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公开(公告)号:US20090052694A1
公开(公告)日:2009-02-26
申请号:US12187703
申请日:2008-08-07
申请人: Takashi YAMAZAKI , Masaru Kimura
发明人: Takashi YAMAZAKI , Masaru Kimura
CPC分类号: G10H1/16 , G10H2210/321 , G10H2250/571
摘要: A multiplier 3 multiplies a square wave signal A(ω,t) by a low frequency component signal L(ω,t) to generate an even-order harmonic component signal B(ω,t). A multiplier 4 multiplies the even-order harmonic component signal B(ω,t) by the low frequency component signal L(ω,t) to generate an odd-order harmonic component signal C(ω,t). An adder 5 adds the even-order harmonic component signal B(ω,t) and the odd-order harmonic component signal C(ω,t) to generate the harmonic component signal D(ω,t).
摘要翻译: 乘法器3将方波信号A(ω,t)乘以低频分量信号L(ω,t)以产生偶次谐波分量信号B(ω,t)。 乘法器4将偶次谐波分量信号B(ω,t)乘以低频分量信号L(ω,t),以产生奇次谐波分量信号C(ω,t)。 加法器5将偶次谐波分量信号B(ω,t)和奇次谐波分量信号C(ω,t)相加以产生谐波分量信号D(ω,t)。
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62.
公开(公告)号:US07281088B2
公开(公告)日:2007-10-09
申请号:US10812893
申请日:2004-03-31
申请人: Takashi Yamazaki , Kazuo Hakamata , Azuma Kano
发明人: Takashi Yamazaki , Kazuo Hakamata , Azuma Kano
IPC分类号: G06F12/00
CPC分类号: G06F3/0625 , G06F1/3221 , G06F1/3268 , G06F3/0634 , G06F3/0653 , G06F3/0659 , G06F3/0689 , G06F11/1662 , G06F11/2094 , G06F11/2097 , G11B19/00 , Y02D10/154 , Y02D50/20
摘要: Times at which requests for a data read or data write from/to a logical volume are received are stored in memory as access times of a RAID group making up the logical volume. When a predetermined time has elapsed after the access time, a number of the hard disk drives according to the redundancy of the RAID group are set to a power saving mode. Assume there are first hard disk drives and second hard disk drives having shorter lifes and the RAID group exceeds a predetermined time after the access time. When the RAID group consists of only the first drives, a number of the first drives according to the redundancy of the RAID group are set to a power saving mode and when it consists of only the second drives, an arbitrary number of second drives are set to a power saving mode.
摘要翻译: 接收来自/向逻辑卷的数据读取或数据写入的请求的时间作为构成逻辑卷的RAID组的访问时间被存储在存储器中。 当在访问时间之后经过预定时间时,根据RAID组的冗余将多个硬盘驱动器设置为省电模式。 假设有第一个硬盘驱动器和第二个硬盘驱动器具有较短的寿命,并且RAID组在访问时间之后超过预定时间。 当RAID组仅由第一个驱动器组成时,根据RAID组的冗余将多个第一个驱动器设置为省电模式,并且当仅由第二个驱动器组成时,将设置任意数量的第二个驱动器 进入省电模式。
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公开(公告)号:US07203101B2
公开(公告)日:2007-04-10
申请号:US11330220
申请日:2006-01-12
申请人: Kazuhiko Kajigaya , Kazuyuki Miyazawa , Manabu Tsunozaki , Kazuyoshi Oshima , Takashi Yamazaki , Yuji Sakai , Jiro Sawada , Yasunori Yamaguchi , Tetsurou Matsumoto , Shinji Udo , Hiroshi Yoshioka , Hirokazu Saito , Mitsuhiro Takano , Makoto Morino , Sinichi Miyatake , Eiji Miyamoto , Yasuhiro Kasama , Akira Endo , Ryoichi Hori , Jun Etoh , Masashi Horiguchi , Shinichi Ikenaga , Atsushi Kumata
发明人: Kazuhiko Kajigaya , Kazuyuki Miyazawa , Manabu Tsunozaki , Kazuyoshi Oshima , Takashi Yamazaki , Yuji Sakai , Jiro Sawada , Yasunori Yamaguchi , Tetsurou Matsumoto , Shinji Udo , Hiroshi Yoshioka , Hirokazu Saito , Mitsuhiro Takano , Makoto Morino , Sinichi Miyatake , Eiji Miyamoto , Yasuhiro Kasama , Akira Endo , Ryoichi Hori , Jun Etoh , Masashi Horiguchi , Shinichi Ikenaga , Atsushi Kumata
IPC分类号: G11C7/10
CPC分类号: H01L24/06 , G11C5/025 , G11C5/04 , G11C5/063 , G11C11/406 , G11C29/06 , G11C29/12005 , G11C29/12015 , G11C29/24 , G11C29/34 , G11C29/50 , G11C29/50012 , G11C29/70 , G11C29/80 , G11C29/804 , G11C29/832 , G11C29/844 , G11C2029/2602 , H01L24/05 , H01L24/45 , H01L24/48 , H01L27/0207 , H01L27/105 , H01L27/10897 , H01L27/11898 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/05624 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/73215 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01037 , H01L2924/01038 , H01L2924/01039 , H01L2924/01041 , H01L2924/01043 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01054 , H01L2924/01055 , H01L2924/01058 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01083 , H01L2924/01084 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要: A semiconductor memory device formed on a semiconductor chip comprises a plurality of first memory arrays, a plurality of second memory arrays, a first voltage generator, and a plurality of first bonding pads. The semiconductor chip is divided into a first rectangle region, a second rectangle region, and a third rectangle region and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The plurality of first memory arrays are formed in the first rectangle region. The plurality of second memory arrays are formed in the second rectangle region. The voltage generator and the plurality of first bonding pads are arranged in the third rectangle region. The plurality of first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the plurality of second memory arrays.
摘要翻译: 形成在半导体芯片上的半导体存储器件包括多个第一存储器阵列,多个第二存储器阵列,第一电压发生器和多个第一焊盘。 半导体芯片被分成第一矩形区域,第二矩形区域和第三矩形区域,并且第三矩形区域布置在第一矩形区域和第二矩形区域之间。 多个第一存储器阵列形成在第一矩形区域中。 多个第二存储器阵列形成在第二矩形区域中。 电压发生器和多个第一接合焊盘被布置在第三矩形区域中。 多个第一接合焊盘布置在第一矩形区域和电压发生器之间,并且在电压发生器和多个第二存储器阵列之间没有布置接合焊盘。
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公开(公告)号:US20070073970A1
公开(公告)日:2007-03-29
申请号:US11604216
申请日:2006-11-27
申请人: Takashi Yamazaki , Kazuo Hakamata , Azuma Kano
发明人: Takashi Yamazaki , Kazuo Hakamata , Azuma Kano
CPC分类号: G06F3/0625 , G06F1/3221 , G06F1/3268 , G06F3/0634 , G06F3/0653 , G06F3/0659 , G06F3/0689 , G06F11/1662 , G06F11/2094 , G06F11/2097 , G11B19/00 , Y02D10/154 , Y02D50/20
摘要: Times at which requests for a data read or data write from/to a logical volume are received are stored in memory as access times of a RAID group making up the logical volume. When a predetermined time has elapsed after the access time, a number of the hard disk drives according to the redundancy of the RAID group are set to a power saving mode. Assume there are first hard disk drives and second hard disk drives having shorter lifes and the RAID group exceeds a predetermined time after the access time. When the RAID group consists of only the first drives, a number of the first drives according to the redundancy of the RAID group are set to a power saving mode and when it consists of only the second drives, an arbitrary number of second drives are set to a power saving mode.
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公开(公告)号:US07008574B2
公开(公告)日:2006-03-07
申请号:US10677249
申请日:2003-10-03
申请人: Haruyuki Matsubayashi , Yukio Iimura , Takashi Yamazaki , Akira Kanda , Takamitsu Yamashita , Yutaka Yamaguchi , Masamitsu Suzuki
发明人: Haruyuki Matsubayashi , Yukio Iimura , Takashi Yamazaki , Akira Kanda , Takamitsu Yamashita , Yutaka Yamaguchi , Masamitsu Suzuki
IPC分类号: B29C45/77
CPC分类号: B29C45/77 , B29C2945/76006 , B29C2945/76083 , B29C2945/76498 , B29C2945/76605 , B29C2945/76665 , B29C2945/76785 , B29C2945/76859 , B29C2945/76936
摘要: An electric injection molding machine capable of maintaining a quality of molded articles and capable of suppressing a variation of weight of articles molded by a mold having a plurality of cavities when transferring molding conditions in a hydraulic injection molding machine as they are to the electric injection molding machine. This electric injection molding machine has an electric injection mechanism for injecting a molding material into a mold by a drive force of an electric motor, an injection control unit and a servo driver for controlling the injection motor so as to follow the injection speed reference, and an reference compensation unit for compensating the injection speed reference based on the characteristics of the hydraulic drive system so that fluctuation characteristics of the injection speed with respect to the injection pressure when controlling the electric injection mechanism approximate the fluctuation characteristics of the injection speed with respect to the injection pressure in the hydraulic injection mechanism performing the injection of the molding material to the mold by the hydraulic drive system.
摘要翻译: 一种电动注射成型机,其能够保持成型品的质量,并且能够抑制在液压注射成型机中将成型条件转移至电注射成型时将由具有多个空腔的模具成形的制品的重量变化 机。 该电动注射成型机具有电动注射机构,用于通过电动机的驱动力,注射控制单元和伺服驱动器将成型材料注入到模具中,用于控制注射电动机以遵循注射速度参考,以及 参考补偿单元,用于基于液压驱动系统的特性来补偿喷射速度基准,使得当控制电喷射机构时喷射速度相对于喷射压力的波动特性近似于喷射速度的波动特性 液压喷射机构中的注射压力通过液压驱动系统执行模制材料的注入。
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公开(公告)号:US20050199014A1
公开(公告)日:2005-09-15
申请号:US11069039
申请日:2005-03-02
IPC分类号: C03B37/014 , C03B37/018
CPC分类号: C03B37/0144 , C03B37/01406
摘要: In an apparatus for producing glass particles deposit according to the present invention, a plurality of glass particle synthesis burners are placed on a front face of a reaction vessel, and at least one exhaust port is provided on a rear face of the reaction vessel. Two wall faces extending from both sides of the exhaust port and being in contact with two side faces of the reaction vessel are provided so that its contained angle is 90 degrees or less. Assuming that the shorter distance between the shortest distance from a rotation axis of a target rod to the side face of the reaction vessel and the shortest distance from the rotation axis of the target rod to the wall face is L, and the outer diameter of the glass particles deposit deposited on the target rod is d, L is greater than d.
摘要翻译: 在本发明的玻璃粒子沉积物的制造装置中,多个玻璃粒子合成燃烧器配置在反应容器的正面,在反应容器的背面设有至少一个排气口。 设置从排气口两侧延伸并与反应容器的两个侧面接触的两个壁面,使得它的夹角为90度以下。 假设从目标棒的旋转轴到反应容器的侧面的最短距离与从靶棒的旋转轴到壁面的最短距离之间的较短距离为L, 沉积在目标棒上的玻璃颗粒沉积物是d,L大于d。
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公开(公告)号:US20050179058A1
公开(公告)日:2005-08-18
申请号:US11101504
申请日:2005-04-08
申请人: Kazuhiko Kajigaya , Kazuyuki Miyazawa , Manabu Tsunozaki , Kazuyoshi Oshima , Takashi Yamazaki , Yuji Sakai , Jiro Sawada , Yasunori Yamaguchi , Tetsurou Matsumoto , Shinji Udo , Hiroshi Yoshioka , Hirokazu Saito , Mitsuhiro Takano , Makoto Morino , Sinichi Miyatake , Eiji Miyamoto , Yasuhiro Kasama , Akira Endo , Ryoichi Hori , Jun Etoh , Masashi Horiguchi , Shinichi Ikenaga , Atsushi Kumata
发明人: Kazuhiko Kajigaya , Kazuyuki Miyazawa , Manabu Tsunozaki , Kazuyoshi Oshima , Takashi Yamazaki , Yuji Sakai , Jiro Sawada , Yasunori Yamaguchi , Tetsurou Matsumoto , Shinji Udo , Hiroshi Yoshioka , Hirokazu Saito , Mitsuhiro Takano , Makoto Morino , Sinichi Miyatake , Eiji Miyamoto , Yasuhiro Kasama , Akira Endo , Ryoichi Hori , Jun Etoh , Masashi Horiguchi , Shinichi Ikenaga , Atsushi Kumata
IPC分类号: G11C5/00 , G11C5/02 , G11C5/06 , G11C11/406 , H01L23/485 , H01L27/108 , H01L21/3205
CPC分类号: H01L24/06 , G11C5/025 , G11C5/04 , G11C5/063 , G11C11/406 , G11C29/06 , G11C29/12005 , G11C29/12015 , G11C29/24 , G11C29/34 , G11C29/50 , G11C29/50012 , G11C29/70 , G11C29/80 , G11C29/804 , G11C29/832 , G11C29/844 , G11C2029/2602 , H01L24/05 , H01L24/45 , H01L24/48 , H01L27/0207 , H01L27/105 , H01L27/10897 , H01L27/11898 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/05624 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/73215 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01037 , H01L2924/01038 , H01L2924/01039 , H01L2924/01041 , H01L2924/01043 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01054 , H01L2924/01055 , H01L2924/01058 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01083 , H01L2924/01084 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要: A semiconductor memory device formed on a semiconductor chip comprises a plurality of first memory arrays, a plurality of second memory arrays, a first voltage generator, and a plurality of first bonding pads. The semiconductor chip is divided into a first rectangle region, a second rectangle region, and a third rectangle region and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The plurality of first memory arrays are formed in the first rectangle region. The plurality of second memory arrays are formed in the second rectangle region. The voltage generator and the plurality of first bonding pads are arranged in the third rectangle region. The plurality of first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the plurality of second memory arrays.
摘要翻译: 形成在半导体芯片上的半导体存储器件包括多个第一存储器阵列,多个第二存储器阵列,第一电压发生器和多个第一焊盘。 半导体芯片被分成第一矩形区域,第二矩形区域和第三矩形区域,并且第三矩形区域被布置在第一矩形区域和第二矩形区域之间。 多个第一存储器阵列形成在第一矩形区域中。 多个第二存储器阵列形成在第二矩形区域中。 电压发生器和多个第一接合焊盘被布置在第三矩形区域中。 多个第一接合焊盘布置在第一矩形区域和电压发生器之间,并且在电压发生器和多个第二存储器阵列之间没有布置接合焊盘。
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68.
公开(公告)号:US20050160221A1
公开(公告)日:2005-07-21
申请号:US10812893
申请日:2004-03-31
申请人: Takashi Yamazaki , Kazuo Hakamata , Azuma Kano
发明人: Takashi Yamazaki , Kazuo Hakamata , Azuma Kano
CPC分类号: G06F3/0625 , G06F1/3221 , G06F1/3268 , G06F3/0634 , G06F3/0653 , G06F3/0659 , G06F3/0689 , G06F11/1662 , G06F11/2094 , G06F11/2097 , G11B19/00 , Y02D10/154 , Y02D50/20
摘要: Times at which requests for a data read or data write from/to a logical volume are received are stored in memory as access times of a RAID group making up the logical volume. When a predetermined time has elapsed after the access time, a number of the hard disk drives according to the redundancy of the RAID group are set to a power saving mode. Assume there are first hard disk drives and second hard disk drives having shorter lifes and the RAID group exceeds a predetermined time after the access time. When the RAID group consists of only the first drives, a number of the first drives according to the redundancy of the RAID group are set to a power saving mode and when it consists of only the second drives, an arbitrary number of second drives are set to a power saving mode.
摘要翻译: 接收来自/向逻辑卷的数据读取或数据写入的请求的时间作为构成逻辑卷的RAID组的访问时间被存储在存储器中。 当在访问时间之后经过预定时间时,根据RAID组的冗余将多个硬盘驱动器设置为省电模式。 假设有第一个硬盘驱动器和第二个硬盘驱动器具有较短的寿命,并且RAID组在访问时间之后超过预定时间。 当RAID组仅由第一个驱动器组成时,根据RAID组的冗余将多个第一个驱动器设置为省电模式,并且当仅由第二个驱动器组成时,将设置任意数量的第二个驱动器 进入省电模式。
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公开(公告)号:US06898130B2
公开(公告)日:2005-05-24
申请号:US10683260
申请日:2003-10-14
申请人: Kazuhiko Kajigaya , Kazuyuki Miyazawa , Manabu Tsunozaki , Kazuyoshi Oshima , Takashi Yamazaki , Yuji Sakai , Jiro Sawada , Yasunori Yamaguchi , Tetsurou Matsumoto , Shinji Udo , Hiroshi Yoshioka , Hirokazu Saito , Mitsuhiro Takano , Makoto Morino , Sinichi Miyatake , Eiji Miyamoto , Yasuhiro Kasama , Akira Endo , Ryoichi Hori , Jun Etoh , Masashi Horiguchi , Shinichi Ikenaga , Atsushi Kumata
发明人: Kazuhiko Kajigaya , Kazuyuki Miyazawa , Manabu Tsunozaki , Kazuyoshi Oshima , Takashi Yamazaki , Yuji Sakai , Jiro Sawada , Yasunori Yamaguchi , Tetsurou Matsumoto , Shinji Udo , Hiroshi Yoshioka , Hirokazu Saito , Mitsuhiro Takano , Makoto Morino , Sinichi Miyatake , Eiji Miyamoto , Yasuhiro Kasama , Akira Endo , Ryoichi Hori , Jun Etoh , Masashi Horiguchi , Shinichi Ikenaga , Atsushi Kumata
IPC分类号: G11C5/00 , G11C5/02 , G11C5/06 , G11C11/406 , H01L23/485 , G11C16/04
CPC分类号: H01L24/06 , G11C5/025 , G11C5/04 , G11C5/063 , G11C11/406 , G11C29/06 , G11C29/12005 , G11C29/12015 , G11C29/24 , G11C29/34 , G11C29/50 , G11C29/50012 , G11C29/70 , G11C29/80 , G11C29/804 , G11C29/832 , G11C29/844 , G11C2029/2602 , H01L24/05 , H01L24/45 , H01L24/48 , H01L27/0207 , H01L27/105 , H01L27/10897 , H01L27/11898 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/05624 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/73215 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01037 , H01L2924/01038 , H01L2924/01039 , H01L2924/01041 , H01L2924/01043 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01054 , H01L2924/01055 , H01L2924/01058 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01083 , H01L2924/01084 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要: A semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. This structure in which the peripheral circuits are arranged at the center portion of the chip permits the longest signal transition paths to be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.
摘要翻译: 一种半导体存储器件,其中外围电路布置在由纵向中心部分和横向中心部分组成的半导体芯片的交叉区域中,并且其中存储器阵列布置在由横截面划分的四个区域中。 其中外围电路布置在芯片的中心部分的这种结构允许将最长的信号转换路径缩短到芯片尺寸的大约一半,以加速旨在具有大存储容量的DRAM。
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公开(公告)号:US20050045321A1
公开(公告)日:2005-03-03
申请号:US10899224
申请日:2004-07-26
申请人: Takashi Yamazaki
发明人: Takashi Yamazaki
IPC分类号: B60H1/32 , F01P7/04 , F01P7/08 , B60H3/00 , B60H1/00 , B61D27/00 , F25B15/00 , F25B27/00 , F25B39/04
CPC分类号: B60H1/3208 , B60H2001/3248 , B60H2001/3266 , B60H2001/3277 , F01P7/048 , F01P7/08 , F01P2025/04 , F01P2025/66 , F01P2060/14
摘要: A controller of a cooling fan cools a radiator of a vehicle driving system cooling water and a condenser incorporated in a refrigeration cycle of a vehicle air conditioning system. When a high-pressure side refrigerant pressure of the refrigeration cycle is equal to or higher than a predetermined value, the controller drives the cooling fan irrespective of operation/non-operation state of the vehicle air conditioning system.
摘要翻译: 冷却风扇的控制器冷却车辆驱动系统冷却水的散热器和结合在车辆空调系统的制冷循环中的冷凝器。 当制冷循环的高压侧制冷剂压力等于或高于预定值时,控制器驱动冷却风扇,而与车辆空调系统的操作/非操作状态无关。
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