公开(公告)号：US20080057756A1

公开(公告)日：2008-03-06

申请号：US11896298

申请日：2007-08-30

Applicant: Han Kim ,  Yang Je Lee ,  Sang Jin Oh ,  Mi Ja Han

Inventor： Han Kim ,  Yang Je Lee ,  Sang Jin Oh ,  Mi Ja Han

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H01R12/58 ,  H05K3/365 ,  H05K2201/10295

Abstract: Disclosed herein is a Printed Circuit Board (PCB) having connectors. The PCB includes a terminal part and a connector pin. The terminal part is formed in one end of the PCB and is provided with a terminal hole. The connector pin is configured such that one end thereof is inserted into the terminal hole, and the remaining end thereof extends to protrude outside the terminal hole and is also bent several times, thus forming a contact part that is elastically deformed, and electrically connected to a pad part provided in a target PCB for connection. Thus, a desirable signal transmission characteristic is guaranteed, so that the reliability of electronic devices using the PCB can be improved and the manufacturing cost can also be reduced.

Abstract translation: 本文公开了具有连接器的印刷电路板（PCB）。 PCB包括端子部分和连接器引脚。 端子部分形成在PCB的一端并设有端子孔。 连接器销被构造成使得其一端插入端子孔中，并且其剩余端延伸到端子孔外部并且也弯曲多次，从而形成弹性变形的接触部，并且电连接到 设置在目标PCB中用于连接的焊盘部分。 因此，保证期望的信号传输特性，从而可以提高使用PCB的电子设备的可靠性，并且还可以降低制造成本。

公开(公告)号：US20080017406A1

公开(公告)日：2008-01-24

申请号：US11490996

申请日：2006-07-20

Applicant: Marvin C. Espino

Inventor： Marvin C. Espino

IPC: H05K1/16

CPC classification number: H01L23/3672 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0204 ,  H05K3/3447 ,  H05K2201/10295 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A thermal conduit to extract heat from an electrical component on a circuit board is disclosed. An electronic assembly according to aspects of the present invention includes an integrated circuit mounted on a circuit board and a thermal conduit having a first and a second portion. The first portion of the thermal conduit is thermally coupled to one or more electrical terminals of the integrated circuit through an opening defined in the circuit board while the second portion of the thermal conduit is thermally coupled to a first material of the circuit board.

Abstract translation: 公开了一种从电路板上的电气部件提取热量的热导管。 根据本发明的方面的电子组件包括安装在电路板上的集成电路和具有第一和第二部分的热导管。 热导管的第一部分通过限定在电路板中的开口热耦合到集成电路的一个或多个电端子，而热导管的第二部分热耦合到电路板的第一材料。

公开(公告)号：US20070167037A1

公开(公告)日：2007-07-19

申请号：US10589145

申请日：2004-12-24

Applicant: Wolfgang Thiel ,  Dirk Riese ,  Jorg Graubmann

Inventor： Wolfgang Thiel ,  Dirk Riese ,  Jorg Graubmann

IPC: H05K1/00

CPC classification number: H01R12/58 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/10871

Abstract: The invention relates to an electric sub-assembly comprising conductor tracks on its upper and lower faces and non-plated holes (2), the hole (2) in the printed circuit board having predetermined dimensions (D2) and at least one sub-section of the contact pin (1) being oversized (D1.1>D2) in a defined manner in relation to the dimensions (D2) of the hole, in order to form a press connection. The length (l1) of the contact pin (1) that can be introduced is greater than the depth (l2) of the opening (2), so that the contact pin (1), once pressed into the hole, passes through the printed circuit board (2) and projects beyond the latter in the introduction direction.

Abstract translation: 本发明涉及一种电子组件，包括其上表面和下表面上的导体轨道和非电镀孔（2），印刷电路板中的孔（2）具有预定尺寸（D 2） 相对于孔的尺寸（D 2），接触销（1）的横截面尺寸（D 1.1> D 2）以规定的方式，以形成压力连接。 可以引入的接触销（1）的长度（l 1）大于开口（2）的深度（l 2），使得一旦压入孔中的接触销（1）通过 印刷电路板（2），并在引进方向上超越后者。

公开(公告)号：US20070152697A1

公开(公告)日：2007-07-05

申请号：US11395930

申请日：2006-03-30

Applicant: Cheng-Chung Hsu

Inventor： Cheng-Chung Hsu

IPC: G01R31/26

CPC classification number: H05K7/142 ,  H05K1/0215 ,  H05K3/326 ,  H05K3/4015 ,  H05K2201/10295 ,  H05K2201/10962

Abstract: An engaging device of a circuit board is disclosed. The engaging device is for engaging a circuit board having a positioning hole to a housing of an electronic device. The engaging device includes a conductive hook fixed to the housing, the conductive hook including a hook portion for being hooked to the positioning hole, and a contacting end formed on an end of the hook portion; and a conductive slice fixed to a side of the circuit board, corresponding to the positioning hole for contacting with the contacting end when the hook portion is hooked to the positioning hole, so as to allow static electricity generated by the circuit board to be conducted to the housing, and improve engaging strength of the conductive hook and the housing.

Abstract translation: 公开了电路板的接合装置。 接合装置用于将具有定位孔的电路板接合到电子设备的壳体。 所述接合装置包括固定到所述壳体的导电钩，所述导电钩包括用于钩住所述定位孔的钩部和形成在所述钩部的端部上的接触端; 以及固定到所述电路板侧的导电片，其对应于当所述钩部钩挂到所述定位孔时与所述接触端接触的所述定位孔，以便允许将所述电路板产生的静电导入 壳体，并且改善导电钩和壳体的接合强度。

公开(公告)号：US07211103B2

公开(公告)日：2007-05-01

申请号：US10174349

申请日：2002-06-17

Applicant: Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok

Inventor： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok

IPC: A61N1/00

CPC classification number: A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by one of several methods, including attachment by an electrically conductive adhesive, such as epoxy or polyimide, containing platinum metal flake in biocompatible glue; diffusion bonding of platinum bumps covered by an insulating layer; thermal welding of wire staples; or an integrated interconnect fabrication. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封的电子封装通过几种方法之一直接接合到柔性电路或电极，包括通过导电粘合剂（例如环氧树脂或聚酰亚胺）附着，其包含生物相容性胶中的铂金属薄片; 由绝缘层覆盖的铂凸块的扩散接合; 线钉热焊接; 或集成互连制造。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20060189205A1

公开(公告)日：2006-08-24

申请号：US11353604

申请日：2006-02-14

Applicant: Eriko Noguchi

Inventor： Eriko Noguchi

IPC: H01R3/00

CPC classification number: H01M2/10 ,  H01M2/0222 ,  H01M2/0421 ,  H01M2/20 ,  H01M2/30 ,  H05K3/301 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/10606 ,  H05K2201/10666

Abstract: To prevent harmful glass fiber powders from being produced by abrasing and wearing a circuit board and to dispense with a change in a battery minus terminal when changed to a circuit board having a different thickness. Tongue shape locking spring portions formed at both ends of a minus battery terminal comprising an elastic thin plate are inserted into locking holes of a circuit board and the minus terminal is fixed to the circuit board by a contact pressure produced by bringing the tongue shape locking spring portions into contact with inner walls of the locking holes to be elastically deformed thereby. The tongue shape locking spring portion is constituted by a pair of tongue pieces symmetrical in a left and right direction, and each tongue piece includes a horizontal extended portion and a locking hole inserting portion. The locking hole inserting portion is formed with a projection in a semicircular shape brought into contact with the inner wall of the locking hole.

Abstract translation: 为了防止由于磨损和磨损电路板而产生有害的玻璃纤维粉末，并且当改变为具有不同厚度的电路板时，减少电池减去端子的变化。 在包括弹性薄板的负电池端子的两端形成的舌形锁定弹簧部分插入到电路板的锁定孔中，并且负端子通过使舌形锁定弹簧产生的接触压力固定到电路板 与锁定孔的内壁接触的部分由此弹性变形。 舌形锁定弹簧部分由在左右方向上对称的一对舌片构成，每个舌片包括水平延伸部分和锁定孔插入部分。 锁定孔插入部形成有与锁定孔的内壁接触的半圆形的突起。

公开(公告)号：US20050079748A1

公开(公告)日：2005-04-14

申请号：US10948667

申请日：2004-09-24

Applicant: Myoung-Kon Kim

Inventor： Myoung-Kon Kim

IPC: G09F9/00 ,  H01J17/16 ,  H01R4/34 ,  H01R4/66 ,  H05K3/32

CPC classification number: H05K1/0215 ,  H01R4/34 ,  H01R4/66 ,  H05K3/325 ,  H05K2201/10295 ,  H05K2201/10386 ,  H05K2201/10401 ,  H05K2201/10409

Abstract: A coupling and grounding structure of a plasma display device for grounding a circuit board effectively, and fixing the circuit board stably. The plasma display device includes a plasma display panel having a display area, on which images are displayed; a chassis base coupled to a back surface of the plasma display panel; at least one circuit board, on which at least one electronic element for driving the plasma display panel is mounted, the circuit board having a conductive portion and at least one coupling hole to be coupled to the chassis base by a bolt member penetrating the coupling hole; and at least a conductive member which contacts the conductive portion and the bolt member in the coupling hole.

Abstract translation: 用于有效地接地电路板的等离子体显示装置的耦合和接地结构，并且稳定地固定电路板。 等离子体显示装置包括具有显示区域的等离子体显示面板，显示图像; 耦合到所述等离子体显示面板的后表面的底架; 至少一个电路板，其上安装有用于驱动等离子体显示面板的至少一个电子元件，所述电路板具有导电部分和至少一个耦合孔，以通过穿过所述耦合孔的螺栓构件联接到所述底架 ; 以及至少一个与所述连接孔中的导电部分和螺栓构件接触的导电构件。

公开(公告)号：US06716038B2

公开(公告)日：2004-04-06

申请号：US10209009

申请日：2002-07-31

Applicant: Steven E. Garcia

Inventor： Steven E. Garcia

IPC: H01R909

CPC classification number: H01R9/09 ,  H01R12/523 ,  H01R13/2421 ,  H05K3/308 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/10295 ,  H05K2201/1059

Abstract: A three-dimensional circuit module includes z-axis connection pins, such as twist pins to electrically connect multiple, spaced-apart substrates, such as circuit boards. An expanding portion of a bulge of the pin mechanically and electrically contacts a corner edge of a via in a substrate without full insertion of the bulge in the via. Compression of the expanding portion of the non-inserted bulge establishes the electrical connection, which is also assisted by the longitudinal restraint on the pin relative to the substrate. Assembly and disassembly is facilitated without requiring the bulge to be fully inserted into the via.

Abstract translation: 三维电路模块包括z轴连接引脚，例如扭转引脚，以电连接多个间隔开的基板，例如电路板。 销的凸起的膨胀部分机械地和电接触衬底中的通孔的拐角边缘，而不会在通孔中完全插入凸起。 非插入凸起的膨胀部分的压缩建立了电连接，其也由相对于基底的销上的纵向约束来辅助。 便于装配和拆卸，而不需要将凸起完全插入通孔中。

公开(公告)号：US20030233133A1

公开(公告)日：2003-12-18

申请号：US10174349

申请日：2002-06-17

Inventor： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok

IPC: A61N001/375

CPC classification number: A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by one of several methods, including attachment by an electrically conductive adhesive, such as epoxy or polyimide, containing platinum metal flake in biocompatible glue; diffusion bonding of platinum bumps covered by an insulating layer; thermal welding of wire staples; or an integrated interconnect fabrication. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封的电子封装通过几种方法之一直接接合到柔性电路或电极，包括通过导电粘合剂（例如环氧树脂或聚酰亚胺）附着，其包含生物相容性胶中的铂金属薄片; 由绝缘层覆盖的铂凸块的扩散接合; 线钉热焊接; 或集成互连制造。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20020151200A1

公开(公告)日：2002-10-17

申请号：US10030866

申请日：2002-05-16

Inventor： Edwin Fauser ,  Herman Roozenbeek ,  Wolfgang Schilling ,  Hans Seitel ,  Thomas Wizemann ,  Reinhard Pfendtner ,  Werner Butschkau ,  Wolfgang Hiller ,  Stefan Josten

IPC: H01R013/53

CPC classification number: H05K9/0066 ,  H01T4/08 ,  H05K1/026 ,  H05K1/0272 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/09772 ,  H05K2201/10295 ,  H05K2201/10636 ,  Y02P70/611

Abstract: The proposal relates to a device for protecting an electrical and/or electronic component, arranged on a carrier substrate, from electrostatic discharges, an overvoltage occurring in the case of discharge at a carrier-substrate contact element connected to the component being diverted to a ground connection, bypassing the component. It is proposed that the protective device include a first electroconductive structure conductively connected to the jeopardized contact element, and a second electroconductive structure arranged adjacent to the first structure on the carrier substrate and conductively connected to the ground connection. Mutually facing sections of the electroconductive structures are set apart spatially from one another by a defined gap in such a way that an overvoltage transmitted to the contact element is transferred by a spark discharge in the gap from the section of the first electroconductive structure to the section of the second electroconductive structure, and is diverted to the ground connection.

Abstract translation: 该提案涉及一种用于保护布置在载体基板上的电气和/或电子部件免受静电放电的装置，在连接到部件的载体 - 基板接触元件被转移到地面处的放电的情况下发生的过电压 连接，绕过组件。 提出了保护装置包括导电连接到危险接触元件的第一导电结构和在载体基板上邻近第一结构设置并导电连接到接地连接的第二导电结构。 导电结构的相互面对的部分通过限定的间隙在空间上彼此分开设置，使得传递到接触元件的过电压通过间隙中的火花放电从第一导电结构的部分转移到部分 的第二导电结构，并被转移到接地连接。