Thin-film capacitative element and electronic circuit and electronic equipment including the same
    70.
    发明申请
    Thin-film capacitative element and electronic circuit and electronic equipment including the same 审中-公开
    薄膜电容元件与电子电路及电子设备相同

    公开(公告)号:US20060237760A1

    公开(公告)日:2006-10-26

    申请号:US10546498

    申请日:2004-02-20

    Inventor: Yukio Sakashita

    Abstract: A thin film capacitive element according to the present invention includes between a first electrode layer and a second electrode layer a dielectric layer formed of a dielectric material containing a bismuth layer structured compound having a composition represented by the stoichiometric compositional formula: (Bi2O2)2+ (Am−1BmO3m+1)2−, where a symbol m is a positive integer, a symbol A is at least one element selected from a group consisting of sodium, potassium, lead, barium, strontium, calcium and bismuth, and a symbol B is at least one element selected from a group consisting of iron, cobalt, chromium, gallium, titanium, niobium, tantalum, antimony, vanadium, molybdenum and tungsten. The thin film capacitive element having the above identified configuration can be made thin and has an excellent temperature compensating characteristic.

    Abstract translation: 根据本发明的薄膜电容元件在第一电极层和第二电极层之间包括由包含由化学计量组成式表示的组成的铋层结构化合物的电介质材料形成的电介质层:(Bi < (O 2)2 +(3-m-1)m O 3 O 3 符号A为选自钠,钾,铅,钡,锶等的至少一种元素,其中符号m为正整数,符号A为选自钠,钾,铅,钡,锶, 钙和铋,符号B是选自铁,钴,铬,镓,钛,铌,钽,锑,钒,钼和钨中的至少一种元素。 具有上述结构的薄膜电容元件可以变薄并且具有优异的温度补偿特性。

Patent Agency Ranking