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781.
公开(公告)号:US10223299B2
公开(公告)日:2019-03-05
申请号:US15101870
申请日:2014-12-18
Applicant: RAMBUS INC.
Inventor: Frederick A. Ware , Abhijit Abhyankar , Suresh Rajan
Abstract: A memory controller and buffers on memory modules each operate in two modes, depending on the type of mother-board through which the controller and modules are connected. In a first mode, the controller transmits decoded chip-select signals independently to each module, and the motherboard data channel uses multi-drop connections to each module. In a second mode, the motherboard has point-to-point data channel and command address connections to each of the memory modules, and the controller transmits a fully encoded chip-select signal group to each module. The buffers operate modally to correctly select ranks or partial ranks of memory devices on one or more modules for each transaction, depending on the mode.
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公开(公告)号:US10198314B2
公开(公告)日:2019-02-05
申请号:US14285467
申请日:2014-05-22
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Suresh Rajan , Brent Haukness , Scott C. Best , Wayne F. Ellis
Abstract: A memory device is disclosed that includes a row of storage locations to store a data word, and a spare row element. The data word is encoded via an error code for generating error information for correcting X bit errors or detecting Y bit errors, where Y is greater than X. The spare row element has substitute storage locations. The logic is responsive to detected errors to (1) enable correction of a data word based on the error information where there are no more than X bit errors, and (2) substitute the spare row element for a portion of the row where there are at least Y bit errors in the data word.
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公开(公告)号:US10191822B2
公开(公告)日:2019-01-29
申请号:US15114795
申请日:2014-12-19
Applicant: RAMBUS INC.
Inventor: Frederick A. Ware , J. James Tringali , Ely Tsern
Abstract: The embodiments described herein describe technologies for non-volatile memory persistence in a multi-tiered memory system including two or more memory technologies for volatile memory and non-volatile memory.
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公开(公告)号:US10170170B2
公开(公告)日:2019-01-01
申请号:US15798136
申请日:2017-10-30
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Ely K. Tsern , Brian S. Leibowitz , Wayne Frederick Ellis , Akash Bansal , John Welsford Brooks , Kishore Ven Kasamsetty
Abstract: In a multirank memory system in which the clock distribution trees of each rank are permitted to drift over a wide range (e.g., low power memory systems), the fine-interleaving of commands between ranks is facilitated through the use of techniques that cause each addressed rank to properly sample commands intended for that rank, notwithstanding the drift. The ability to perform such “microthreading” provides for substantially enhanced memory capacity without sacrificing the performance of single rank systems. This disclosure provides methods, memory controllers, memory devices and system designs adapted to these ends.
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公开(公告)号:US10168933B2
公开(公告)日:2019-01-01
申请号:US15942260
申请日:2018-03-30
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Robert E. Palmer , John W. Poulton
Abstract: A system includes a memory controller and a memory device having a command interface and a plurality of memory banks, each with a plurality of rows of memory cells. The memory controller transmits an auto-refresh command to the memory device. Responsive to the auto-refresh command, during a first time interval, the memory device performs refresh operations to refresh the memory cells and the command interface of the memory device is placed into a calibration mode for the duration of the first time interval. Concurrently, during at least a portion of the first time interval, the memory controller performs a calibration of the command interface of the memory device. The auto-refresh command may specify an order in which memory banks of the memory device are to be refreshed, such that the memory device sequentially refreshes a respective row in the plurality of memory banks in the specified bank order.
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公开(公告)号:US20180366181A1
公开(公告)日:2018-12-20
申请号:US16011539
申请日:2018-06-18
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , John Eric Linstadt , Kenneth L. Wright
IPC: G11C11/4093 , G06F11/10 , G11C29/52 , G11C7/02 , G11C11/4096
CPC classification number: G11C11/4093 , G06F11/1048 , G11C7/02 , G11C11/4096 , G11C29/52 , G11C2029/0411
Abstract: Described are memory modules that support different error detection and correction (EDC) schemes in both single- and multiple-module memory systems. The memory modules are width configurable and support the different EDC schemes for relatively wide and narrow module data widths. Data buffers on the modules support the half-width and full-width modes, and also support time-division-multiplexing to access additional memory components on each module in support of enhanced EDC.
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公开(公告)号:US10133338B2
公开(公告)日:2018-11-20
申请号:US15589651
申请日:2017-05-08
Applicant: RAMBUS INC.
Inventor: Dinesh Patil , Amir Amirkhany , Farrukh Aquil , Kambiz Kaviani , Frederick A. Ware
IPC: G11C8/00 , G06F1/32 , G06F5/06 , G11C7/10 , G11C11/4093 , G11C11/4076 , G11C7/22 , H03L7/081 , G11C7/04
Abstract: Embodiments generally relate to a memory device. In one embodiment, the memory device includes a clock receiver circuit that receives an external clock signal and provides an internal clock signal. The memory device also includes a delay-locked loop circuit (DLL) having an input, and a circuit that receives the internal clock signal. The circuit selects which pulses of the internal clock signal are applied to the input of the DLL, such that no more than two clock pulses selected from at least three consecutive pulses of the external clock signal are applied to the input of the DLL during a predetermined interval. In another embodiment, a method includes receiving an external clock signal at a clock receiver circuit, receiving an internal clock signal from the clock receiver circuit, and selecting which pulses of the internal clock signal are applied to an input of a DLL, where no more than two clock pulses selected from at least three consecutive pulses of the external clock signal are applied to the input of the DLL during a predetermined interval.
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公开(公告)号:US10102887B2
公开(公告)日:2018-10-16
申请号:US15793029
申请日:2017-10-25
Applicant: Rambus Inc.
Inventor: Frederick A. Ware
Abstract: A lateral transfer path within an adjustable-width signaling interface of an integrated circuit component is formed by a chain of logic segments that may be intercoupled in different groups to effect the lateral data transfer required in different interface width configurations, avoiding the need for a dedicated transfer path per width configuration and thereby substantially reducing number of interconnects (and thus the area) required to implement the lateral transfer structure.
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公开(公告)号:US20180268882A1
公开(公告)日:2018-09-20
申请号:US15916193
申请日:2018-03-08
Applicant: Rambus Inc.
Inventor: Richard E. Perego , Frederick A. Ware
CPC classification number: G11C7/1072 , G06F13/1678 , G06F13/1684 , G06F13/1694 , G11C5/06 , G11C7/1045 , G11C7/1075
Abstract: A memory system includes a memory controller with a plurality N of memory-controller blocks, each of which conveys independent transaction requests over external request ports. The request ports are coupled, via point-to-point connections, to from one to N memory devices, each of which includes N independently addressable memory blocks. All of the external request ports are connected to respective external request ports on the memory device or devices used in a given configuration. The number of request ports per memory device and the data width of each memory device changes with the number of memory devices such that the ratio of the request-access granularity to the data granularity remains constant irrespective of the number of memory devices.
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公开(公告)号:US20180211701A1
公开(公告)日:2018-07-26
申请号:US15872840
申请日:2018-01-16
Applicant: Rambus Inc.
Inventor: Frederick A. Ware
IPC: G11C11/4093 , G11C11/4096 , G11C5/04
Abstract: A stacked semiconductor device is disclosed that includes a plurality of semiconductor dies. Each die has oppositely disposed first and second surfaces, with pads formed on each of the surfaces. A plurality of through-vias connect respective pads on the first surface to respective pads on the second surface. The through-vias include a first group of through-vias coupled to respective I/O circuitry on the semiconductor die and a second group of through-vias not coupled to I/O circuitry on the semiconductor die. The plurality of semiconductor dies are stacked such that the first group of through-vias in a first one of the plurality of semiconductor dies are aligned with respective ones of at least a portion of the second group of through-vias in a second one of the plurality of semiconductor dies.
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