公开(公告)号：US07615405B2

公开(公告)日：2009-11-10

申请号：US11872331

申请日：2007-10-15

申请人： Paul Stephen Andry ,  Leena Paivikki Buchwalter ,  Raymond R. Horton ,  John Ulrich Knickerbocker ,  Cornelia K. Tsang ,  Steven Lorenz Wright

发明人： Paul Stephen Andry ,  Leena Paivikki Buchwalter ,  Raymond R. Horton ,  John Ulrich Knickerbocker ,  Cornelia K. Tsang ,  Steven Lorenz Wright

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L24/81 ,  H01L23/544 ,  H01L24/48 ,  H01L24/97 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/81001 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/20109 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic dive and method of fabricating an electronic device. The method including placing a placement guide over a top surface of a module substrate, the placement guide having a guide opening, the guide opening extending from a top surface of the placement guide to a bottom surface of the placement guide; aligning the placement guide to an integrated circuit chip position on the module substrate; fixing the placement guide to the module substrate; placing an integrated circuit chip in the guide opening, sidewalls of the placement guide opening constraining electrically conductive bonding structures on bottom surface of the integrated circuit chip to self-align to an electrically conductive module substrate contact pad on the top surface of the module substrate in the integrated circuit chip position; and bonding the bonding structures to the module substrate contact pads, the bonding structures and the module substrate contact pads in direct physical and electrical contact after the bonding.

摘要翻译： 一种电子潜水及其制造方法。 所述方法包括将放置引导件放置在模块基板的顶表面上，所述放置引导件具有引导开口，所述引导开口从所述放置引导件的顶表面延伸到所述放置引导件的底表面; 将所述放置引导件对准所述模块基板上的集成电路芯片位置; 将所述放置引导件固定到所述模块基板; 将集成电路芯片放置在引导开口中，放置引导开口的侧壁约束集成电路芯片的底表面上的导电接合结构，以与模块基板的顶表面上的导电模块衬底接触焊盘自对准 集成电路芯片位置; 以及在接合之后将结合结构粘合到模块衬底接触焊盘，接合结构和模块衬底接触焊盘，直接物理和电接触。

公开(公告)号：US20080182362A1

公开(公告)日：2008-07-31

申请号：US11872331

申请日：2007-10-15

申请人： Paul Stephen Andry ,  Leena Paivikki Buchwalter ,  Raymond R. Horton ,  John Ulrich Knickerbocker ,  Cornelia K. Tsang ,  Steven Lorenz Wright

发明人： Paul Stephen Andry ,  Leena Paivikki Buchwalter ,  Raymond R. Horton ,  John Ulrich Knickerbocker ,  Cornelia K. Tsang ,  Steven Lorenz Wright

IPC分类号： H01L21/00

CPC分类号： H01L24/81 ,  H01L23/544 ,  H01L24/48 ,  H01L24/97 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/81001 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/20109 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic dive and method of fabricating an electronic device. The method including placing a placement guide over a top surface of a module substrate, the placement guide having a guide opening, the guide opening extending from a top surface of the placement guide to a bottom surface of the placement guide; aligning the placement guide to an integrated circuit chip position on the module substrate; fixing the placement guide to the module substrate; placing an integrated circuit chip in the guide opening, sidewalls of the placement guide opening constraining electrically conductive bonding structures on bottom surface of the integrated circuit chip to self-align to an electrically conductive module substrate contact pad on the top surface of the module substrate in the integrated circuit chip position; and bonding the bonding structures to the module substrate contact pads, the bonding structures and the module substrate contact pads in direct physical and electrical contact after the bonding.

摘要翻译： 一种电子潜水及其制造方法。 所述方法包括将放置引导件放置在模块基板的顶表面上，所述放置引导件具有引导开口，所述引导开口从所述放置引导件的顶表面延伸到所述放置引导件的底表面; 将所述放置引导件对准所述模块基板上的集成电路芯片位置; 将所述放置引导件固定到所述模块基板; 将集成电路芯片放置在引导开口中，放置引导开口的侧壁约束集成电路芯片的底表面上的导电接合结构，以与模块基板的顶表面上的导电模块衬底接触焊盘自对准 集成电路芯片位置; 以及在接合之后将结合结构粘合到模块衬底接触焊盘，接合结构和模块衬底接触焊盘，直接物理和电接触。

公开(公告)号：US07276787B2

公开(公告)日：2007-10-02

申请号：US10729254

申请日：2003-12-05

申请人： Daniel Charles Edelstein ,  Paul Stephen Andry ,  Leena Paivikki Buchwalter ,  Jon Alfred Casey ,  Sherif A. Goma ,  Raymond R. Horton ,  Gareth Geoffrey Hougham ,  Michael Wayne Lane ,  Xiao Hu Liu ,  Chirag Suryakant Patel ,  Edmund Juris Sprogis ,  Michelle Leigh Steen ,  Brian Richard Sundlof ,  Cornelia K. Tsang ,  George Frederick Walker

发明人： Daniel Charles Edelstein ,  Paul Stephen Andry ,  Leena Paivikki Buchwalter ,  Jon Alfred Casey ,  Sherif A. Goma ,  Raymond R. Horton ,  Gareth Geoffrey Hougham ,  Michael Wayne Lane ,  Xiao Hu Liu ,  Chirag Suryakant Patel ,  Edmund Juris Sprogis ,  Michelle Leigh Steen ,  Brian Richard Sundlof ,  Cornelia K. Tsang ,  George Frederick Walker

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L21/4763 ,  H01L29/40 ,  H01L23/52

CPC分类号： H01L23/49883 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

摘要： A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is less than or closely matches that of the substrate. The conductive structure may include concentric via fill areas having differing materials disposed concentrically therein, a core of the substrate material surrounded by an annular ring of conductive material, a core of CTE-matched non-conductive material surrounded by an annular ring of conductive material, a conductive via having an inner void with low CTE, or a full fill of a conductive composite material such as a metal-ceramic paste which has been sintered or fused.

摘要翻译： 一种载体结构和方法，用于制造具有通孔的载流子结构，每个导通孔具有导电结构，其有效热膨胀系数小于或接近于基板的热膨胀系数，并且具有小于或等于 或者与衬底的密切匹配。 导电结构可以包括同心的通孔填充区域，其具有同心设置的不同材料，由导电材料的环形环包围的衬底材料的芯，由导电材料的环形环包围的CTE匹配的非导电材料的芯， 具有低CTE的内部空隙的导电通孔，或已经烧结或熔合的诸如金属 - 陶瓷浆料的导电复合材料的完整填充物。

公开(公告)号：US08679280B2

公开(公告)日：2014-03-25

申请号：US12788839

申请日：2010-05-27

申请人： Bing Dang ,  Matthew Farinelli ,  John Knickerbocker ,  Aparna Prabhakar ,  Robert E. Trzcinski ,  Cornelia K. Tsang

发明人： Bing Dang ,  Matthew Farinelli ,  John Knickerbocker ,  Aparna Prabhakar ,  Robert E. Trzcinski ,  Cornelia K. Tsang

IPC分类号： B32B38/10

CPC分类号： H01L21/6835 ,  B23K26/0622 ,  B23K26/0823 ,  B23K26/361 ,  B23K26/57 ,  B23K2101/40 ,  B23K2103/42 ,  B23K2103/50 ,  C09J5/00 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2400/22 ,  H01L2221/68381 ,  Y10T156/1158 ,  Y10T156/1917

摘要： A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC), includes attaching the handler to the wafer using an adhesive comprising a thermoset polymer, the handler comprising a material that is transparent in a wavelength range of about 193 nanometers (nm) to about 400 nm; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer.

摘要翻译： 一种用于从晶片释放处理器的方法，所述晶片包括集成电路（IC），包括使用包含热固性聚合物的粘合剂将所述处理器附接到所述晶片，所述处理器包括在约193的波长范围内是透明的材料 纳米（nm）至约400nm; 使用激光器通过处理器烧蚀粘合剂，其中基于处理材料的透明度选择激光的波长; 并将处理器与晶片分离。

公开(公告)号：US08617689B2

公开(公告)日：2013-12-31

申请号：US13443418

申请日：2012-04-10

申请人： Kuan-Neng Chen ,  Bruce K. Furman ,  Sampath Purushothaman ,  David L. Rath ,  Anna W. Topol ,  Cornelia K. Tsang

发明人： Kuan-Neng Chen ,  Bruce K. Furman ,  Sampath Purushothaman ,  David L. Rath ,  Anna W. Topol ,  Cornelia K. Tsang

IPC分类号： B32B3/00 ,  B32B15/04

CPC分类号： H01L24/05 ,  B23K20/023 ,  B23K20/233 ,  B23K20/24 ,  B23K2101/42 ,  H01L24/03 ,  H01L24/08 ,  H01L24/12 ,  H01L24/80 ,  H01L2224/0381 ,  H01L2224/03845 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/08147 ,  H01L2224/08148 ,  H01L2224/80203 ,  H01L2224/80345 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80948 ,  H01L2224/80986 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T428/24479 ,  Y10T428/24521 ,  Y10T428/24545 ,  Y10T428/24612 ,  Y10T428/31678 ,  H01L2924/00012 ,  H01L2924/0001 ,  H01L2924/00

摘要： Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric, as well as related structures, are disclosed. One method includes providing a first substrate having a metal-dielectric pattern on a surface thereof; providing a second substrate having a metal-dielectric pattern on a surface thereof; performing a process resulting in the metal being raised above the dielectric; cleaning the metal; and bonding the first substrate to the second substrate. A related structure is also disclosed. The bonding of raised metal provides a strong bonding medium, and good electrical and thermal connections enabling creation of three dimensional integrated structures with enhanced functionality.

摘要翻译： 公开了包括金属电介质图案在表面上与在电介质上方凸起的金属以及相关结构的接合。 一种方法包括在其表面上提供具有金属 - 电介质图案的第一基板; 提供在其表面上具有金属 - 电介质图案的第二基板; 执行导致金属在电介质上方升高的过程; 清洗金属; 以及将所述第一基板接合到所述第二基板。 还公开了相关的结构。 凸起金属的结合提供了强大的粘合介质，以及良好的电气和热连接，能够创建具有增强功能的三维集成结构。

公开(公告)号：US08419895B2

公开(公告)日：2013-04-16

申请号：US12788843

申请日：2010-05-27

申请人： Bing Dang ,  John Knickerbocker ,  Aparna Prabhakar ,  Peter Sorce ,  Robert E. Trzcinski ,  Cornelia K. Tsang

发明人： Bing Dang ,  John Knickerbocker ,  Aparna Prabhakar ,  Peter Sorce ,  Robert E. Trzcinski ,  Cornelia K. Tsang

IPC分类号： B32B38/10

CPC分类号： H01L21/6835 ,  B23K26/361 ,  H01L2221/68381 ,  Y10T156/1111 ,  Y10T156/1158 ,  Y10T156/1917

摘要： A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC) includes attaching the handler to the wafer using an adhesive comprising a polymer; performing edge processing to remove an excess portion of the adhesive from an edge of the handler and wafer; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer. A system for releasing a handler from a wafer, the wafer comprising an IC includes a handler attached to a wafer using an adhesive comprising a polymer; an edge processing module, the edge processing module configured to remove an excess portion of the adhesive from the edge of the handler and wafer; and a laser, the laser configured to ablate the adhesive through the handler.

摘要翻译： 一种用于从晶片释放处理器的方法，包括集成电路（IC）的晶片包括使用包含聚合物的粘合剂将处理器附接到晶片; 执行边缘处理以从处理器和晶片的边缘去除多余的粘合剂部分; 使用激光器通过处理器烧蚀粘合剂，其中基于处理材料的透明度选择激光的波长; 并将处理器与晶片分离。 一种用于从晶片释放处理器的系统，包括IC的晶片包括使用包含聚合物的粘合剂附接到晶片的处理器; 边缘处理模块，所述边缘处理模块被配置为从所述处理器和晶片的边缘去除所述粘合剂的多余部分; 和激光器，激光器被配置为通过处理器消融粘合剂。