公开(公告)号：US20180226351A1

公开(公告)日：2018-08-09

申请号：US15944321

申请日：2018-04-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Hyun PARK ,  Han KIM ,  Kang Heon HUR ,  Young Gwan KO ,  Jung Ho SHIM

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H01L23/48 ,  H01L25/00 ,  H01L23/00 ,  H01L25/10 ,  H01L21/56 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/00 ,  H01L24/19 ,  H01L24/20 ,  H01L24/48 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2221/68386 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/12105 ,  H01L2224/16238 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/185 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present disclosure relates to a fan-out semiconductor package and a method of manufacturing the same. The fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member includes a first insulating layer, a first redistribution layer and a second redistribution layer disposed on one surface and the other surface of the first insulating layer opposing the one surface thereof, respectively, a second insulating layer disposed on the first insulating layer and covering the first redistribution layer, and a third redistribution layer disposed on the second insulating layer. A fan-out semiconductor package may include one or more connection units instead of the first connection member.

公开(公告)号：US20180145044A1

公开(公告)日：2018-05-24

申请号：US15877021

申请日：2018-01-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Hyun PARK ,  Han KIM ,  Kang Heon HUR ,  Young Gwan KO ,  Jung Ho SHIM

IPC: H01L23/00 ,  H01L23/48

CPC classification number: H01L24/00 ,  H01L21/568 ,  H01L23/48 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/24195 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/185 ,  H05K2201/10674 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: An electronic component package and a method of manufacturing the same are provided. The electronic component package includes a frame having a through-hole, an electronic component disposed in the through-hole of the frame, and a redistribution part disposed at one side of the frame and the electronic component. One or more first wiring layers of the frame are electrically connected to the electronic component through the redistribution part.

公开(公告)号：US20170271071A1

公开(公告)日：2017-09-21

申请号：US15285605

申请日：2016-10-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han KIM ,  Kang Heon HUR ,  Sang Jong LEE ,  Jung Wook SEO

IPC: H01F27/28 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F38/14 ,  H01F41/041 ,  H01F2027/2809

Abstract: Disclosed are a method of manufacturing a coil device and a coil device, which includes a base layer and a coil pattern formed on a surface of the base layer. In an aspect, the method of manufacturing a coil device includes forming a seed layer of a coil by bonding a copper foil to a base layer, etching to remove a portion of the copper foil, and plating a plating layer on the seed layer.

公开(公告)号：US20170110236A1

公开(公告)日：2017-04-20

申请号：US15183035

申请日：2016-06-15

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Su Bong JANG ,  Sang Jong LEE ,  Tae Ho YUN ,  Han KIM

IPC: H01F27/28 ,  H01F41/04 ,  H01F41/10 ,  H01F27/29

CPC classification number: H01F41/10 ,  H01F5/00 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  H01F41/043

Abstract: A multilayer electronic component includes: a multilayer body includes stacked insulating layers and internal coil parts disposed on the insulating layers; external electrodes disposed on an outer portion of the multilayer body and connected to the internal coil parts; and a material layer disposed on an outermost coil part among the internal coil parts and having a specific resistance that is lower than a specific resistance of the internal coil parts.

公开(公告)号：US20170099729A1

公开(公告)日：2017-04-06

申请号：US15198679

申请日：2016-06-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han KIM ,  Seong Hee CHOI ,  Dae Hyun PARK

IPC: H05K1/02 ,  H01P3/08

CPC classification number: H05K1/0253 ,  H01P3/08 ,  H01P3/081 ,  H01P3/085 ,  H05K1/0225 ,  H05K1/0298 ,  H05K2201/09263 ,  H05K2201/09681 ,  H05K2201/09781

Abstract: A circuit board includes a first conductive layer, a second conductive layer, and a first insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer includes a signal line, the second conductive layer includes a ground line, and the ground line of the second conductive layer includes a pattern area patterned in a meander shape.

公开(公告)号：US20150116950A1

公开(公告)日：2015-04-30

申请号：US14524940

申请日：2014-10-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji No YOO ,  Han KIM ,  Won Gi KIM ,  Suk Hyeon CHO

IPC: H01F27/28 ,  H05K7/02 ,  H01F41/02 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F27/022 ,  H01F27/255 ,  H05K1/116 ,  H05K1/185 ,  H05K3/46 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10196 ,  Y10T29/49075

Abstract: A coil component may be capable of being easily manufactured and significantly decreasing direct current (DC) resistance of its wiring. The coil component may include a coil assembly including a core substrate and coil patterns formed on the core substrate; and a magnetic material part embedding the coil assembly therein.

Abstract translation: 线圈部件可以容易地制造并且显着降低其布线的直流（DC）电阻。 线圈部件可以包括线圈组件，其包括芯基板和形成在芯基板上的线圈图案; 以及将线圈组件嵌入其中的磁性材料部分。