Indirect printing apparatus employing printhead for depositing a sacrificial coating composition on an intermediate transfer member and method for depositing the sacrifical coating
    51.
    发明授权
    Indirect printing apparatus employing printhead for depositing a sacrificial coating composition on an intermediate transfer member and method for depositing the sacrifical coating 有权
    使用用于在中间转印部件上沉积牺牲涂料组合物的打印头的间接印刷装置以及用于沉积牺牲涂层的方法

    公开(公告)号:US09138985B1

    公开(公告)日:2015-09-22

    申请号:US14277464

    申请日:2014-05-14

    CPC classification number: B41J2/0057

    Abstract: An indirect printing apparatus can include an intermediate transfer member, at least one jetting nozzle of a printhead positioned proximate the intermediate transfer member for jetting sacrificial coating composition droplets imagewise onto the intermediate transfer member, a drying station, at least one ink jet nozzle positioned proximate the intermediate transfer member, an ink processing station, and a substrate transfer mechanism. The drying station can be configured for drying the sacrificial coating composition to form a sacrificial coating pattern on the intermediate transfer member. The at least one ink jet nozzle can be configured for jetting ink droplets onto the sacrificial coating formed on the intermediate transfer member. The ink processing station can be configured to at least partially dry the ink on the sacrificial coating formed on the intermediate transfer member. The substrate transfer mechanism can be configured for moving a substrate into contact with the intermediate transfer member.

    Abstract translation: 间接印刷装置可以包括中间转印部件,位于中间转印部件附近的打印头的至少一个喷射喷嘴,用于将牺牲涂料组合物液滴成像地喷射到中间转印部件上,干燥台,至少一个喷墨喷嘴, 中间转印部件,油墨处理台和基板转印机构。 干燥站可以被配置用于干燥牺牲涂料组合物以在中间转印构件上形成牺牲涂层图案。 所述至少一个喷墨喷嘴可以被配置为将墨滴喷射到形成在中间转印部件上的牺牲涂层上。 油墨处理站可以被配置为至少部分地干燥形成在中间转印部件上的牺牲涂层上的油墨。 衬底传送机构可以被配置为使衬底移动以与中间转印构件接触。

    Adhesive composition comprising metal nanoparticles

    公开(公告)号:US11142671B2

    公开(公告)日:2021-10-12

    申请号:US16277664

    申请日:2019-02-15

    Abstract: Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of metal nanoparticle shaving an average particle size ranging from about 0.5 nanometers to about 100 nanometers, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.

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