Abstract:
The present invention relates to a conductive paste in which fine metal particles are dispersed into a chemical adsorption liquid produced from a mixture of at least an alkoxysilane compound, a silanol condensation catalyst, and a nonaqueous organic solvent to form an organic thin film comprising molecules covalently bound to the surface of the fine metal particle by having the surface of the fine metal particle react with the alkoxysilane compound, so that fine metal particles that are given a reactive function to the surface are produced while almost maintaining the original conductivity of the fine metal particles, and further the particles are pasted with an organic solvent.
Abstract:
A flame retardant which comprises an inorganic hydroxide and a carbodiimide-group-containing organic layer chemically bonded to the surface of the inorganic hydroxide. Examples of the carbodiimide-group-containing organic layer include a layer comprising a carbodiimide-group-containing compound represented by either of the following formulae. Due to the constitution, the flame retardant can be highly dispersed in a resin even when added in a high proportion and can give a molding inhibited from deteriorating in electrical properties, mechanical properties, etc. (X1)m-Z-[A-(R1—N═C═N)n—R1—NCO]1 (1) (X1)m-Z-[A-(R1—N═C═N)n—R1-A-Z-(X2)3])3 (2) [R1 represents a residue of an isocyanate compound; X1 and X2 each independently represents hydrogen, halogeno, etc.; Z's each independently represents silicon or titanium; A represents an organic group having a valence of 2 or higher containing a bond derived from an isocyanate group; m and l each is an integer of 1-3, provided that m+1=4; and n is an integer of 1-100.]
Abstract:
The present invention provides an article of manufacture using an electrophotographic printer to produce printed electronic circuits by printing a second conductive powder layer and a first thermoplastic layer in registration. The second conductive powder layer is permanently fixed to the first layer before removing conductive powder from portions of the substrate other than that coated with the thermoplastic patterned image.
Abstract:
There is disclosed a conductive particle used for an anisotropic conductive connection material for establishing conductive interconnection between e.g. a substrate and an electrical component. The conductive particle includes a base particle (2) exhibiting electrical conductivity at least on its surface and a continuous insulating resin film (3) formed by welding of fine particles (3a) of an insulating resin that composes the resin film. The surface of the base particle is coated with the continuous insulating resin film. There are formed voids at least between neighboring fine particles.
Abstract:
A silver fine powder comprising silver particles with an average particle diameter of 20 nm or less and having an organic protective material on the surface thereof, wherein the proportion of the organic protective material present is 0.05 to 25% by mass based on the total mass of the silver particles and the organic protective material. An amine compound having a molecular weight of 100 to 1,000 is preferably used as the organic protective material, and that having one or more unsaturated bond in one molecule is particularly preferred. This silver fine powder has, for example, a crystallite diameter in (111) crystal plane of silver particle of 20 nm or less. The present invention further provides an ink comprising particles of the silver fine powder dispersed in an organic solvent in the silver concentration of 10% by mass or more, the ink having a viscosity of 50 mPa·s or less.
Abstract:
A solder composition containing a lead-free SnZn alloy and a solder flux that contains at least an epoxy resin and an organic carboxylic acid. The organic carboxylic acid is dispersed in the solder composition as a solid at room temperature, and has a molecular weight of from 100 to 200 g/mol.
Abstract:
A voltage switchable dielectric material comprising a concentration of multi-component particles that are individually formed by a mechanical or mechanochemical bonding process that bonds a semiconductive or conductive-type host particle with multiple insulative, conductive, or semi-conductive guest particles.
Abstract:
Insulated conductive particles, anisotropic adhesive films, and electrical connections using the same are provided.In some embodiments of the present invention, an insulated conductive particle includes a conductive particle with insulating microparticles bound thereto, wherein the insulating microparticles include a hard particle region and a soft functional resin region, and wherein the soft functional resin region includes a functional group capable of binding a metal.
Abstract:
A flame-retardant epoxy resin composition, as well as an electronic device, a laminated circuit board, a multilayered circuit board and a printed circuit board employing the flame-retardant epoxy resin composition are disclosed. The flame-retardant epoxy resin composition contains: an epoxy resin; an epoxy resin curing agent; and flame-retardant particles containing a metal hydrate. The flame-retardant particles are provided with a coating layer on the surfaces thereof and have a volume average particle diameter in a range from 1 to 500 nm.
Abstract:
A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.