公开(公告)号：US4080477A

公开(公告)日：1978-03-21

申请号：US626299

申请日：1975-10-28

申请人： Haruo Tsumura ,  Yukio Hashimoto

发明人： Haruo Tsumura ,  Yukio Hashimoto

IPC分类号： A23C19/082 ,  A23C19/093 ,  A23C20/00 ,  A23C19/12 ,  A23L1/20

CPC分类号： A23C19/093 ,  A23C19/082 ,  A23C20/005

摘要： A processed cheese-like product containing soy cheese as a part of the major ingredient is made by adding both a casein-containing substance derived from animal milk and a cheese emulsifying melting salt to natural soy cheese and agitating this mixture under relatively high shearing conditions, while heating to an elevated temperature of less than about 85.degree. C, for a period sufficient to form the mixture into a softened, flowable consistency. After pasteurization, the melted or softened mixture is introduced into a suitable container and cooled to produce a processed cheese-like product having superior flavor and texture characteristics.

摘要翻译： 含有大豆乳酪作为主要成分的一部分的加工干酪样产品通过将来自动物乳的酪蛋白含量物质和乳酪乳化熔盐加入到天然大豆乳酪中并在相对高的剪切条件下搅拌该混合物来制备， 同时加热到低于约85℃的升高的温度，持续足以将混合物形成软化的可流动的稠度的时间。 在巴氏消毒之后，将熔融或软化的混合物引入合适的容器中并冷却以产生具有优异风味和质地特征的加工的乳酪样产品。

公开(公告)号：US3938316A

公开(公告)日：1976-02-17

申请号：US440240

申请日：1974-02-06

申请人： Shigeru Morokawa ,  Yukio Hashimoto ,  Yasuhiko Nishikubo

发明人： Shigeru Morokawa ,  Yukio Hashimoto ,  Yasuhiko Nishikubo

IPC分类号： G04F5/06 ,  H03L1/02 ,  G04C3/00

CPC分类号： G04F5/06 ,  H03L1/022 ,  H03L1/026

摘要： A temperature compensated electronic timepiece comprises a time reference signal generator for generating a time reference signal and a temperature compensating device for compensating a change of the oscillating frequency of the time reference signal generator caused by any external temperature change. The temperature compensating device comprises a temperature detector having an element composed of two semiconductors of different respective conductivities (such as a transistor composed of P and N type semiconductors) which are joined to form a junction, or an element composed of a conductor and a semiconductor joined to form a junction. The voltage-current characteristics of the junction are changed when the external temperature exceeds a given temperature to deliver a digital signal whose state is reversed from an initial condition. The output signal from the temperature detector compensates any temperature change of the oscillating frequency of the time reference signal generator.

摘要翻译： 温度补偿电子钟表包括用于产生时间参考信号的时间参考信号发生器和用于补偿由任何外部温度变化引起的时间参考信号发生器的振荡频率变化的温度补偿装置。 温度补偿装置包括温度检测器，该温度检测器具有由两个不同相应电导率的半导体（例如由P型和N型半导体组成的晶体管）组成的元件，该半导体被连接以形成结，或由导体和半导体构成的元件 加入形成交界处。 当外部温度超过给定温度时，结点的电压 - 电流特性发生变化，从而将其状态从初始状态反转。 来自温度检测器的输出信号补偿时间参考信号发生器的振荡频率的任何温度变化。

公开(公告)号：US08957520B2

公开(公告)日：2015-02-17

申请号：US13155552

申请日：2011-06-08

申请人： Hiroaki Sato ,  Yukio Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

发明人： Hiroaki Sato ,  Yukio Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40 ,  H01L21/56 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31

CPC分类号： H01L21/561 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： A microelectronic assembly may include a substrate containing a dielectric element having first and second opposed surfaces. The dielectric element may include a first dielectric layer adjacent the first surface, and a second dielectric layer disposed between the first dielectric layer and the second surface. A Young's modulus of the first dielectric layer may be at least 50% greater than the Young's modulus of the second dielectric layer, which is less than two gigapascal (GPa). A conductive structure may extend through the first and second dielectric layers and electrically connect substrate contacts at the first surface with terminals at the second surface. The substrate contacts may be joined with contacts of a microelectronic element through conductive masses, and a rigid underfill may be between the microelectronic element and the first surface. The terminals may be usable to bond the microelectronic assembly to contacts of a component external to the microelectronic assembly.

摘要翻译： 微电子组件可以包括含有具有第一和第二相对表面的电介质元件的衬底。 电介质元件可以包括与第一表面相邻的第一电介质层，以及设置在第一介电层和第二表面之间的第二电介质层。 第一电介质层的杨氏模量可以比第二电介质层的杨氏模量大至少50％，小于二千兆帕（GPa）。 导电结构可以延伸穿过第一和第二电介质层，并且将第一表面处的基板触点与第二表面上的端子电连接。 衬底触点可以通过导电块与微电子元件的触点接合，并且刚性底部填充可以在微电子元件和第一表面之间。 端子可以用于将微电子组件接合到微电子组件外部的部件的触点。

公开(公告)号：US08490265B2

公开(公告)日：2013-07-23

申请号：US12484448

申请日：2009-06-15

申请人： Yukio Hashimoto ,  Masayoshi Kojima ,  Katsunori Kinno ,  Mitsuru Sato

发明人： Yukio Hashimoto ,  Masayoshi Kojima ,  Katsunori Kinno ,  Mitsuru Sato

IPC分类号： B23Q17/00

CPC分类号： B23P19/084 ,  F16D65/0043 ,  F16D65/18 ,  F16D2121/02 ,  Y10T29/49771 ,  Y10T29/49776 ,  Y10T29/49863 ,  Y10T29/4987 ,  Y10T29/53657

摘要： A brake includes an annular boot which can be expanded and contracted according to movements of a piston and is assembled to an opening part of a cylinder and to an annular groove on an outer peripheral face of the piston. The boot is assembled by: engaging one end of the boot with the opening part of the cylinder in a state where the piston is contained in the cylinder; moving the piston so that at least a part of the piston is withdrawn from the cylinder and that the other end of the boot is pressed by a pressing face of the piston; and fitting the other end of the boot into the annular groove of the piston, while a movable range of the other end of the boot is restricted by an expanding allowance of the boot whose one end is engaged with the opening part of the cylinder.

摘要翻译： 制动器包括可根据活塞的运动而膨胀和收缩的环形护罩，并组装到气缸的开口部分和活塞的外周面上的环形槽。 靴子通过以下方式组装：在活塞被容纳在气缸中的状态下，将靴子的一端与气缸的开口部分接合; 移动所述活塞使得所述活塞的至少一部分从所述气缸中退出，并且所述护罩的另一端被所述活塞的按压面按压; 并且将靴子的另一端装配到活塞的环形槽中，同时，靴的另一端的可移动范围通过一端与缸的开口部接合的靴的扩张容限来限制。

公开(公告)号：US20120145442A1

公开(公告)日：2012-06-14

申请号：US12965192

申请日：2010-12-10

申请人： Debabrata Gupta ,  Yukio Hashimoto ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Rajesh Katkar

发明人： Debabrata Gupta ,  Yukio Hashimoto ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Rajesh Katkar

IPC分类号： H05K1/18 ,  H05K1/11

CPC分类号： H01L24/14 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/528 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13647 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly includes a first surface and a first thin conductive element exposed at the first surface and having a face comprising first and second regions. A first conductive projection having a base connected to and covering the first region of the face extends to an end remote from the base. A first dielectric material layer covers the second region of the first thin element and contacts at least the base of the first conductive projection. The assembly further includes a second substrate having a second face and a second conductive projection extending away from the second face. A first fusible metal mass connects the first projection to the second projection and extends along an edge of the first projection towards the first dielectric material layer.

摘要翻译： 微电子组件包括第一表面和暴露在第一表面处并具有包括第一和第二区域的面的第一薄导电元件。 具有连接到并覆盖面的第一区域的基部的第一导电突起延伸到远离基部的一端。 第一介电材料层覆盖第一薄元件的第二区域并且至少与第一导电突起的基部接触。 组件还包括具有第二面的第二衬底和远离第二面延伸的第二导电突起。 第一可熔金属块将第一突起连接到第二突起并沿着第一突起的边缘朝着第一介电材料层延伸。

公开(公告)号：US20110057324A1

公开(公告)日：2011-03-10

申请号：US12941511

申请日：2010-11-08

申请人： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

发明人： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

IPC分类号： H01L23/522

CPC分类号： H05K3/4038 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/06 ,  H05K3/20 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4647 ,  H05K3/4658 ,  H05K2201/0379 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An interconnect element is provided. A monolithic dielectric element has a first exposed major surface, a plurality of first recesses extending inwardly from the first major surface, and a second exposed major surface remote from the first major surface, a plurality of second recesses extending inwardly from the second major surface. A plurality of first metal interconnect patterns are embedded in the plurality of first recesses and extend in one or more directions along the first major surface. A plurality of second metal interconnect patterns are embedded in the plurality of second recesses and extend in one or more directions along the second major surface. A plurality of non-hollow metal posts extend through the dielectric element between at least some of the plurality of first metal interconnect patterns and at least some of the plurality of second metal interconnect patterns.

摘要翻译： 提供互连元件。 单片电介质元件具有第一暴露的主表面，从第一主表面向内延伸的多个第一凹槽和远离第一主表面的第二暴露的主表面，从第二主表面向内延伸的多个第二凹槽。 多个第一金属互连图案被嵌入在多个第一凹部中并沿着第一主表面沿一个或多个方向延伸。 多个第二金属互连图案被嵌入在多个第二凹部中并沿着第二主表面沿一个或多个方向延伸。 多个非中空金属柱在多个第一金属互连图案中的至少一些和多个第二金属互连图案中的至少一些之间延伸穿过介质元件。

公开(公告)号：US07407708B2

公开(公告)日：2008-08-05

申请号：US10489453

申请日：2002-09-18

申请人： Mutsuhiro Amari ,  Yukio Hashimoto ,  Tsutomu Ogawa

发明人： Mutsuhiro Amari ,  Yukio Hashimoto ,  Tsutomu Ogawa

IPC分类号： B32B27/08 ,  B32B27/28 ,  B32B37/12

CPC分类号： B32B27/08 ,  B32B27/28 ,  B32B27/281 ,  B32B27/285 ,  B32B27/322 ,  B32B2250/40 ,  B32B2307/54 ,  B32B2307/552 ,  B32B2309/62 ,  B32B2327/18 ,  B32B2379/08 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31721 ,  Y10T428/31909

摘要： A chemically resistant, extractable free, composite laminar film including polyimide, PFA and m-PTFE layers.

摘要翻译： 一种耐化学腐蚀，无萃取的复合层状膜，包括聚酰亚胺，PFA和m-PTFE层。

公开(公告)号：US20080136041A1

公开(公告)日：2008-06-12

申请号：US11805300

申请日：2007-05-23

申请人： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

发明人： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H05K3/4038 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/06 ,  H05K3/20 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4647 ,  H05K3/4658 ,  H05K2201/0379 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An interconnect element is provided which includes a dielectric element having a major surface. Metal interconnect patterns are embedded in recesses which extend inwardly from the major surface, the outer surfaces of the interconnect patterns being substantially co-planar with the major surface and extending in one or more directions of the major surface. A projecting conductive film extends over the major surface in at least one direction parallel to a plane defined by the major surface such that it contacts the dielectric element along at least a portion of the major surface and conductively contacts an outer surface of at least one of the metal interconnect patterns.

摘要翻译： 提供一种互连元件，其包括具有主表面的电介质元件。 金属互连图案嵌入从主表面向内延伸的凹槽中，互连图案的外表面与主表面基本共面并且在主表面的一个或多个方向上延伸。 突出的导电膜在平行于由主表面限定的平面的至少一个方向上在主表面上延伸，使得其沿着主表面的至少一部分接触电介质元件，并且导电地接触至少一个的外表面 金属互连图案。

公开(公告)号：US07210969B1

公开(公告)日：2007-05-01

申请号：US11511445

申请日：2006-08-29

申请人： Yukio Hashimoto ,  Seiki Miura ,  Takumi Nishimoto ,  Takashi Tomago

发明人： Yukio Hashimoto ,  Seiki Miura ,  Takumi Nishimoto ,  Takashi Tomago

IPC分类号： H01R13/42

CPC分类号： H01R12/585 ,  H05K3/308 ,  H05K2201/1059 ,  H05K2201/10765 ,  H05K2201/10856

摘要： A press-fit fixing terminal is mountable to a wiring board by being inserted into a through-hole of the wiring board, and includes a flat plate section and a resilient contacting section. The flat plate section is made of metal thin plate and double-backed such that an end of the flat plate section is placed on a root side and a bent point works as an insertion tip when the terminal is inserted into the through-hole. The resilient contacting sections sandwich the double-backed portion of the flat plate section such that they are placed symmetrically with respect to the double-backed portion and both of the ridges of the resilient contacting section face outward viewed from the double-backed portion, so that each one of the resilient contacting sections forms a V-shape including an obtuse angle.

摘要翻译： 压入固定端子通过插入到布线板的通孔中而安装到布线板，并且包括平板部分和弹性接触部分。 平板部分由金属薄板制成，并且当端子插入到通孔中时，平板部分的端部被放置在根部侧上，并且弯曲点用作插入尖端。 弹性接触部分夹着平板部分的双重部分，使得它们相对于双背部分对称地放置，并且弹性接触部分的两个脊部从双背部分向外看，因此 每个弹性接触部分形成包括钝角的V形。

公开(公告)号：US20050218068A1

公开(公告)日：2005-10-06

申请号：US10505418

申请日：2003-02-27

申请人： Makoto Komatsu ,  Kunio Fujiwara ,  Kazuyoshi Takeda ,  Yukio Hashimoto ,  Eriko Usui ,  Mutsuhiro Amari

发明人： Makoto Komatsu ,  Kunio Fujiwara ,  Kazuyoshi Takeda ,  Yukio Hashimoto ,  Eriko Usui ,  Mutsuhiro Amari

IPC分类号： B01J47/12 ,  B01D71/06

CPC分类号： B01J47/12

摘要： The present invention has an object to provide a filter cartridge for purifying a chemical which can efficiently remove metal ions and impurities in the form of fine particles in a liquid to be filtered. The present invention provides, as the means to achieve the above described object, a filter cartridge comprising a fiber membrane material obtained by introducing ion exchange groups and/or chelate groups into an organic polymer fiber membrane base material having an average fiber diameter of 0.1 μm to 20 μm and an average pore size of 1 μm to 20 μm or a filter cartridge. And also present invention provides, as the means to achieve the above described object, comprising a bi-layered or laminated structure of filter membranes prepared from fiber membrane material obtained by introducing ion exchange groups and/or chelate groups into an organic polymer fiber membrane base material and a micro porous membrane material.

摘要翻译： 本发明的目的是提供一种用于净化化学品的滤筒，其可以有效地去除待过滤液体中的细颗粒形式的金属离子和杂质。 作为实现上述目的的手段，本发明提供一种滤芯，其包括通过将离子交换基团和/或螯合基团导入到平均纤维直径为0.1μm的有机聚合物纤维膜基材中而获得的纤维膜材料 至20μm，平均孔径为1〜20μm，或滤筒。 本发明还提供了作为实现上述目的的手段，其包括由将离子交换基团和/或螯合基团引入到有机聚合物纤维膜基材中而获得的纤维膜材料制成的过滤膜的双层或层压结构 材料和微孔膜材料。