公开(公告)号：US08957520B2

公开(公告)日：2015-02-17

申请号：US13155552

申请日：2011-06-08

申请人： Hiroaki Sato ,  Yukio Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

发明人： Hiroaki Sato ,  Yukio Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40 ,  H01L21/56 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31

CPC分类号： H01L21/561 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： A microelectronic assembly may include a substrate containing a dielectric element having first and second opposed surfaces. The dielectric element may include a first dielectric layer adjacent the first surface, and a second dielectric layer disposed between the first dielectric layer and the second surface. A Young's modulus of the first dielectric layer may be at least 50% greater than the Young's modulus of the second dielectric layer, which is less than two gigapascal (GPa). A conductive structure may extend through the first and second dielectric layers and electrically connect substrate contacts at the first surface with terminals at the second surface. The substrate contacts may be joined with contacts of a microelectronic element through conductive masses, and a rigid underfill may be between the microelectronic element and the first surface. The terminals may be usable to bond the microelectronic assembly to contacts of a component external to the microelectronic assembly.

摘要翻译： 微电子组件可以包括含有具有第一和第二相对表面的电介质元件的衬底。 电介质元件可以包括与第一表面相邻的第一电介质层，以及设置在第一介电层和第二表面之间的第二电介质层。 第一电介质层的杨氏模量可以比第二电介质层的杨氏模量大至少50％，小于二千兆帕（GPa）。 导电结构可以延伸穿过第一和第二电介质层，并且将第一表面处的基板触点与第二表面上的端子电连接。 衬底触点可以通过导电块与微电子元件的触点接合，并且刚性底部填充可以在微电子元件和第一表面之间。 端子可以用于将微电子组件接合到微电子组件外部的部件的触点。

公开(公告)号：US20120313238A1

公开(公告)日：2012-12-13

申请号：US13155552

申请日：2011-06-08

申请人： Hiroaki Sato ,  Yukio Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

发明人： Hiroaki Sato ,  Yukio Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

IPC分类号： H01L23/498 ,  H01L21/56

CPC分类号： H01L21/561 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： A microelectronic assembly may include a substrate containing a dielectric element having first and second opposed surfaces. The dielectric element may include a first dielectric layer adjacent the first surface, and a second dielectric layer disposed between the first dielectric layer and the second surface. A Young's modulus of the first dielectric layer may be at least 50% greater than the Young's modulus of the second dielectric layer, which is less than two gigapascal (GPa). A conductive structure may extend through the first and second dielectric layers and electrically connect substrate contacts at the first surface with terminals at the second surface. The substrate contacts may be joined with contacts of a microelectronic element through conductive masses, and a rigid underfill may be between the microelectronic element and the first surface. The terminals may be usable to bond the microelectronic assembly to contacts of a component external to the microelectronic assembly.

摘要翻译： 微电子组件可以包括含有具有第一和第二相对表面的电介质元件的衬底。 电介质元件可以包括与第一表面相邻的第一电介质层，以及设置在第一介电层和第二表面之间的第二电介质层。 第一电介质层的杨氏模量可以比第二电介质层的杨氏模量大至少50％，小于二千兆帕（GPa）。 导电结构可以延伸穿过第一和第二电介质层，并且将第一表面处的基板触点与第二表面上的端子电连接。 衬底触点可以通过导电块与微电子元件的触点接合，并且刚性底部填充可以在微电子元件和第一表面之间。 端子可以用于将微电子组件接合到微电子组件外部的部件的触点。

公开(公告)号：US20120286416A1

公开(公告)日：2012-11-15

申请号：US13105325

申请日：2011-05-11

申请人： Hiroaki Sato ,  Yukio Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

发明人： Hiroaki Sato ,  Yukio Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L24/97 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/561 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81444 ,  H01L2224/81455 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

摘要： A microelectronic assembly may include a microelectronic element having a plurality of element contacts at a face thereof, and a compliant dielectric element having a Young's modulus of less than about two gigapascal (GPa) and substrate contacts at a first surface joined to the element contacts. The substrate contacts may be electrically connected with terminals at a second surface of the compliant dielectric element that opposes the first surface, through conductive vias in the compliant dielectric element. A rigid underfill may be between the face of the microelectronic element and the first surface of the compliant dielectric element. The terminals may be usable for bonding the microelectronic assembly to corresponding contacts of a component external to the microelectronic assembly.

摘要翻译： 微电子组件可以包括在其表面具有多个元件触点的微电子元件，以及在与元件触点连接的第一表面处具有小于约二千兆帕（GPa）的杨氏模量和柔性介电元件以及在第一表面处的衬底触点。 衬底触点可以通过柔性介电元件中的导电通孔与柔性介电元件的与第一表面相对的第二表面的端子电连接。 刚性底部填充物可以位于微电子元件的表面和顺应介电元件的第一表面之间。 端子可用于将微电子组件接合到微电子组件外部的部件的相应触点。

公开(公告)号：US08525338B2

公开(公告)日：2013-09-03

申请号：US13154778

申请日：2011-06-07

申请人： Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

发明人： Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/00

CPC分类号： H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49517 ,  H01L23/49816 ,  H01L24/24 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package and method of making same are provided. The package includes a substrate having first and second opposed surfaces, an edge surface extending therebetween, a plurality of terminals, and a plurality of conductive elements electrically connected with the terminals. The edge surface can be disposed at a periphery of the substrate or can be the edge surface of an aperture within the substrate. A microelectronic element has a front face and contacts thereon, with at least some of the contacts being adjacent to the edge surface of the substrate. A dielectric material overlies the edge surface of the substrate and defines a sloping surface between the front face of the microelectronic element and the substrate. A conductive matrix material defines a plurality of conductive interconnects extending along the sloping surface. The conductive interconnects electrically interconnect respective ones of the contacts with the conductive elements.

摘要翻译： 提供微电子封装及其制造方法。 封装包括具有第一和第二相对表面的基板，在其间延伸的边缘表面，多个端子以及与端子电连接的多个导电元件。 边缘表面可以设置在基底的周边，或者可以是基底内的孔的边缘表面。 微电子元件具有正面并在其上接触，其中至少一些触点与衬底的边缘表面相邻。 电介质材料覆盖在衬底的边缘表面上，并且在微电子元件的前表面和衬底之间限定一倾斜表面。 导电基体材料限定沿着倾斜表面延伸的多个导电互连。 导电互连将导电元件的各个触点电连接。

公开(公告)号：US08890304B2

公开(公告)日：2014-11-18

申请号：US13155719

申请日：2011-06-08

申请人： Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

发明人： Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

IPC分类号： H01L23/04 ,  H01L23/00 ,  H01L23/498 ,  H01L23/13 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L24/83 ,  H01L21/561 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/02 ,  H01L24/03 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/0231 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24225 ,  H01L2224/245 ,  H01L2224/29008 ,  H01L2224/32225 ,  H01L2224/73217 ,  H01L2224/76155 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82103 ,  H01L2224/82104 ,  H01L2224/8284 ,  H01L2224/83053 ,  H01L2224/8309 ,  H01L2224/83091 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic package includes a microelectronic unit and a substrate. The microelectronic unit includes a microelectronic element having contacts on a front face. A dielectric material has a first surface substantially flush with the front face of the microelectronic element. Conductive traces have at least portions extending along the front face away from the contacts, at least some of which also extend along the first surface of the dielectric material. Contacts are connected with the traces, at least some of which are disposed at the first surface of the dielectric material. The substrate has first and second opposed surfaces and an edge extending therebetween, the first surface facing the front face of the microelectronic unit, and the second surface having a plurality of terminals thereon configured for electrical connection with at least one external component. Masses of conductive matrix material join the terminals with the redistribution contacts.

摘要翻译： 微电子封装包括微电子单元和衬底。 微电子单元包括具有在正面上的触点的微电子元件。 电介质材料具有与微电子元件的前表面基本齐平的第一表面。 导电迹线具有至少部分，其沿前表面延伸远离触点，其中至少一些部分还沿电介质材料的第一表面延伸。 触头与迹线连接，其中至少一些设置在电介质材料的第一表面。 衬底具有第一和第二相对表面和在其间延伸的边缘，第一表面面向微电子单元的前表面，并且第二表面具有多个端子，其构造成用于与至少一个外部部件电连接。 导电基体材料的质量与再分布接触端子连接。

公开(公告)号：US20120313253A1

公开(公告)日：2012-12-13

申请号：US13155719

申请日：2011-06-08

申请人： Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg ,  Hiroaki Sato ,  Kiyoaki Hashimoto

发明人： Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg ,  Hiroaki Sato ,  Kiyoaki Hashimoto

IPC分类号： H01L23/522 ,  H01L21/50

CPC分类号： H01L24/83 ,  H01L21/561 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/02 ,  H01L24/03 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/0231 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24225 ,  H01L2224/245 ,  H01L2224/29008 ,  H01L2224/32225 ,  H01L2224/73217 ,  H01L2224/76155 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82103 ,  H01L2224/82104 ,  H01L2224/8284 ,  H01L2224/83053 ,  H01L2224/8309 ,  H01L2224/83091 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic package includes a microelectronic unit and a substrate. The microelectronic unit includes a microelectronic element having contacts on a front face. A dielectric material has a first surface substantially flush with the front face of the microelectronic element. Conductive traces have at least portions extending along the front face away from the contacts, at least some of which also extend along the first surface of the dielectric material. Contacts are connected with the traces, at least some of which are disposed at the first surface of the dielectric material. The substrate has first and second opposed surfaces and an edge extending therebetween, the first surface facing the front face of the microelectronic unit, and the second surface having a plurality of terminals thereon configured for electrical connection with at least one external component. Masses of conductive matrix material join the terminals with the redistribution contacts.

摘要翻译： 微电子封装包括微电子单元和衬底。 微电子单元包括具有在正面上的触点的微电子元件。 电介质材料具有与微电子元件的前表面基本齐平的第一表面。 导电迹线具有沿着前表面远离触点延伸的至少部分，其中至少一些部分还沿电介质材料的第一表面延伸。 触头与迹线连接，其中至少一些设置在电介质材料的第一表面。 衬底具有第一和第二相对表面和在其间延伸的边缘，第一表面面向微电子单元的前表面，并且第二表面具有多个端子，其构造成用于与至少一个外部部件电连接。 导电基体材料的质量与再分布接触端子连接。

公开(公告)号：US20120155055A1

公开(公告)日：2012-06-21

申请号：US13157722

申请日：2011-06-10

申请人： Teck-Gyu Kang ,  Wei-Shun Wang ,  Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

发明人： Teck-Gyu Kang ,  Wei-Shun Wang ,  Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

IPC分类号： H05K7/00 ,  H05K3/36 ,  H05K3/32

CPC分类号： H01L24/81 ,  B23K1/0016 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/8138 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/831 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/113 ,  H05K3/341 ,  H05K3/4007 ,  H05K2201/0195 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.

摘要翻译： 微电子组件可以包括包括具有导电元件的刚性介电层的基板，具有在其表面暴露的多个触点的微电子元件以及延伸穿过刚性介电层上的柔性介电层的导电通孔。 通孔将基板触点分别电连接到导电元件，并且基板触点分别连接到微电子元件的触点。 通孔，柔性层和衬底触点适于明显地减轻与组件的差分热接触和膨胀相关联的衬底触点处的应力。

公开(公告)号：US09137903B2

公开(公告)日：2015-09-15

申请号：US13157722

申请日：2011-06-10

申请人： Teck-Gyu Kang ,  Wei-Shun Wang ,  Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

发明人： Teck-Gyu Kang ,  Wei-Shun Wang ,  Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

IPC分类号： H05K1/11 ,  H05K3/40 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L24/81 ,  B23K1/0016 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/8138 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/831 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/113 ,  H05K3/341 ,  H05K3/4007 ,  H05K2201/0195 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.

摘要翻译： 微电子组件可以包括包括具有导电元件的刚性介电层的基板，具有在其表面暴露的多个触点的微电子元件以及延伸穿过刚性介电层上的柔性介电层的导电通孔。 通孔将基板触点分别电连接到导电元件，并且基板触点分别连接到微电子元件的触点。 通孔，柔性层和衬底触点适于明显地减轻与组件的差分热接触和膨胀相关联的衬底触点处的应力。

公开(公告)号：US20120313264A1

公开(公告)日：2012-12-13

申请号：US13154778

申请日：2011-06-07

申请人： Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

发明人： Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49517 ,  H01L23/49816 ,  H01L24/24 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package and method of making same are provided. The package includes a substrate having first and second opposed surfaces, an edge surface extending therebetween, a plurality of terminals, and a plurality of conductive elements electrically connected with the terminals. The edge surface can be disposed at a periphery of the substrate or can be the edge surface of an aperture within the substrate. A microelectronic element has a front face and contacts thereon, with at least some of the contacts being adjacent to the edge surface of the substrate. A dielectric material overlies the edge surface of the substrate and defines a sloping surface between the front face of the microelectronic element and the substrate. A conductive matrix material defines a plurality of conductive interconnects extending along the sloping surface. The conductive interconnects electrically interconnect respective ones of the contacts with the conductive elements.

摘要翻译： 提供微电子封装及其制造方法。 封装包括具有第一和第二相对表面的基板，在其间延伸的边缘表面，多个端子以及与端子电连接的多个导电元件。 边缘表面可以设置在基底的周边，或者可以是基底内的孔的边缘表面。 微电子元件具有正面并在其上接触，其中至少一些触点与衬底的边缘表面相邻。 电介质材料覆盖在衬底的边缘表面上，并且在微电子元件的前表面和衬底之间限定一倾斜表面。 导电基体材料限定沿着倾斜表面延伸的多个导电互连。 导电互连将导电元件的各个触点电连接。

公开(公告)号：US08618659B2

公开(公告)日：2013-12-31

申请号：US13462158

申请日：2012-05-02

申请人： Hiroaki Sato ,  Teck-Gyu Kang ,  Belgacem Haba ,  Philip R. Osborn ,  Wei-Shun Wang ,  Ellis Chau ,  Ilyas Mohammed ,  Norihito Masuda ,  Kazuo Sakuma ,  Kiyoaki Hashimoto ,  Kurosawa Inetaro ,  Tomoyuki Kikuchi

发明人： Hiroaki Sato ,  Teck-Gyu Kang ,  Belgacem Haba ,  Philip R. Osborn ,  Wei-Shun Wang ,  Ellis Chau ,  Ilyas Mohammed ,  Norihito Masuda ,  Kazuo Sakuma ,  Kiyoaki Hashimoto ,  Kurosawa Inetaro ,  Tomoyuki Kikuchi

IPC分类号： H01L23/48

CPC分类号： H01L21/4885 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49517 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.

摘要翻译： 微电子组件包括具有第一表面和远离第一表面的第二表面的衬底。 微电子元件覆盖在第一表面上，并且第一导电元件暴露在第一表面和第二表面中的一个处。 一些第一导电元件电连接到微电子元件。 线接合具有连接到远离基板和基座的导电元件和端表面的基部，每个引线接合限定在基部和端表面之间延伸的边缘表面。 封装层从第一表面延伸并填充引线键合之间的空间，使得引线键合被封装层分离。 引线键合的未封装的部分由未被封装层覆盖的引线接合端表面的至少部分限定。