    58.
    发明授权
    Semiconductor LED, opto-electronic integrated circuits (OEIC), and method of fabricating OEIC 有权
    半导体LED,光电集成电路(OEIC)以及制造OEIC的方法

    公开(公告)号:US08030668B2

    公开(公告)日:2011-10-04

    申请号:US11935904

    申请日:2007-11-06

    IPC分类号: H01L27/15

    摘要: A light emitting diode demonstrating high luminescence efficiency and comprising a Group IV semiconductor such as silicon or germanium equivalent thereto as a basic component formed on a silicon substrate by a prior art silicon process, and a fabricating method of waveguide thereof are provided. The light emitting diode of the invention comprises a first electrode for implanting electrons, a second electrode for implanting holes, and a light emitting section electrically connected to the first and the second electrode, wherein the light emitting section is made out of single crystalline silicon and has a first surface and a second surface facing the first surface, wherein with respect to plane orientation (100) of the first and second surfaces, the light emitting section crossing at right angles to the first and second surfaces is made thinner, and wherein a material having a high refractive index is arranged around the thin film section.

    摘要翻译: 提供了高发光效率的发光二极管,并且包括通过现有技术的硅工艺在硅衬底上形成的等价于其的硅或锗等IV族半导体作为基底部件,以及其波导管的制造方法。 本发明的发光二极管包括用于注入电子的第一电极,用于注入孔的第二电极和与第一和第二电极电连接的发光部分,其中发光部分由单晶硅制成, 具有面向第一表面的第一表面和第二表面,其中相对于第一表面和第二表面的平面取向(100),使与第一表面和第二表面成直角交叉的发光部分变薄,并且其中 具有高折射率的材料设置在薄膜部分周围。

    Semiconductor memory having writing and reading transistors, method of
fabrication thereof, and method of use thereof
    60.
    发明授权
    Semiconductor memory having writing and reading transistors, method of fabrication thereof, and method of use thereof 失效
    具有写入和读取晶体管的半导体存储器,其制造方法及其使用方法

    公开(公告)号:US5357464A

    公开(公告)日:1994-10-18

    申请号:US22937

    申请日:1993-02-26

    CPC分类号: G11C11/401 H01L27/108

    摘要: Disclosed is a semiconductor memory having a self-amplifying cell structure, using (1) a writing transistor and (2) a reading transistor with a floating gate as a charge storage node for each memory cell, and a method of fabricating the memory cell. The writing transistor and reading transistor are of opposite conductivity type to each other; for example, the writing transistor uses a P-channel MOS transistor and the reading transistor (having the floating gate) uses an N-channel MOS transistor. The floating gate of the reading transistor is connected to a single bit line through a source-drain path of the writing transistor, the source-drain path of the reading transistor is connected between the single bit line and a predetermined potential, and the gate electrodes of the writing and reading transistors are connected to a single word line. At least the reading transistor can be formed in a trench, and the word line can be formed overlying the writing transistor and the reading transistor in the trench. Also disclosed is a method of operating the memory cell, wherein the voltage applied to the word line, in a standby condition, is intermediate to the voltage applied to the word line during the writing operation and during the reading operation.

    摘要翻译: 公开了具有自放大单元结构的半导体存储器,其使用(1)写入晶体管和(2)具有浮置栅极的读取晶体管作为每个存储单元的电荷存储节点,以及制造该存储单元的方法。 写入晶体管和读取晶体管彼此具有相反的导电类型; 例如,写入晶体管使用P沟道MOS晶体管,并且读取晶体管(具有浮置栅极)使用N沟道MOS晶体管。 读取晶体管的浮置栅极通过写入晶体管的源极 - 漏极连接到单个位线,读取晶体管的源极 - 漏极连接在单个位线和预定电位之间,并且栅电极 的写和读晶体管连接到单个字线。 至少读取晶体管可以形成在沟槽中,并且字线可以形成在沟槽中的写入晶体管和读取晶体管的上方。 还公开了一种操作存储单元的方法,其中在备用状态下施加到字线的电压在写入操作期间和在读取操作期间施加到字线的电压的中间。