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    POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE
    61.
    发明申请
    POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE 有权

    公开(公告)号：US20110186897A1

    公开(公告)日：2011-08-04

    申请号：US13023273

    申请日：2011-02-08

    申请人： Ban P. Loh

    发明人： Ban P. Loh

    IPC分类号： H01L33/60

    CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L33/641 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

    摘要： A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad, and includes a reflective surface to direct light from the LED in a desired direction. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).

    Tile for Solid State Lighting
    62.
    发明申请
    Tile for Solid State Lighting 有权
    固态照明瓷砖

    公开(公告)号：US20090219714A1

    公开(公告)日：2009-09-03

    申请号：US12093698

    申请日：2006-11-17

    申请人： Gerald H. Negley ,  Paul E. Sims ,  Ban P. Loh

    发明人： Gerald H. Negley ,  Paul E. Sims ,  Ban P. Loh

    IPC分类号： F21V9/00 ,  F21S4/00

    CPC分类号： H05B33/0803 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133613 ,  G09F9/35 ,  H01L2224/49175 ,  H01L2224/8592 ,  H05B33/0821 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0058 ,  Y10S362/80

    摘要： A solid state lighting tile (10) includes a substrate having a planar surface. A first plurality of solid state light emitting devices (LEDs) are on the substrate. The first plurality of LEDs (19) are connected in series to form a first string of LEDs of a first color having an anode contact (22) at a first end of the tile and a cathode contact (24) at a second end of the tile. A second plurality of LEDs are on the substrate. The second plurality of LEDs (21) are connected in series to form a second string of LEDs of the first color having a cathode contact (28) at the first end of the tile and an anode contact (26) at the second end of the tile.

    摘要翻译： 固态照明瓦（10）包括具有平坦表面的基板。 第一多个固态发光器件（LED）在衬底上。 第一组多个LED（19）串联连接以形成第一颜色的第一串LED，在第一端具有阳极触点（22），在第二端的第二端处形成阴极触点（24） 瓦。 第二多个LED在基板上。 所述第二多个LED（21）串联连接以形成所述第一颜色的第二串LED，所述第二颜色的LED在所述瓦片的第一端处具有阴极触点（28），并且在所述第二颜色的第二端处具有阳极触点（26） 瓦。

    Textured encapsulant surface in LED packages
    63.
    发明申请
    Textured encapsulant surface in LED packages 有权
    LED封装中纹理密封面

    公开(公告)号：US20090152573A1

    公开(公告)日：2009-06-18

    申请号：US12002429

    申请日：2007-12-14

    申请人： Ban P. Loh ,  Chenhua You ,  Bernd Keller ,  Nathaniel O. Cannon ,  Mitch Jackson ,  Ernest W. Combs

    发明人： Ban P. Loh ,  Chenhua You ,  Bernd Keller ,  Nathaniel O. Cannon ,  Mitch Jackson ,  Ernest W. Combs

    IPC分类号： H01L33/00 ,  H01L21/56

    CPC分类号： H01L33/54 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

    摘要： A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.

    摘要翻译： 一种封装的LED器件，其具有纹理化的密封剂，其与其上设置有至少一个LED芯片的安装表面保持一致。 可以在包装之前或期间将可以使用添加剂或减色过程进行纹理化的纹理密封剂施加到LED。 密封剂包括至少一个纹理表面，光从该表面发射。 纹理表面有助于减少密封剂内的全内反射，提高输出分布的提取效率和色温均匀性。 几个芯片可以安装在单个纹理密封剂下面。 可以使用具有不规则表面的模具同时在许多LED上形成多个密封剂。

    Thermocompression molding of plastic optical elements
    64.
    发明申请
    Thermocompression molding of plastic optical elements 有权
    塑料光学元件的热压成型

    公开(公告)号：US20070273058A1

    公开(公告)日：2007-11-29

    申请号：US11440166

    申请日：2006-05-24

    申请人： Ban P. Loh ,  Nicholas W. Medendorp

    发明人： Ban P. Loh ,  Nicholas W. Medendorp

    IPC分类号： B29D11/00

    CPC分类号： B29D11/00432 ,  B29C33/0022 ,  B29C43/021 ,  B29C43/184 ,  B29C2043/5076 ,  B29K2105/0002 ,  B29L2011/0016

    摘要： Method of forming a plastic element include dispensing a quantity of a liquid precursor material into a first die mold, positioning a carrier tape on the first die mold above the dispensed liquid precursor material, bringing a second die mold into contact with the carrier tape and the first die mold, and applying pressure to the first die mold and the second die mold. The liquid precursor material may include a liquid silicone.

    摘要翻译： 形成塑料元件的方法包括将一定量的液体前体材料分配到第一模具模具中，将载带定位在分配的液体前体材料上方的第一模具模具上，使第二模具模具与载带接触，并且 第一模具，并向第一模具模具和第二模具模具施加压力。 液体前体材料可以包括液体硅酮。

    LED light device with improved thermal and optical characteristics
    65.
    发明授权
    LED light device with improved thermal and optical characteristics 有权
    LED灯具具有改善的热和光学特性

    公开(公告)号：US09453617B2

    公开(公告)日：2016-09-27

    申请号：US13163437

    申请日：2011-06-17

    申请人： Ban P. Loh

    发明人： Ban P. Loh

    IPC分类号： F21V29/00 ,  F21K99/00 ,  F21V3/00 ,  F21Y101/02

    CPC分类号： F21K9/233 ,  F21K9/232 ,  F21K9/60 ,  F21V3/00 ,  F21V29/00 ,  F21Y2101/00 ,  F21Y2115/10

    摘要： A lighting device such as a light bulb is disclosed. The lighting device includes an optical sub-assembly adapted to generate light when electrically excited; a body sub-assembly thermally coupled to the optical sub-assembly to draw heat away from the optical sub-assembly and to dissipate it; an electrical sub-assembly electrically connecting the optical sub-assembly to the body sub-assembly; and a final assembly covering at least a portion of the optical sub-assembly.

    摘要翻译： 公开了诸如灯泡的照明装置。 照明装置包括适于在电激励时产生光的光学子组件; 热耦合到光学子组件的主体子组件以将热量从光学子组件吸走并使其散开; 将所述光学子组件电连接到所述主体子组件的电子组件; 以及覆盖光学子组件的至少一部分的最终组件。

    Power surface mount light emitting die package
    67.
    发明授权
    Power surface mount light emitting die package 有权
    功率表面贴装发光管芯封装

    公开(公告)号：US08622582B2

    公开(公告)日：2014-01-07

    申请号：US13023273

    申请日：2011-02-08

    申请人： Ban P. Loh

    发明人： Ban P. Loh

    IPC分类号： F21V29/00

    CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L33/641 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

    摘要： A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad, and includes a reflective surface to direct light from the LED in a desired direction. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).

    摘要翻译： 发光管芯封装包括基板，反射板和透镜。 衬底具有用于将外部电源连接到安装衬垫上的发光二极管（LED）的迹线。 反射板耦合到基板并且基本上围绕安装焊盘，并且包括反射表面以在期望的方向上引导来自LED的光。 透镜相对于反射板自由移动，并且能够被润湿并粘附到其上的密封剂升高或降低，并且被放置在距离LED芯片最佳距离处。 在操作期间由LED产生的热量通过基板（作为底部散热器）和反射板（作为顶部散热器）两者而被从LED引出。

    LED backlighting for displays
    68.
    发明授权
    LED backlighting for displays 有权
    LED背光用于显示器

    公开(公告)号：US08308331B2

    公开(公告)日：2012-11-13

    申请号：US13175600

    申请日：2011-07-01

    申请人： Ban P. Loh

    发明人： Ban P. Loh

    IPC分类号： F21V7/04

    CPC分类号： G02F1/133603 ,  G02F1/133606 ,  G02F2001/133628 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A display system including a display panel having a first major surface and a second major surface and a lighting system adapted to provide uniform luminance proximal to the display panel is disclosed. The lighting system includes an illuminating substrate having a first major surface with reflective coating and a second major surface. The illuminating substrate defines an array of mounting holes, each hole occupied by an LED module. An array of light emitting diode (LED) modules are affixed to the illuminating substrate, each module including at least one light emitting diode adapted to emit light. The lighting system can also include a diffusant layer which can be optically coupled to the illuminating substrate by soft optical gel and is placed close to or made to contact the display panel. The optical gel may contain phosphors or other optical substance for added optical performance to the lighting system. The diffusant layer has beveled edges at critical angle of refraction or coated with reflective material to minimize light loss at its edges. Each of the LED modules includes at least one LED chip, conductive traces connected to the LED chip and a heat sink.

    摘要翻译： 公开了一种显示系统，包括具有第一主表面和第二主表面的显示面板和适于在显示面板附近提供均匀亮度的照明系统。 照明系统包括具有带有反射涂层的第一主表面和第二主表面的照明基板。 照明基板限定一组安装孔，每个孔由LED模块占据。 一组发光二极管（LED）模块固定到照明基板上，每个模块包括适于发光的至少一个发光二极管。 照明系统还可以包括扩散层，其可以通过柔性光学凝胶光学耦合到照明基底并且靠近显示面板或与显示面板接触。 光学凝胶可以含有荧光体或其它用于向照明系统增加光学性能的光学物质。 扩散层在临界折射角处具有倾斜边缘，或涂覆有反射材料，以最小化其边缘处的光损失。 每个LED模块包括至少一个LED芯片，连接到LED芯片的导电迹线和散热器。