摘要:
Provided is a multilayer adhesive sheet which enables easy separation between an adhesive layer and a die attach film during the pick-up even in cases where an acrylate ester copolymer is used in the die attach film, thereby making the pick-up work of semiconductor chips after the dicing easy. The multilayer adhesive sheet comprises a base film, an adhesive layer that is disposed on one surface of the base film, and a die attach film that is disposed on an exposed surface of the adhesive layer. The adhesive that constitutes the adhesive layer contains: (A) a (meth)acrylate ester copolymer; (B) an ultraviolet polymerizable compound; (C) a multifunctional isocyanate curing agent; (D) a photopolymerization initiator; and (E) a silicone polymer.
摘要:
A container is provided that is used as a container permitting easy transfer into another container without spilling of contents at the time of work of refilling. The present invention relates to a container that is fitted in a container body of tubular shape having an open end, a bottom part and a side wall and that transfers contents into a preservation container. This container has: a funnel component (201) provided with a funnel (220) whose diameter decreases from a larger opening side toward a smaller opening side and provided with a plurality of ribs (228) that extend radially from the center of an opening part (222) on the smaller opening side of the funnel (220) so as to bridge a part with another part of the inner surface of the opening part (222) on the smaller opening side; and a container body.
摘要:
A method for manufacturing electronic parts, which is characteristic in that it permits reduction of contamination to the semi-cured adhesive layer formed on semiconductor wafer and the cohesive sheet used therein is superior in adhesiveness for example to the lead frame, the method comprising a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer by coating a pasty adhesive entirely over the rear face of a wafer and curing the pasty adhesive partially by radiation-ray irradiation or heating into the sheet shape, a fixing step of fixing the semi-cured adhesive layer formed on a wafer and a ring frame by bonding them to the cohesive layer of a cohesive sheet, a dicing step of dicing the wafer together with the semi-cured adhesive layer with a dicing blade into semiconductor chips, and a pick-up step of picking up the chips carrying the semi-cured adhesive layer from the cohesive layer of the cohesive sheet after radiation-ray irradiation, wherein the photopolymerization initiator in the cohesive layer of the cohesive sheet has a particular property.
摘要:
Provided is a multilayer adhesive sheet which enables easy separation between an adhesive layer and a die attach film during the pick-up even in cases where an acrylate ester copolymer is used in the die attach film, thereby making the pick-up work of semiconductor chips after the dicing easy. The multilayer adhesive sheet comprises a base film, an adhesive layer that is disposed on one surface of the base film, and a die attach film that is disposed on an exposed surface of the adhesive layer. The adhesive that constitutes the adhesive layer contains: (A) a (meth)acrylate ester copolymer; (B) an ultraviolet polymerizable compound; (C) a multifunctional isocyanate curing agent; (D) a photopolymerization initiator; and (E) a silicone polymer.
摘要:
A temperature adjustment member is arranged to control temperature of a reformer independently of temperature of a fuel cell module. The reformer is structured as a three-fluid heat exchanger into which a fluid is introducible whose temperature is higher or lower than exhaust-gas temperature of the fuel cell module. Then, the temperature of the reformer is controlled independently of operation temperature of the fuel cell by introducing the higher-temperature or lower-temperature fluid into the reformer. Also, a high-temperature or low-temperature gas is mixed with the module's exhaust gas, thereby adjusting temperature of the exhaust gas itself. This also controls the temperature of the reformer independently of the operation temperature of the fuel cell.
摘要:
An energy management apparatus includes: a communicator capable of communicating with at least a meter apparatus among the meter apparatus and a server apparatus that collects measurement information from the meter apparatus; a device registration processor configured to determine whether the direct communicator to the server apparatus can communicate with the server apparatus; if the direct communication is possible, transmit to the server apparatus a device registration message that requests to register a device identifier of the meter apparatus and a device identifier of the energy management apparatus; and, if the direct communication to the server apparatus is not possible, transmit the device registration message for the server apparatus to the meter apparatus; a communication processor configured to obtain energy control information of the device transmitted from the server apparatus; and a control executor configured to control the used energy amount of the device based on the energy control information.
摘要:
A printing device controller provided with a first computational processing unit that performs overall control of the device as a whole and a second computational processing unit that consumes less power than the first computational processing unit, the printing device controller including: a RAM (Random Access Memory) having a self-refresh mode; a main control unit whose main processing constituent is the first computational processing unit; and a sub control unit whose main processing constituent is the second computational processing unit. When an instruction to enter a power-saving state is inputted, the main control unit causes the first computational processing unit to store information necessary for returning from the power-saving state into a storage unit and then causes the RAM to enter the self-refresh mode, and the sub control unit then powers off the first computational processing unit.
摘要:
A temperature adjustment member is arranged to control temperature of a reformer independently of temperature of a fuel cell module. The reformer is structured as a three-fluid heat exchanger into which a fluid is introducible whose temperature is higher or lower than exhaust-gas temperature of the fuel cell module. Then, the temperature of the reformer is controlled independently of operation temperature of the fuel cell by introducing the higher-temperature or lower-temperature fluid into the reformer. Also, a high-temperature or low-temperature gas is mixed with the module's exhaust gas, thereby adjusting temperature of the exhaust gas itself. This also controls the temperature of the reformer independently of the operation temperature of the fuel cell.
摘要:
A temperature adjustment member is arranged to control temperature of a reformer independently of temperature of a fuel cell module. The reformer is structured as a three-fluid heat exchanger into which a fluid is introducible whose temperature is higher or lower than exhaust-gas temperature of the fuel cell module. Then, the temperature of the reformer is controlled independently of operation temperature of the fuel cell by introducing the higher-temperature or lower-temperature fluid into the reformer. Also, a high-temperature or low-temperature gas is mixed with the module's exhaust gas, thereby adjusting temperature of the exhaust gas itself. This also controls the temperature of the reformer independently of the operation temperature of the fuel cell.
摘要:
In a thin solid electrolytic capacitor including a solid electrolytic capacitor element disposed on a substrate, the solid electrolytic capacitor element has an upper surface largely extending along the substrate as compared with a height dimension thereof from the substrate. A casing portion is at least partly made of a resin and surrounds the solid electrolytic capacitor element jointly with the substrate. The casing portion includes a non-adhesive member that is in contact with an upper surface of the solid electrolytic capacitor element, but is not adhesive to the solid electrolytic capacitor element.