公开(公告)号：US08461050B2

公开(公告)日：2013-06-11

申请号：US13157938

申请日：2011-06-10

申请人： Hironori Araki ,  Yoshitaka Sasaki ,  Hiroyuki Ito ,  Kazuki Sato ,  Shigeki Tanemura ,  Yukinori Ikegawa

发明人： Hironori Araki ,  Yoshitaka Sasaki ,  Hiroyuki Ito ,  Kazuki Sato ,  Shigeki Tanemura ,  Yukinori Ikegawa

IPC分类号： H01L21/311

CPC分类号： G11B5/314 ,  G11B5/3163 ,  G11B2005/0021 ,  H01L21/31116

摘要： A method of taper-etching a layer to be etched that is made of SiO2 or SiON and has a top surface. The method includes the step of forming an etching mask with an opening on the top surface of the layer to be etched, and the step of taper-etching a portion of the layer to be etched, the portion being exposed from the opening, by reactive ion etching so that a groove having two wall faces that intersect at a predetermined angle is formed in the layer to be etched. The etching mask is formed of a material containing elemental Al. The step of taper-etching employs an etching gas that contains a main component gas, which contributes to the etching of the layer to be etched, and N2.

摘要翻译： 一种由SiO 2或SiON制成并具有顶表面的蚀刻层的蚀刻方法。 该方法包括以下步骤：在待蚀刻层的顶表面上形成具有开口的蚀刻掩模;以及将待蚀刻层的一部分从开口暴露的部分，通过反应 离子蚀刻，使得在被蚀刻层中形成具有以预定角度相交的两个壁面的凹槽。 蚀刻掩模由含有元素Al的材料形成。 锥蚀刻的步骤使用包含有助于蚀刻蚀刻层的主要成分气体和N 2的蚀刻气体。

公开(公告)号：US08454848B2

公开(公告)日：2013-06-04

申请号：US13235856

申请日：2011-09-19

申请人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Shigeki Tanemura ,  Hironori Araki ,  Kazuki Sato ,  Kazumasa Yasuda

发明人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Shigeki Tanemura ,  Hironori Araki ,  Kazuki Sato ,  Kazumasa Yasuda

IPC分类号： B29D11/00

CPC分类号： G11B5/314 ,  G11B5/3163 ,  G11B5/6088 ,  G11B2005/0021

摘要： A method of manufacturing the plasmon generator includes the steps of: forming a base part made of a dielectric material; forming a metal film that is to later become the plasmon generator; and forming a filler layer made of a dielectric material. The base part includes a base surface and a protruding part that protrudes from the base surface. The protruding part has a top surface that is different in level from the base surface, and a first sidewall connecting the top surface of the protruding part to the base surface. The metal film includes an adhesion part adhering to the first sidewall. The filler layer has a second sidewall disposed such that the adhesion part is interposed between the first sidewall and the second sidewall.

摘要翻译： 制造等离子体发生器的方法包括以下步骤：形成由电介质材料制成的基部; 形成以后成为等离子体发生器的金属膜; 并形成由介电材料制成的填充层。 基部包括基部表面和从基部表面突出的突出部分。 突出部分具有与基部表面不同的顶表面，以及将突出部分的顶表面连接到基部表面的第一侧壁。 金属膜包括附着在第一侧壁上的粘合部。 填料层具有第二侧壁，该第二侧壁设置成使得粘合部分插入在第一侧壁和第二侧壁之间。

公开(公告)号：US08362602B2

公开(公告)日：2013-01-29

申请号：US12852767

申请日：2010-08-09

申请人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Hiroshi Ikejima ,  Atsushi Iijima

发明人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Hiroshi Ikejima ,  Atsushi Iijima

IPC分类号： H01L23/02

CPC分类号： H01L25/50 ,  H01L23/5382 ,  H01L24/01 ,  H01L25/0657 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2924/07802 ,  H01L2924/00

摘要： A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including a plurality of layer portions; a plurality of first terminals disposed on the top surface of the main part and connected to the wiring; and a plurality of second terminals disposed on the bottom surface of the main part and connected to the wiring. Each layer portion includes a semiconductor chip. The plurality of second terminals are positioned to overlap the plurality of first terminals as viewed in a direction perpendicular to the top surface of the main body. A plurality of pairs of first and second terminals that are electrically connected via the wires include a plurality of pairs of a first terminal and a second terminal that are positioned not to overlap each other.

摘要翻译： 分层芯片封装包括主体和布线，其包括布置在主体的侧表面上的多根导线。 主体包括：主要部分，包括多个层部分; 多个第一端子，其设置在所述主体部的上表面并与所述布线连接; 以及多个第二端子，其设置在所述主体部的底面并与所述布线连接。 每个层部分包括半导体芯片。 多个第二端子被定位成在垂直于主体顶表面的方向上与多个第一端子重叠。 经由导线电连接的多对第一和第二端子包括定位为不彼此重叠的多对第一端子和第二端子。

公开(公告)号：US08325441B2

公开(公告)日：2012-12-04

申请号：US12662138

申请日：2010-03-31

申请人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Hironori Araki ,  Shigeki Tanemura ,  Atsushi Iijima

发明人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Hironori Araki ,  Shigeki Tanemura ,  Atsushi Iijima

IPC分类号： G11B5/02 ,  G11B11/10 ,  G11B5/31

CPC分类号： G11B5/6005 ,  G02B6/122 ,  G11B5/3116 ,  G11B5/314 ,  G11B5/3163 ,  G11B5/6088 ,  G11B2005/0021

摘要： A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The thermally assisted magnetic head includes a base layer which a base groove part having a width gradually getting smaller along a depth direction and extending in an intersecting direction intersecting with the medium-opposing surface is formed. The near-field light generating layer has an in-groove generating layer formed inside of the base groove part. The in-groove generating layer is formed along an inner wall surface of the base groove part and has a thin-film like structure.

摘要翻译： 一种热辅助磁头包括主磁极层，具有产生在介质相对表面内布置的近场光的产生端部分的近场光产生层和将光引导到近场光产生 层。 热辅助磁头包括基底层，基底槽部分的宽度随着深度方向逐渐变小并且在与介质相对表面相交的相交方向上延伸。 近场光产生层具有形成在基槽部内的内槽生成层。 槽内产生层沿着基部槽部的内壁面形成，具有薄膜状结构。

公开(公告)号：US08324741B2

公开(公告)日：2012-12-04

申请号：US13067195

申请日：2011-05-16

申请人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Tatsuya Harada ,  Nobuyuki Okuzawa ,  Satoru Sueki ,  Hiroshi Ikejima

发明人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Tatsuya Harada ,  Nobuyuki Okuzawa ,  Satoru Sueki ,  Hiroshi Ikejima

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L24/24 ,  H01L24/25 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/94 ,  H01L24/96 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2224/05554 ,  H01L2224/18 ,  H01L2224/32145 ,  H01L2224/48 ,  H01L2224/48463 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73267 ,  H01L2224/94 ,  H01L2225/06551 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/03

摘要： A layered chip package has a main body including pairs of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip. The pairs of layer portions include specific pairs of layer portions. Each of the specific pairs of layer portions includes a first-type layer portion and a second-type layer portion. The first-type layer portion includes electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the second-type layer portion does not include such electrodes. The specific pairs of layer portions are provided in an even number.

摘要翻译： 分层芯片封装具有包括一对层部分的主体和布置在主体的侧表面上的布线。 每个层部分包括半导体芯片。 这些层部分包括特定的层对。 每个特定的层部分对包括第一类型层部分和第二类型的部分。 第一型层部分包括各自连接到半导体芯片并且各自具有位于布置有布线的主体的侧表面的端面的电极，而第二型层部分不包括这样的电极。 特定的层部分对以偶数提供。

公开(公告)号：US08274165B2

公开(公告)日：2012-09-25

申请号：US12368643

申请日：2009-02-10

申请人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Atsushi Iijima

发明人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Atsushi Iijima

IPC分类号： H01L23/544

CPC分类号： H01L25/0657 ,  H01L23/3114 ,  H01L23/3178 ,  H01L24/24 ,  H01L2224/24145 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/00

摘要： A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: insulating layers formed in the plurality of groove portions; a rectangular unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode including an extended terminal portion extended from the unit region to the inside of the groove portion. The semiconductor substrate is manufactured by forming a plurality of groove portions along scribe lines; embedding an insulating material in the plurality of groove portions and planarizing a surface to form insulating layers; and forming a wiring electrode including an extended terminal portion extended from a rectangular unit region in contact with at least any one of the plurality of groove portions to the inside of the groove portion.

摘要翻译： 半导体基板具有沿划线形成的多个槽部。 半导体基板包括：形成在多个槽部中的绝缘层; 与所述多个槽部中的至少任一个接触的矩形单位区域; 以及布线电极，其包括从所述单元区域延伸到所述槽部的内部的延伸端子部。 通过沿着划线形成多个槽部来制造半导体衬底; 在多个凹槽部分中嵌入绝缘材料并使表面平坦化以形成绝缘层; 以及形成布线电极，所述布线电极包括从与所述多个槽部中的至少任一个接触的矩形单位区域延伸到所述槽部的内部的延伸端子部。

公开(公告)号：US08184398B2

公开(公告)日：2012-05-22

申请号：US12314565

申请日：2008-12-12

申请人： Hironori Araki ,  Yoshitaka Sasaki ,  Hiroyuki Ito ,  Takehiro Horinaka ,  Kazuo Ishizaki ,  Shigeki Tanemura

发明人： Hironori Araki ,  Yoshitaka Sasaki ,  Hiroyuki Ito ,  Takehiro Horinaka ,  Kazuo Ishizaki ,  Shigeki Tanemura

IPC分类号： G11B5/127 ,  C25F3/02

CPC分类号： G11B5/3106 ,  G11B5/17 ,  G11B5/3136 ,  Y10T428/1171

摘要： A magnetic head includes a coil, a pole layer, and a coil adjacent layer. The coil includes a winding portion having two side surfaces. The coil adjacent layer is adjacent to at least part of the whole of the two side surfaces of the winding portion. The coil adjacent layer is formed of a nonmagnetic material having a linear thermal expansion coefficient of 5×10−6/° C. or smaller at a temperature of 25° C. to 100° C. and having a thermal conductivity of 40 W/m·K or higher at a temperature of 25° C.

摘要翻译： 磁头包括线圈，极层和线圈相邻层。 线圈包括具有两个侧表面的绕组部分。 线圈相邻层与绕组部分的两个侧表面的整体的至少一部分相邻。 线圈相邻层由25℃〜100℃的线性热膨胀系数为5×10 -6 /℃以下的非磁性材料形成，导热率为40W / m·K以上的温度

公开(公告)号：US08182704B2

公开(公告)日：2012-05-22

申请号：US12232665

申请日：2008-09-22

申请人： Yoshitaka Sasaki ,  Hironori Araki ,  Hiroyuki Ito

发明人： Yoshitaka Sasaki ,  Hironori Araki ,  Hiroyuki Ito

IPC分类号： B44C1/22

CPC分类号： G11B5/3163 ,  G11B5/1278 ,  G11B5/3116 ,  Y10T29/49046 ,  Y10T29/49048

摘要： A thin-film magnetic head structure has a configuration adapted to manufacture a thin-film magnetic head configured such that a main magnetic pole layer including a magnetic pole tip on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the magnetic pole tip so as to form a recording gap layer on the medium-opposing surface side, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated. The magnetic pole tip of the main magnetic pole layer includes an even width portion having a substantially even width along an extending direction.

摘要翻译： 薄膜磁头结构具有适于制造薄膜磁头的结构，该薄膜磁头被构造成使得包括在相对于记录介质的介质相对表面侧的磁极尖端的主磁极层，写入屏蔽层 与磁极尖端相对以在介质相对表面侧上形成记录间隙层，并且缠绕在写入屏蔽层或主磁极层上的薄膜线圈被层压。 主磁极层的磁极尖端包括沿着延伸方向具有大致均匀宽度的均匀宽度部分。

公开(公告)号：US20110316141A1

公开(公告)日：2011-12-29

申请号：US12822601

申请日：2010-06-24

申请人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Hiroshi Ikejima ,  Atsushi Iijima

发明人： Yoshitaka Sasaki ,  Hiroyuki Ito ,  Hiroshi Ikejima ,  Atsushi Iijima

IPC分类号： H01L23/485 ,  H01L21/60 ,  H01L21/822

CPC分类号： H01L21/6835 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/522 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/95 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54453 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02317 ,  H01L2224/02321 ,  H01L2224/02371 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05008 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1146 ,  H01L2224/13144 ,  H01L2224/16148 ,  H01L2224/24011 ,  H01L2224/24146 ,  H01L2224/245 ,  H01L2224/2746 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32148 ,  H01L2224/81121 ,  H01L2224/8113 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/82005 ,  H01L2224/821 ,  H01L2224/82101 ,  H01L2224/82106 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/8313 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/9202 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/95001 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2221/68304

摘要： A layered chip package includes a main body, and wiring disposed on a side surface of the main body. The main body includes: a main part including a plurality of layer portions stacked; a plurality of first terminals disposed on the top surface of the main part and connected to the wiring; and a plurality of second terminals disposed on the bottom surface of the main part and connected to the wiring. The plurality of layer portions include a first-type layer portion and a second-type layer portion. The first-type layer portion includes a conforming semiconductor chip, and a plurality of first-type electrodes that are connected to the semiconductor chip and the wiring. The second-type layer portion includes a defective semiconductor chip, and a plurality of second-type electrodes that are connected to the wiring and not to the semiconductor chip.

摘要翻译： 分层芯片封装包括主体和布置在主体的侧表面上的布线。 主体包括：主要部分，其包括堆叠的多个层部分; 多个第一端子，其设置在所述主体部的上表面并与所述布线连接; 以及多个第二端子，其设置在所述主体部的底面并与所述布线连接。 多个层部分包括第一类型层部分和第二类型部分。 第一型层部分包括符合半导体芯片和连接到半导体芯片和布线的多个第一类型电极。 第二型层部分包括有缺陷的半导体芯片，以及多个第二类型电极，其连接到布线而不连接到半导体芯片。

公开(公告)号：US07978432B2

公开(公告)日：2011-07-12

申请号：US12232664

申请日：2008-09-22

申请人： Yoshitaka Sasaki ,  Hironori Araki ,  Hiroyuki Ito

发明人： Yoshitaka Sasaki ,  Hironori Araki ,  Hiroyuki Ito

IPC分类号： G11B5/147

CPC分类号： G11B5/3163 ,  G11B5/1278 ,  G11B5/3116 ,  Y10T29/49046 ,  Y10T29/49048

摘要： A thin-film magnetic head structure has a configuration adapted to manufacture a thin-film magnetic head configured such that a main magnetic pole layer including a magnetic pole tip on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the magnetic pole tip so as to form a recording gap layer on the medium-opposing surface side, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated. The magnetic pole tip of the main magnetic pole layer includes an even width portion having a substantially even width along an extending direction.

摘要翻译： 薄膜磁头结构具有适于制造薄膜磁头的结构，该薄膜磁头被构造成使得包括在相对于记录介质的介质相对表面侧的磁极尖端的主磁极层，写入屏蔽层 与磁极尖端相对以在介质相对表面侧上形成记录间隙层，并且缠绕在写入屏蔽层或主磁极层上的薄膜线圈被层压。 主磁极层的磁极尖端包括沿着延伸方向具有大致均匀宽度的均匀宽度部分。