公开(公告)号：US4888449A

公开(公告)日：1989-12-19

申请号：US140859

申请日：1988-01-04

Applicant: Jacob Crane ,  Barry C. Johnson ,  Deepak Mahulikar ,  Sheldon H. Butt

Inventor： Jacob Crane ,  Barry C. Johnson ,  Deepak Mahulikar ,  Sheldon H. Butt

IPC: H01L23/057 ,  H01L23/06 ,  H01L23/10 ,  H01L23/14 ,  H01L23/367

CPC classification number: H01L23/057 ,  H01L23/06 ,  H01L23/10 ,  H01L23/142 ,  H01L23/3675 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  Y10T29/49121

Abstract: A semiconductor package for an electrical component which has a metal or metal alloy leadframe with first and second surface, which leadframe is adapted to have an electrical component connected thereto. The leadframe is bonded by means of a polymer to a copper or copper alloy base member. The leadframe is also bonded by means of a polymer to a copper or copper alloy cap member. The cap and base members have coated to their inside surfaces a metal or metal alloy. The coating improves the polymer bond between the leadframe and the base and cap members. The surface area of the base member is increased to transfer more heat from the silicon chip in the semiconductor package and to reduce the thermal stresses between the silicon chip and the base member.

Abstract translation: 一种用于电气部件的半导体封装件，其具有带有第一和第二表面的金属或金属合金引线框架，该引线框架适于具有连接到其上的电气部件。 引线框通过聚合物粘合到铜或铜合金基底上。 引线框也通过聚合物粘合到铜或铜合金盖构件上。 帽和基部构件已经在其内表面涂覆有金属或金属合金。 涂层改善了引线框架与底座和盖件之间的聚合物粘结。 增加基体部件的表面积，以从半导体封装中的硅芯片传递更多的热量，并且减小硅芯片和基底部件之间的热应力。

公开(公告)号：US4883778A

公开(公告)日：1989-11-28

申请号：US924959

申请日：1986-10-30

Applicant: Narendra N. SinghDeo ,  Deepak Mahulikar ,  Sheldon H. Butt

Inventor： Narendra N. SinghDeo ,  Deepak Mahulikar ,  Sheldon H. Butt

IPC: A61F2/00 ,  A61F2/30 ,  A61F2/36 ,  C03C14/00 ,  H05K1/03

CPC classification number: A61F2/30965 ,  C03C14/004 ,  A61F2/367 ,  A61F2002/3631 ,  A61F2002/368 ,  A61F2002/3682 ,  A61F2310/00203 ,  C03C2214/04 ,  C03C2214/08 ,  H01L2924/01078 ,  H01L2924/09701 ,  H05K1/0306

Abstract: The present invention is directed to an engineering ceramic product formed of a ceramic-glass-metal composite being strong, durable, formable into complex shapes and having good improved thermal conductivity.

Abstract translation: 本发明涉及由陶瓷 - 玻璃 - 金属复合材料形成的工程陶瓷产品，该陶瓷玻璃 - 金属复合材料坚固耐用，可形成复杂形状并具有良好的改善的导热性。

公开(公告)号：US4882212A

公开(公告)日：1989-11-21

申请号：US924970

申请日：1986-10-30

Applicant: Narendra N. SinghDeo ,  Deepak Mahulikar ,  Sheldon H. Butt

Inventor： Narendra N. SinghDeo ,  Deepak Mahulikar ,  Sheldon H. Butt

IPC: A61F2/00 ,  A61F2/30 ,  A61F2/36 ,  C03C14/00 ,  H01L23/10 ,  H01L23/15 ,  H01L23/367 ,  H01L23/498 ,  H05K1/03

CPC classification number: H01L23/15 ,  A61F2/30965 ,  C03C14/004 ,  H01L23/10 ,  H01L23/3677 ,  H01L23/49805 ,  H01L23/49861 ,  A61F2/367 ,  A61F2002/3631 ,  A61F2002/368 ,  A61F2002/3682 ,  A61F2310/00203 ,  C03C2214/04 ,  C03C2214/08 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/3025 ,  H05K1/0306 ,  Y10S428/901 ,  Y10T428/239 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  Y10T428/259

Abstract: The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout. Metal elements can be embedded into the material to enable simplified fabrication of devices such as semiconductor packaging.

Abstract translation: 本发明涉及形成用于容纳半导体器件的部件的部件和工艺。 这些部件由独特的陶瓷 - 玻璃 - 金属复合材料制成，陶瓷颗粒，金属颗粒和玻璃基体，所述陶瓷和金属颗粒遍布整个分散。 金属元件可以嵌入到材料中，以简化诸如半导体封装的器件的制造。

公开(公告)号：US4799973A

公开(公告)日：1989-01-24

申请号：US596182

申请日：1984-04-02

Applicant: Deepak Mahulikar ,  Eugene Shapiro

Inventor： Deepak Mahulikar ,  Eugene Shapiro

IPC: C22F1/08 ,  B32B15/20

CPC classification number: C22F1/08 ,  Y10T428/1291

Abstract: The present invention relates to a process for maintaining the fine grain size of and providing excellent bend formability, hot ductility and strength properties to a copper-nickel-manganese alloy to be exposed to elevated temperatures. The process of the present invention includes a final cold working step during which the material to be fabricated into a desired article and/or exposed to the elevated temperatures has its thickness reduced by about 4% to about 30%, preferably from about 5% to about 25%. The alloys described herein have particular utility in brazed articles or assemblies.

Abstract translation: 本发明涉及一种保持高温下铜 - 镍 - 锰合金的细晶粒尺寸并提供优异的弯曲成形性，热延展性和强度性能的方法。 本发明的方法包括最终的冷加工步骤，在该最终冷加工步骤中，要制造成所需制品的材料和/或暴露于升高的温度下，其厚度减小约4％至约30％，优选约5％至约5％ 约25％。 本文所述的合金在钎焊制品或组件中具有特别的用途。

公开(公告)号：US4748136A

公开(公告)日：1988-05-31

申请号：US924968

申请日：1986-10-30

Applicant: Deepak Mahulikar ,  Narendra N. SinghDeo

Inventor： Deepak Mahulikar ,  Narendra N. SinghDeo

IPC: A61F2/00 ,  A61F2/30 ,  A61F2/36 ,  C03C14/00 ,  H05K1/03

CPC classification number: C03C14/004 ,  A61F2/30965 ,  A61F2/367 ,  A61F2002/3631 ,  A61F2002/368 ,  A61F2002/3682 ,  A61F2310/00203 ,  C03C2214/04 ,  C03C2214/08 ,  H01L2924/01078 ,  H01L2924/09701 ,  H05K1/0306

Abstract: The present invention is directed to a composite and process of forming the composite comprising metallic particles for enhancing the flow characteristics of said composite, a glass for adhering the composite together and the balance essentially ceramic particles. The composite has a matrix comprising the glass with the ceramic and metallic particles dispersed therein. The metallic particles are preferably present in the composite at a volume percentage so as to be discontinuously dispersed throughout.

Abstract translation: 本发明涉及一种形成复合材料的复合材料和方法，所述复合材料包括用于增强所述复合材料的流动特性的金属颗粒，用于将复合材料粘合在一起的玻璃和其余的基本上为陶瓷颗粒。 该复合材料具有包含分散有陶瓷和金属颗粒的玻璃的基体。 金属颗粒优选以体积百分比存在于复合材料中，以便不连续地分散在整个组合物中。

公开(公告)号：US4715892A

公开(公告)日：1987-12-29

申请号：US922271

申请日：1986-10-30

Applicant: Deepak Mahulikar

Inventor： Deepak Mahulikar

IPC: C22C1/05 ,  C22C32/00 ,  H01L21/48 ,  H01L23/15 ,  C22C29/12

CPC classification number: H01L23/15 ,  C22C1/05 ,  C22C32/0089 ,  H01L21/4807 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/3025 ,  Y10T428/12056 ,  Y10T428/12097 ,  Y10T428/12139 ,  Y10T428/12181

Abstract: The present invention is directed to a cermet material comprising a matrix of metal or alloy with ceramic particles distributed therein. The cermet includes a glass binder for bonding between the metal or alloy and the ceramic particles.

Abstract translation: 本发明涉及一种金属陶瓷材料，其包含金属或合金的基体，其中分布有陶瓷颗粒。 金属陶瓷包括用于在金属或合金与陶瓷颗粒之间接合的玻璃粘合剂。

公开(公告)号：US20130067998A1

公开(公告)日：2013-03-21

申请号：US13618088

申请日：2012-09-14

Applicant: Saeed H. Mohseni ,  Elizabeth K. Gramm ,  Deepak Mahulikar

Inventor： Saeed H. Mohseni ,  Elizabeth K. Gramm ,  Deepak Mahulikar

IPC: C09K13/00 ,  G01N1/44 ,  G01N1/10 ,  C09K13/02 ,  C09G1/02

CPC classification number: C09K3/1463 ,  C09G1/02

Abstract: A method of forming a colloidal dispersion includes providing a first continuous material flow, providing a second continuous material flow, combining the first and second continuous material flows, and moving a continuous flow of a colloidal dispersion in a direction downstream of the first and second continuous flows. The first continuous material flow includes one or more of a diluent (e.g., deionized water), a base, and an acid, and the second continuous material flow includes an abrasive particle solution. The first and second material flows are combined with a Reynolds number greater than about 4400 and less than about 25000 (e.g., about 7400 to about 25000). The colloidal dispersion includes the diluent, the base, the acid, and abrasive particles from the abrasive particle solution.

Abstract translation: 形成胶态分散体的方法包括提供第一连续材料流，提供第二连续材料流，组合第一和第二连续材料流，以及在第一和第二连续材料的下游方向上移动胶体分散体的连续流动 流动。 第一连续材料流包括稀释剂（例如去离子水），碱和酸中的一种或多种，​​并且第二连续材料流包括研磨颗粒溶液。 第一和第二材料流与大于约4400且小于约25000（例如约7400至约25000）的雷诺数组合。 胶体分散体包括来自磨料颗粒溶液的稀释剂，碱，酸和磨料颗粒。

公开(公告)号：US20120145950A1

公开(公告)日：2012-06-14

申请号：US13405027

申请日：2012-02-24

Applicant: Deepak Mahulikar ,  Yuhu Wang ,  Ken A. Delbridge ,  Gert R.M. Moyaerts ,  Saeed H. Mohseni ,  Nichole R. Koontz ,  Bin Hu ,  Liqing Wen

Inventor： Deepak Mahulikar ,  Yuhu Wang ,  Ken A. Delbridge ,  Gert R.M. Moyaerts ,  Saeed H. Mohseni ,  Nichole R. Koontz ,  Bin Hu ,  Liqing Wen

IPC: C09K13/00 ,  B82Y30/00

CPC classification number: C23F3/04 ,  C01B33/1435 ,  C01B33/1485 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2006/80 ,  C09G1/02 ,  C09K3/1463 ,  C09K3/1472 ,  H01L21/31053 ,  H01L21/3212

Abstract: An ultrapure colloidal silica dispersion comprising colloidal silica particles having a mean or aggregate particle size from about 10 to about 200 nm, wherein the colloidal silica dispersion has less than 200 ppb, of each trace metal impurity disposed therein, excluding potassium and sodium, and have less than 2 ppm residual alcohol. A method for producing and using the same is also disclosed.

Abstract translation: 一种超纯胶态二氧化硅分散体，其包含平均或聚集体粒径为约10至约200nm的胶体二氧化硅颗粒，其中胶态二氧化硅分散体中除了钾和钠之外的每种痕量金属杂质少于200ppb，并且具有 小于2ppm的残余酒精。 还公开了其制造和使用方法。

公开(公告)号：US20090053896A1

公开(公告)日：2009-02-26

申请号：US12221864

申请日：2008-08-07

Applicant: Bin Hu ,  Richard Wen ,  Deepak Mahulikar

Inventor： Bin Hu ,  Richard Wen ,  Deepak Mahulikar

IPC: H01L21/304 ,  C09K13/00

CPC classification number: C09G1/02 ,  C09G1/16 ,  H01L21/3212

Abstract: A water-soluble polymer is effective as a removal rate enhancer in a chemical mechanical polishing slurry to polish copper on semiconductor wafers or other copper laid structures, while keeping the etching rate low. The slurry may also include soft particles and certain metal chelating agents, or combinations thereof. The slurry can also comprise an abrasive particle, an organic acid, and an oxidizer.

Abstract translation: 水溶性聚合物在化学机械抛光浆料中作为去除速率增强剂是有效的，以在半导体晶片或其它铜敷设结构上抛光铜，同时保持蚀刻速率较低。 浆料还可以包括软颗粒和某些金属螯合剂，或其组合。 浆料还可以包含磨料颗粒，有机酸和氧化剂。

公开(公告)号：US06776696B2

公开(公告)日：2004-08-17

申请号：US10281905

申请日：2002-10-28

Applicant: Deepak Mahulikar ,  Richard J. Jenkins

Inventor： Deepak Mahulikar ,  Richard J. Jenkins

IPC: B24B100

CPC classification number: C09G1/02 ,  B24B37/044 ,  H01L21/3212

Abstract: A continuous CMP process for polishing multiple conductive and non-conductive layers on a semiconductor substrate. The continuous process comprises the steps of: (a) disposing a substrate on a platen; (b) polishing a first layer using both a mechanical means and a chemical means; and (c) polishing a second layer upon adjusting at least one parameter in either the mechanical means, chemical means, or both.