公开(公告)号：US20120135159A1

公开(公告)日：2012-05-31

申请号：US12957196

申请日：2010-11-30

Applicant: Shuaigang Xiao ,  Renè Johannes Marinus Van De Veerdonk ,  Kim Yang Lee ,  David Kuo ,  XiaoMin Yang ,  Wei Hu

Inventor： Shuaigang Xiao ,  Renè Johannes Marinus Van De Veerdonk ,  Kim Yang Lee ,  David Kuo ,  XiaoMin Yang ,  Wei Hu

IPC: B05D5/00 ,  B05D3/06 ,  B05C9/10 ,  B05C9/14 ,  B05C9/12 ,  B05D3/12 ,  B05D3/00

CPC classification number: B81C1/00031 ,  B81C2201/0149 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G11B5/855

Abstract: This disclosure describes a method for nano-patterning by incorporating one or more block copolymers and one or more nano-imprinting steps in the fabrication process. The block copolymers may be comprised of organic or organic components, and may be lamellar, spherical or cylindrical. As a result, a patterned medium may be formed having one-dimensional or two-dimensional patterns with a feature pitch of 5-100 nm and/or a bit density of at least 1 Tdpsi.

Abstract translation: 本公开描述了通过在制造过程中引入一种或多种嵌段共聚物和一种或多种纳米压印步骤来进行纳米图案化的方法。 嵌段共聚物可以由有机或有机组分组成，并且可以是层状的，球形的或圆柱形的。 结果，可以形成具有特征间距为5-100nm和/或至少1Tdpsi的位密度的一维或二维图案的图案化介质。

公开(公告)号：US07887723B2

公开(公告)日：2011-02-15

申请号：US11623817

申请日：2007-01-17

Applicant: Kenji Murao ,  Kosuke Kuwabara ,  Masahiko Ogino

Inventor： Kenji Murao ,  Kosuke Kuwabara ,  Masahiko Ogino

IPC: B29C65/00

CPC classification number: B81C1/0046 ,  B29C43/021 ,  B29C2043/025 ,  B81B2201/0214 ,  B81B2203/0361 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y15/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: It is an object of the present invention to provide a method which can easily and selectively modify specific sites on indentations or protrusions of indentation/protrusion structures fabricated by nano-imprinting. Pressing a mold having indentation/protrusion structures onto a polymer substrate comprising at least two layers of different chemical composition exposes the second layer, which has been covered by the outermost layer, in pillars formed as a result of the pressing. Site-specific chemical modification of the pillars can be achieved by formulating a desired chemical composition for the second layer beforehand, or by chemical modification of the exposed second layer cross-sections in the pillars.

Abstract translation: 本发明的一个目的是提供一种方法，其可以容易且选择性地改变通过纳米压印制造的压痕/突起结构的凹陷或凸起上的特定部位。 将具有凹陷/突起结构的模具压到包含至少两层不同化学组成的聚合物基材上，将由最外层覆盖的第二层暴露在由压制形成的柱中。 可以通过预先为第二层配制所需的化学组合物，或者通过化学修饰柱中暴露的第二层横截面来实现柱的特定位点的化学修饰。

公开(公告)号：US20090281242A1

公开(公告)日：2009-11-12

申请号：US12425108

申请日：2009-04-16

Applicant: Stefan Landis

Inventor： Stefan Landis

IPC: C08L53/00

CPC classification number: B81C1/00111 ,  B81C2201/0149 ,  B81C2201/0153 ,  B82Y30/00

Abstract: A method of preparing a polymer film having nanoscale features at the surface and being microstructured in its thickness over all or part of this film in accordance with a particular system including providing at least one block copolymer capable of being microstructured in accordance with the aforementioned particular system at a predetermined temperature and in accordance with at least one predetermined thickness, where the predetermined thickness corresponds to the thickness of the film all or part of which is compatible with the microstructuring in accordance with the particular system. At least one mould is provided capable of conferring the predetermined thickness and the nanoscale features after application to a film comprising the block copolymer. The mould is applied to a film including the block copolymer while heating the mould to the predetermined temperature, by which means the film is obtained and defined as an article.

Abstract translation: 一种制备具有纳米尺度特征的聚合物膜的方法，该聚合物膜根据特定体系包括提供至少一种能够根据上述特定体系进行微结构化的嵌段共聚物，在该膜的全部或部分上以其厚度微结构化 在预定温度下并且根据至少一个预定厚度，其中预定厚度对应于膜的厚度，其全部或部分与根据特定系统的微结构兼容。 提供至少一个模具，其能够在施加到包含嵌段共聚物的膜之后赋予预定厚度和纳米尺度特征。 在将模具加热到预定温度的同时将模具施加到包括嵌段共聚物的膜上，由此获得膜并将其定义为制品。

公开(公告)号：US20090173889A1

公开(公告)日：2009-07-09

申请号：US11921641

申请日：2006-06-12

Applicant: Santiago Costantino ,  Katrin G. Heinze ,  Paul W. Wiseman ,  Oscar E. Martinez

Inventor： Santiago Costantino ,  Katrin G. Heinze ,  Paul W. Wiseman ,  Oscar E. Martinez

IPC: G01J1/58 ,  G01D18/00 ,  B29C35/08

CPC classification number: G01N21/6458 ,  B81C1/00071 ,  B81C1/00206 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G01N21/278 ,  G01N2021/6482 ,  G03F7/0002 ,  G03F7/2053

Abstract: There is provided fluorescent photopolymerizable resins for use in biological studies and image acquisition. In particular the photopolymerizable resins are useful in studying the properties of cells. The resins are also useful for the calibration of microscopic measurement systems.

Abstract translation: 提供用于生物学研究和图像采集的荧光光聚合树脂。 特别地，可光聚合树脂可用于研究细胞的性质。 这些树脂也可用于微观测量系统的校准。

公开(公告)号：US20090115094A1

公开(公告)日：2009-05-07

申请号：US12129418

申请日：2008-05-29

Applicant: Stephen Y. Chou ,  Xiaogan Liang

Inventor： Stephen Y. Chou ,  Xiaogan Liang

IPC: B29C33/42

CPC classification number: G03F7/0002 ,  B01L3/502707 ,  B01L3/502761 ,  B01L2200/0663 ,  B01L2300/0816 ,  B01L2300/0896 ,  B81B2203/0338 ,  B81C1/00071 ,  B81C1/0046 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00

Abstract: This application describes a novel method of fabricating narrow (2-100 nm) width and long (greater than 50 micrometers and preferably 1 centimeter or longer) yet continuous hollow channels that allow flow of fluid or gas, or their combination. It can optimally include RIE pattern transfer or an optional sealing of a top surface over the channel. The invention also includes a novel method for making an imprint mold for imprinting the channel.

Abstract translation: 本申请描述了一种制造窄（2-100nm）宽和长（大于50微米，优选1厘米或更长）的连续中空通道的新方法，其允许流体或气体或其组合流动。 它可以最佳地包括RIE图案转移或通道上顶表面的可选密封。 本发明还包括用于制造用于压印通道的压印模具的新颖方法。

公开(公告)号：US07509733B2

公开(公告)日：2009-03-31

申请号：US11503856

申请日：2006-08-14

Applicant: Francçis Marion

Inventor： Francçis Marion

IPC: H05K3/02 ,  H01L21/44

CPC classification number: B81C1/00269 ,  B81C2201/0153 ,  B81C2203/019 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/062 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0405 ,  H05K2203/043 ,  Y10T29/49155 ,  Y10T29/49158 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method for producing a plurality of stamped shapes to serve as a mechanism for connecting and/or soldering or sealing a component, on a substrate, including the steps of depositing a layer made of a ductile material on the substrate and stamping the layer by means of an etched die having the plurality of etched portions defining one or more shapes to form the plurality of stamped shapes.

Abstract translation: 一种用于制造多个冲压形状以用作在基板上连接和/或焊接或密封部件的机构的方法，包括以下步骤：将由延性材料制成的层沉积在基板上并通过装置 蚀刻的模具具有限定一个或多个形状的多个蚀刻部分以形成多个冲压形状。

公开(公告)号：US20080003818A1

公开(公告)日：2008-01-03

申请号：US11671688

申请日：2007-02-06

Applicant: Robert Seidel ,  Carsten Peters ,  Frank Feustel

Inventor： Robert Seidel ,  Carsten Peters ,  Frank Feustel

IPC: H01L21/44

CPC classification number: B81B7/0006 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/28114 ,  H01L21/76224 ,  H01L21/76229 ,  H01L21/76804 ,  H01L21/76807 ,  H01L21/76817 ,  H01L21/76838 ,  H01L21/76852 ,  H01L21/76885 ,  H01L2221/1021

Abstract: By forming metallization structures on the basis of an imprint technique, in which via openings and trenches may be commonly formed, a significant reduction of process complexity may be achieved due to the omission of at least one further alignment process as required in conventional process techniques. Furthermore, the flexibility and efficiency of imprint lithography may be increased by providing appropriately designed imprint molds in order to provide via openings and trenches exhibiting an increased fill capability, thereby also improving the performance of the finally obtained metallization structures with respect to reliability, resistance against electromigration and the like.

Abstract translation: 通过基于压印技术形成金属化结构，其中可以通常形成通孔和沟槽，由于根据常规工艺技术所要求的至少一个进一步对准过程，可以实现工艺复杂性的显着降低。 此外，可以通过提供适当设计的压印模具来提高压印光刻的灵活性和效率，以便提供表现出增加的填充能力的通孔开口和沟槽，从而也提高了最终获得的金属化结构在可靠性，抗性 电迁移等。

公开(公告)号：US20070049065A1

公开(公告)日：2007-03-01

申请号：US11503856

申请日：2006-08-14

Applicant: Francois Marion

Inventor： Francois Marion

IPC: H05K1/00

CPC classification number: B81C1/00269 ,  B81C2201/0153 ,  B81C2203/019 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/062 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0405 ,  H05K2203/043 ,  Y10T29/49155 ,  Y10T29/49158 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method for producing a mechanism for connecting and/or soldering or sealing a component on a substrate, including depositing on the substrate a layer made of a ductile material which, if applicable, conducts electricity, and stamping the layer thus produced by means of an etched die, the etching depending on the shape that one wishes to give the mechanism for connecting and/or soldering.

Abstract translation: 一种用于生产用于连接和/或焊接或密封基底上的部件的机构的方法，包括在基底上沉积由可延展材料制成的层，如果适用的话，该导电材料可传导电，并且通过 蚀刻，取决于希望给出用于连接和/或焊接的机构的形状的蚀刻。