公开(公告)号：US20100304104A1

公开(公告)日：2010-12-02

申请号：US12734823

申请日：2008-11-11

Applicant: Kunio Nagasaki ,  Yusuke Sugino ,  Kohei Doi

Inventor： Kunio Nagasaki ,  Yusuke Sugino ,  Kohei Doi

IPC: B32B25/08 ,  C09J7/02 ,  B32B27/30

CPC classification number: B32B25/08 ,  B32B5/022 ,  B32B5/024 ,  B32B5/028 ,  B32B5/14 ,  B32B5/147 ,  B32B7/06 ,  B32B7/12 ,  B32B25/06 ,  B32B25/12 ,  B32B25/14 ,  B32B27/06 ,  B32B27/08 ,  B32B27/10 ,  B32B27/12 ,  B32B27/16 ,  B32B27/18 ,  B32B27/281 ,  B32B27/285 ,  B32B27/288 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B29/005 ,  B32B29/02 ,  B32B29/06 ,  B32B2255/02 ,  B32B2255/10 ,  B32B2255/12 ,  B32B2255/26 ,  B32B2262/04 ,  B32B2270/00 ,  B32B2307/412 ,  B32B2307/50 ,  B32B2405/00 ,  C08F287/00 ,  C08J3/24 ,  C08J3/244 ,  C08J7/06 ,  C08J7/18 ,  C08J2367/02 ,  C08J2400/26 ,  C08J2409/06 ,  C08J2433/00 ,  C08J2433/02 ,  C08J2433/04 ,  C08J2433/06 ,  C08J2453/02 ,  C09D133/02 ,  C09J7/10 ,  C09J153/02 ,  C09J153/025 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2421/00 ,  C09J2433/00 ,  C09J2453/00 ,  Y10T428/2495 ,  Y10T428/28 ,  Y10T428/31826 ,  Y10T428/31833 ,  C08L53/02 ,  C08F220/18 ,  C08F220/06

Abstract: Provided is a viscoelastic article which exerts different properties between one surface and the other surface thereof, which has a transparent appearance, and which less causes staining of objects to which the viscoelastic article is adopted. The viscoelastic article is an article having a multilayer structure including a polymer layer, and a monomer-absorptive layer capable of absorbing at least one of monomer component(s) constituting the polymer, in which the polymer layer is a polymer layer containing an elastomer unevenly distributed and enriched at an interface, or in the vicinity thereof, opposite to the monomer-absorptive layer. The vicinity of the interface opposite to the monomer-absorptive layer is preferably a region ranging from the interface opposite to the other interface with the monomer-absorptive layer and occupying, in a thickness direction, 50% or less of the total thickness.

Abstract translation: 提供一种粘弹性制品，其在一个表面和另一个表面之间发挥不同的性质，其具有透明的外观，并且更少地导致采用粘弹性制品的物体的染色。 粘弹性体是具有包含聚合物层的多层结构的物品和能够吸收构成聚合物的单体成分中的至少一种的单体吸收层，其中聚合物层是含有不均匀的弹性体的聚合物层 在与单体吸收层相对的界面或其附近分布和富集。 与单体吸收层相反的界面附近优选为从与单体吸收层的其他界面相反的界面的范围，并且在厚度方向占据总厚度的50％以下。

公开(公告)号：US20100277885A1

公开(公告)日：2010-11-04

申请号：US12808967

申请日：2008-12-16

Applicant: Takashi Tatsuzawa ,  Kouji Kobayashi ,  Akihiro Ito

Inventor： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Akihiro Ito

IPC: H05K1/11 ,  H02G3/04

CPC classification number: H01R4/04 ,  C08K3/017 ,  C08K3/08 ,  C08K9/02 ,  C09J7/10 ,  C09J9/02 ,  C09J11/04 ,  C09J2201/36 ,  C09J2205/102 ,  H01R12/52 ,  H01R12/7076 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/1189

Abstract: A circuit connecting material which is situated between mutually opposing circuit electrodes and, upon pressing the mutually opposing circuit electrodes, electrically connects the electrodes in the pressing direction, the circuit connecting material having a laminated construction comprising an anisotropic conductive adhesive layer A with conductive particles 21 dispersed therein and an insulating adhesive layer B, wherein the adhesive force of the insulating adhesive layer B for glass substrates is greater than the adhesive force of the anisotropic conductive adhesive layer A for glass substrates.

Abstract translation: 位于相互相对的电路电极之间的电路连接材料，并且在按压相互相对的电路电极时沿着按压方向电连接电极，该电路连接材料具有包含各向异性导电粘合剂层A的导电粒子21 分散在其中以及绝缘粘合剂层B，其中用于玻璃基板的绝缘粘合剂层B的粘合力大于玻璃基板用各向异性导电粘合剂层A的粘合力。

公开(公告)号：US20100247835A1

公开(公告)日：2010-09-30

申请号：US12813887

申请日：2010-06-11

Applicant: Hsing-Tsung LIN ,  Chih-Ming Ou

Inventor： Hsing-Tsung LIN ,  Chih-Ming Ou

IPC: B32B33/00

CPC classification number: A47B91/00 ,  C09J7/10 ,  C09J2201/28 ,  C09J2201/36 ,  Y10T428/1476

Abstract: An elastic strip with self-adhesion effect of double viscosity has self-adhesive first, second elastic layers and at least a release paper. The first and second elastic layers are molded by mixing thermo plastic rubber, resin and bonding agent to realize self-adhesion and scalability of the entire plate structure. The first and second adhesion surfaces formed at one side of the first and second elastic layers not yet mated are provided with different adhesive strength. For two bonding surfaces formed at first and second elastic layers, the adhesive strength is larger than that of the first and second adhesion surfaces. The release paper is adhered onto either the first or second adhesion surface, and can be easily peeled off. Due to self-adhesion without debonding and residual gelatine, the elastic strip can be widely applied to multi-functional adhesive products resisting overturn, sliding, shock and theft, thus improving the living quality and convenience.

Abstract translation: 具有双重粘度的自粘附效果的弹性带具有自粘合的第一，第二弹性层和至少一个剥离纸。 第一和第二弹性层通过混合热塑性橡胶，树脂和粘合剂来模制，以实现整个板结构的自粘和可伸缩性。 形成在未配合的第一和第二弹性层的一侧上的第一和第二粘附表面具有不同的粘合强度。 对于形成在第一和第二弹性层处的两个接合表面，粘合强度大于第一和第二粘合表面的粘合强度。 剥离纸粘附到第一或第二粘合表面上，并且可以容易地剥离。 由于自粘而不脱粘和残留明胶，弹性带可广泛应用于抵抗翻转，滑动，冲击和盗窃的多功能粘合剂产品，从而提高生活质量和便利性。

公开(公告)号：US20100223872A1

公开(公告)日：2010-09-09

申请号：US12719799

申请日：2010-03-08

Applicant: STEVEN L. TAYLOR ,  NORMAN C. TRACY ,  CHARLES R. CORNMAN ,  JOHN W. McMULLEN ,  THOMAS R. PECK, JR.

Inventor： STEVEN L. TAYLOR ,  NORMAN C. TRACY ,  CHARLES R. CORNMAN ,  JOHN W. McMULLEN ,  THOMAS R. PECK, JR.

IPC: E04F13/09 ,  E04F13/08 ,  E04C2/24

CPC classification number: E04F13/0887 ,  C09J7/38 ,  C09J2201/128 ,  C09J2201/134 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2201/40 ,  E04F15/02155 ,  E04F15/02188 ,  E04F15/187

Abstract: The installation system and method for installing an architectural covering material to a substrate surface utilizes an adhesive mat having layers of adhesive and release layers arranged to allow the covering material to be initially positioned, and later repositioned to be permanently set. The adhesive mat includes a planar carrier member, one or more adhesive layers on at least one planar side of the planar carrier member, and at least one release layer of material removably covering the one or more adhesive layers. In one form, the adhesive mat includes a carrier sheet, first and second adhesive layers on opposing planar sides of the carrier sheet, and first and second release layers of material removably covering the two adhesive layers.

Abstract translation: 用于将建筑覆盖材料安装到基底表面的安装系统和方法利用具有布置成允许覆盖材料被初始定位并且随后重新定位以永久设置的粘合剂层和释放层的粘合剂垫。 粘合垫包括平面载体构件，在平面载体构件的至少一个平面侧上的一个或多个粘合剂层和至少一个可移除地覆盖一个或多个粘合剂层的材料释放层。 在一种形式中，粘合剂垫包括载体片，载体片的相对平面侧上的第一和第二粘合剂层，以及可移除地覆盖两个粘合剂层的材料的第一和第二释放层。

公开(公告)号：US20100129988A1

公开(公告)日：2010-05-27

申请号：US12625735

申请日：2009-11-25

Applicant: Hironao OOTAKE ,  Katsuhiko KAMIYA

Inventor： Hironao OOTAKE ,  Katsuhiko KAMIYA

IPC: H01L21/78 ,  C09J7/00

CPC classification number: B32B7/12 ,  B32B3/08 ,  B32B5/18 ,  B32B15/04 ,  B32B23/04 ,  B32B25/12 ,  B32B25/14 ,  B32B25/18 ,  B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/22 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/40 ,  B32B29/002 ,  B32B2255/205 ,  B32B2262/101 ,  B32B2307/21 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/516 ,  B32B2307/518 ,  B32B2307/54 ,  B32B2457/14 ,  C08J9/10 ,  C08J2207/02 ,  C08K5/23 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/006 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/19042 ,  Y10T428/31786 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

Abstract: The present invention provides a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film is a pressure-sensitive adhesive layer which contains a gas-generating agent in a ratio of 10 to 200 parts by weight based on 100 parts by weight of a base polymer, the base polymer is an acrylic polymer A composed of a monomer composition containing 50% by weight or more of an acrylic acid ester represented by CH2═CHCOOR (in which R is an alkyl group having 6 to 10 carbon atoms) and 1% by weight to 30% by weight of a hydroxyl group-containing monomer and containing no carboxyl group-containing monomer, and the die-bonding film is formed of a die-adhering layer.

Abstract translation: 本发明提供一种切片模片接合薄膜，包括：切割薄膜，其具有设置在基材上的压敏粘合剂层; 以及设置在压敏粘合剂层上的芯片接合膜，其中切割膜的压敏粘合剂层是含有气体发生剂的压敏粘合剂层，其比例为10-200份 基于100重量份的基础聚合物的重量，基础聚合物是由包含50重量％以上的由CH 2 = CHCOOR表示的丙烯酸酯（其中R是烷基）的单体组合物构成的丙烯酸类聚合物A 具有6〜10个碳原子）和1重量％〜30重量％的含羟基单体，不含有羧基的单体，并且芯片接合膜由模具粘附层形成。

公开(公告)号：US07718257B2

公开(公告)日：2010-05-18

申请号：US10415948

申请日：2001-11-07

Applicant: Akihisa Murata ,  Toshiyuki Oshima ,  Yukio Arimitsu ,  Kazuyuki Kiuchi

Inventor： Akihisa Murata ,  Toshiyuki Oshima ,  Yukio Arimitsu ,  Kazuyuki Kiuchi

IPC: B32B7/12 ,  B32B33/00 ,  B32B27/00

CPC classification number: C09J7/22 ,  C09J7/38 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/11 ,  Y10T428/14 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/249982 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2848 ,  Y10T428/2852

Abstract: A heat-peelable pressure-sensitive adhesive sheet comprises: a base material; and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres, the thermo-expandable pressure-sensitive adhesive layer having a surface to be adhered to an adherend, wherein the surface of the thermo-expandable pressure-sensitive adhesive layer before subjecting to heating has a centerline average roughness of greater than 0.4 μm, and has a convex portion resulting from the thermo-expandable microspheres.

Abstract translation: 一种可热剥离的压敏粘合片包括：基材; 以及含有热可膨胀性微球的热可膨胀压敏粘合剂层，所述热可膨胀压敏粘合剂层具有粘合到被粘物的表面，其中所述热可膨胀压敏粘合剂层的表面经受 加热时的中心线平均粗糙度大于0.4μm，并具有由热膨胀性微球形成的凸部。

公开(公告)号：US20100028687A1

公开(公告)日：2010-02-04

申请号：US12533395

申请日：2009-07-31

Applicant: Katsuhiko Kamiya ,  Takeshi Matsumura ,  Shuuhei Murata ,  Hironao Ootake

Inventor： Katsuhiko Kamiya ,  Takeshi Matsumura ,  Shuuhei Murata ,  Hironao Ootake

IPC: B32B27/08 ,  B32B27/38

CPC classification number: H01L21/6836 ,  C08L33/08 ,  C08L2205/02 ,  C08L2666/04 ,  C09J7/22 ,  C09J7/30 ,  C09J7/38 ,  C09J133/08 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2463/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2221/68327 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/3025 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising an acrylic ester A represented by CH2═CHCOOR1 (where R1 is an alkyl group having 6-10 carbon atoms), an acrylic ester B represented by CH2═CHCOOR2 (where R2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond, where the ratios of components are 40-10 mol % of the acrylic ester B to 60-90 mol % of the acrylic ester A, 10-30 mol % hydroxyl group-containing monomer to 100 mol % of the total of the acrylic ester A and the acrylic ester B, 70-90 mol % isocyanate compound to 100 mol % of the hydroxyl group-containing monomer, and the die-bonding film is formed from an epoxy resin.

Abstract translation: 一种在基材上具有压敏粘合剂层和压敏粘合剂层上的芯片接合膜的切割芯片接合膜，该压敏粘合剂层包含丙烯酸类聚合物，其包含由CH 2 -CHCOOR 1表示的丙烯酸酯A （其中R1是具有6-10个碳原子的烷基），由CH2-CHCOOR2（其中R2是具有11个或更多个碳原子的烷基）表示的丙烯酸酯B，含羟基的单体和异氰酸酯化合物 具有自由基反应性碳 - 碳双键，其中组分的比例为丙烯酸酯B的40-10摩尔％至丙烯酸酯A的60-90摩尔％，含有10-30摩尔％含羟基的单体至100 丙烯酸酯A和丙烯酸酯B，70-90mol％异氰酸酯化合物与100mol％含羟基单体的总摩尔％，芯片接合膜由环氧树脂形成。

公开(公告)号：US20100019365A1

公开(公告)日：2010-01-28

申请号：US12440495

申请日：2006-09-12

Applicant: Takeshi Matsumura ,  Sadahito Misumi

Inventor： Takeshi Matsumura ,  Sadahito Misumi

IPC: H01L23/00 ,  H01L21/301 ,  C09J7/00

CPC classification number: H01L24/83 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3142 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/85 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/48 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/3025 ,  Y10T428/26 ,  H01L2924/0675 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/05432 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer and a die bonding adhesive layer being sequentially laminated on a supporting substrate, wherein said pressure-sensitive adhesive layer has a thickness of 10 to 80 μm, and has a storage elastic modulus at 23° C. of 1×104 to 1×1010 Pa.

Abstract translation: 本发明涉及一种具有压敏粘合剂层和芯片接合粘合剂层的切割芯片接合膜，其顺序层压在支撑基板上，其中所述压敏粘合剂层的厚度为10至80μm，并且具有 在23℃下的储能弹性模量为1×10 4至1​​×10 10 Pa。

公开(公告)号：US07635516B2

公开(公告)日：2009-12-22

申请号：US10591940

申请日：2005-02-18

Applicant: Yukio Arimitsu ,  Daisuke Shimokawa

Inventor： Yukio Arimitsu ,  Daisuke Shimokawa

IPC: B32B7/12 ,  B32B15/04 ,  C08J9/16 ,  H01L21/00

CPC classification number: H01L21/6835 ,  C09J5/08 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/302 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K3/0058 ,  Y10T428/249984 ,  Y10T428/26 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2848

Abstract: Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer caused by pressurization, further reduce chipping in grinding and cutting processes, be easily peeled off from a processed article after processing, and can be easily applied to an adhered at ordinary temperature. The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate, the heat-expandable pressure-sensitive adhesive layer containing a foaming agent and having a shear modulus (23° C.) in an unfoamed state of 7×106 Pa or more. The adhesive sheet further includes a pressure-sensitive adhesive layer being arranged on or above heat-expandable pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer has a shear modulus (23° C.) of less than 7×106 Pa and a thickness of 0.01 to 10 μm.

Abstract translation: 公开了一种可以防止由加压引起的压敏粘合剂层的变形的热剥离性粘合片，进一步减少研磨和切割过程中的碎屑，在加工后容易从加工品中剥离，并且可以 容易在普通温度下施加于粘附物。 热剥离性粘合片包括基材和布置在基材的至少一侧上方的热膨胀性压敏粘合剂层，所述热膨胀性压敏粘合剂层含有发泡剂，并且具有 在7×10 6 Pa以上的未发泡状态下的剪切模量（23℃）。 粘合片还包括布置在热膨胀压敏粘合剂层上或上方的压敏粘合剂层，其中压敏粘合剂层的剪切模量（23℃）小于7×10 6 Pa，厚度 为0.01〜10um。

公开(公告)号：US20090269536A1

公开(公告)日：2009-10-29

申请号：US12110898

申请日：2008-04-28

Applicant: David J. Carter ,  Jonathan Bernstein ,  Peter Kerrebrock ,  Arnis Mangolds

Inventor： David J. Carter ,  Jonathan Bernstein ,  Peter Kerrebrock ,  Arnis Mangolds

IPC: F16B11/00 ,  F16B47/00

CPC classification number: F16B11/00 ,  C09J7/10 ,  C09J2201/134 ,  C09J2201/36 ,  Y10T156/10 ,  Y10T428/14 ,  Y10T428/1481 ,  Y10T428/1495 ,  Y10T428/24008 ,  Y10T428/24017 ,  Y10T428/28

Abstract: Adhesive systems may be fabricated to include first and second solid adhesion structures. The first adhesion structure may require an applied normal preload force to achieve adhesion to a surface. The second solid adhesion structure may be separate from but joined to the first adhesion structure such that both adhesion structures are jointly adherable to the surface upon application of the normal preload force.

Abstract translation: 可以制造粘合剂体系以包括第一和第二固体粘合结构。 第一粘合结构可能需要施加的正常预载力以实现与表面的粘附。 第二固体粘合结构可以与第一粘合结构分离，但是连接到第一粘合结构，使得两个粘合结构在施加正常预载力时可共同地粘附到表面。