Semiconductor device and method of manufacturing the same

    公开(公告)号:US08076711B2

    公开(公告)日:2011-12-13

    申请号:US13114590

    申请日:2011-05-24

    申请人: Yoshio Ozawa

    发明人: Yoshio Ozawa

    IPC分类号: H01L29/76

    摘要: According to an aspect of the invention, there is provided a semiconductor device including a plurality of memory cells, comprising a plurality of floating gate electrodes which are formed on a tunnel insulating film formed on a semiconductor substrate and have an upper portion which is narrower in a channel width direction than a lower portion, an interelectrode insulating film formed on the floating gate electrodes, and a control gate electrode which is formed on the interelectrode insulating film formed on the floating gate electrodes and partially buried between the floating gate electrodes opposing each other.

    Semiconductor device having nitride film between gate insulation film and gate electrode
    62.
    发明授权
    Semiconductor device having nitride film between gate insulation film and gate electrode 有权
    在栅极绝缘膜和栅电极之间具有氮化物膜的半导体器件

    公开(公告)号:US08063432B2

    公开(公告)日:2011-11-22

    申请号:US12805620

    申请日:2010-08-10

    申请人: Yoshio Ozawa

    发明人: Yoshio Ozawa

    IPC分类号: H01L29/788 H01L29/792

    摘要: A semiconductor device includes a tunnel insulation film formed on a semiconductor substrate, a floating gate electrode formed on the tunnel insulation film, an inter-electrode insulation film formed on the floating gate electrode, a control gate electrode formed on the inter-electrode insulation film, a pair of oxide films which are formed between the tunnel insulation film and the floating gate electrode and are formed near lower end portions of a pair of side surfaces of the floating gate electrode, which are parallel in one of a channel width direction and a channel length direction, and a nitride film which is formed between the tunnel insulation film and the floating gate electrode and is formed between the pair of oxide films.

    摘要翻译: 半导体器件包括形成在半导体衬底上的隧道绝缘膜,形成在隧道绝缘膜上的浮栅电极,形成在浮栅上的电极间绝缘膜,形成在电极间绝缘膜上的控制栅电极 形成在所述隧道绝缘膜和所述浮栅之间并且形成在所述浮栅电极的一对侧面的下端部附近的一对氧化膜,所述一对侧面在沟道宽度方向和 沟道长度方向和形成在隧道绝缘膜和浮栅之间并形成在一对氧化膜之间的氮化物膜。

    Method of manufacturing a nonvolatile semiconductor memory device
    65.
    发明授权
    Method of manufacturing a nonvolatile semiconductor memory device 有权
    制造非易失性半导体存储器件的方法

    公开(公告)号:US07972927B2

    公开(公告)日:2011-07-05

    申请号:US12540663

    申请日:2009-08-13

    摘要: According to a method of manufacturing a MONOS nonvolatile semiconductor memory device, a tunnel insulating film, a charge storage layer, a block insulating film containing a metal oxide and a control gate electrode are stacked on a semiconductor substrate. Heat treatment is carried out in an atmosphere containing an oxidizing gas after the tunnel insulating film, the charge storage layer and the block insulating film are stacked on the semiconductor substrate. Thereafter, the control gate electrode is formed on the block insulating film.

    摘要翻译: 根据制造MONOS非易失性半导体存储器件的方法,在半导体衬底上层叠隧道绝缘膜,电荷存储层,含有金属氧化物的块绝缘膜和控制栅电极。 在隧道绝缘膜,电荷存储层和块绝缘膜堆叠在半导体衬底上之后,在含有氧化性气体的气氛中进行热处理。 此后,控制栅电极形成在块绝缘膜上。

    NONVOLATILE MEMORY DEVICE
    68.
    发明申请
    NONVOLATILE MEMORY DEVICE 有权
    非易失性存储器件

    公开(公告)号:US20110068312A1

    公开(公告)日:2011-03-24

    申请号:US12795197

    申请日:2010-06-07

    IPC分类号: H01L45/00 H01L29/22

    摘要: According to one embodiment, a nonvolatile memory device comprises a plurality of first lines, a plurality of second lines, and memory cells. Each of the memory cells comprise a variable resistor, and a diode. The variable resistor includes a first metal oxide film and is configured to reversibly change resistance value by energy application. The diode includes a second metal oxide film and is connected in series to the variable resistor. The first metal oxide film has at least one of dielectric constant lower than that of the second metal oxide film and physical film thickness greater than that of the second metal oxide film.

    摘要翻译: 根据一个实施例,非易失性存储器件包括多个第一线,多条第二线和存储单元。 每个存储单元包括可变电阻器和二极管。 可变电阻器包括第一金属氧化物膜,并且被配置为通过能量施加可逆地改变电阻值。 二极管包括第二金属氧化物膜并串联连接到可变电阻器。 第一金属氧化物膜具有比第二金属氧化物膜低的介电常数中的至少一种,并且物理膜厚度大于第二金属氧化物膜的介电常数。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    69.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20110012190A1

    公开(公告)日:2011-01-20

    申请号:US12888140

    申请日:2010-09-22

    IPC分类号: H01L29/68

    摘要: A semiconductor device includes a semiconductor substrate, a first insulating film formed on the semiconductor substrate, a charge storage layer formed on the first insulating film, a second insulating film formed on the charge storage layer, and a control electrode formed on the second insulating film, the second insulating film including a lower silicon nitride film, a lower silicon oxide film formed on the lower silicon nitride film, an intermediate insulating film formed on the lower silicon oxide film and containing a metal element, the intermediate insulating film having a relative dielectric constant of greater than 7, an upper silicon oxide film formed on the intermediate insulating film, and an upper silicon nitride film formed on the upper silicon oxide film.

    摘要翻译: 半导体器件包括半导体衬底,形成在半导体衬底上的第一绝缘膜,形成在第一绝缘膜上的电荷存储层,形成在电荷存储层上的第二绝缘膜,以及形成在第二绝缘膜上的控制电极 ,所述第二绝缘膜包括下氮化硅膜,形成在所述下氮化硅膜上的下氧化硅膜,形成在所述下氧化硅膜上并含有金属元素的中间绝缘膜,所述中间绝缘膜具有相对电介质 大于7的常数,形成在中间绝缘膜上的上部氧化硅膜和形成在上部氧化硅膜上的上部氮化硅膜。

    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    70.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    半导体存储器件及其制造方法

    公开(公告)号:US20100288995A1

    公开(公告)日:2010-11-18

    申请号:US12728028

    申请日:2010-03-19

    IPC分类号: H01L45/00 H01L21/20

    摘要: A semiconductor memory device includes: a lower electrode including a plurality of projections formed on a top surface thereof; an oxide film covering the top surface and made of an oxide of a same metal as a metal contained in the lower electrode; and a resistance variable film provided on the oxide film and being in contact with the oxide film, the projections being buried in the oxide film, and a lower layer portion of the resistance variable film having an oxygen concentration lower than an oxygen concentration of a portion other than the lower layer portion of the resistance variable film.

    摘要翻译: 半导体存储器件包括:下电极,其包括形成在其顶表面上的多个突起; 覆盖上表面并由与下部电极中所含的金属相同的金属的氧化物构成的氧化膜; 以及设置在氧化膜上并与氧化膜接触的电阻变化膜,所述突起被埋在氧化物膜中,并且电阻变化膜的下层部分的氧浓度低于部分的氧浓度 除了电阻可变膜的下层部分之外。