公开(公告)号：US08324878B2

公开(公告)日：2012-12-04

申请号：US12610959

申请日：2009-11-02

Applicant: Dong Ho Lee

Inventor： Dong Ho Lee

IPC: G05F1/40

CPC classification number: H02M3/1588 ,  Y02B70/1466

Abstract: A voltage regulator includes an active control switch, an active sync switch, a driver circuit, and a gate resistor. The active control switch is coupled between an input voltage line and an input of an energy storage device. The active sync switch is coupled to the input of the energy storage device. The driver circuit is coupled to the control and sync switches to alternately drive each of the control and sync switches into a conducting state to produce a regulated voltage at an output of the energy storage device. The gate resistor is coupled in series within a control path of the sync switch. The gate resistor has a resistance value that is tuned to reduce an anticipated dead time between a turn-off time of the sync switch and a turn-on time of the control switch.

Abstract translation: 电压调节器包括有源控制开关，有源同步开关，驱动电路和栅极电阻。 有源控制开关耦合在输入电压线和能量存储装置的输入端之间。 主动同步开关耦合到能量存储装置的输入端。 驱动器电路耦合到控制和同步开关以交替地将每个控制和同步开关驱动到导通状态，以在能量存储装置的输出处产生调节电压。 栅极电阻器在同步开关的控制路径内串联耦合。 栅极电阻器具有被调节的电阻值，以减少同步开关的关断时间和控制开关的导通时间之间的预期死区时间。

公开(公告)号：US20120273477A1

公开(公告)日：2012-11-01

申请号：US13456897

申请日：2012-04-26

Applicant: Guen Yong PARK ,  Jae Hyoun Kim ,  Cheol Jin Kim ,  Han Seong Kang ,  Jin Hae Cho ,  Eun Oh Kim ,  Chan Park ,  Dong-Ho Lee

Inventor： Guen Yong PARK ,  Jae Hyoun Kim ,  Cheol Jin Kim ,  Han Seong Kang ,  Jin Hae Cho ,  Eun Oh Kim ,  Chan Park ,  Dong-Ho Lee

IPC: A47J27/21 ,  H05B3/02

CPC classification number: F24C15/327

Abstract: A steam cooking apparatus with improved water supply and drainage structures. The apparatus includes a body, a cooking compartment, a steam generator to supply steam into the cooking compartment, a water vessel to store water and supply the water into the steam generator, a water supply device including a holder and a slider slidably mounted in the holder so as to be withdrawn from the body, a first water supply tube connecting the slider and the water vessel, a second water supply tube connecting the water vessel and the steam generator, and a drain tube to drain water in the steam generator to the outside of the body. The drain tube includes an end fixed to the slider so that the end of the drain tube is withdrawn with the slider from the body when water in the steam generator is drained to the outside.

Abstract translation: 具有改善给排水结构的蒸汽烹饪设备。 该装置包括主体，烹饪室，蒸汽发生器，以将蒸汽供应到烹饪室中，水容器，用于存储水并将水供应到蒸汽发生器中;供水装置，其包括保持器和可滑动地安装在所述蒸汽发生器中的滑块 保持器，以便从身体中取出，连接滑块和水容器的第一供水管，连接水容器和蒸汽发生器的第二供水管和排水管，以将蒸汽发生器中的水排出到 身体外。 排水管包括固定到滑块的端部，使得当蒸汽发生器中的水排出到外部时，排水管的端部与滑块一起从主体被抽出。

公开(公告)号：US08288738B2

公开(公告)日：2012-10-16

申请号：US12613118

申请日：2009-11-05

Applicant: Seong-ho Cho ,  Dong-ho Lee

Inventor： Seong-ho Cho ,  Dong-ho Lee

IPC: G01N21/76 ,  G01T1/10

CPC classification number: G01N21/6452 ,  G01N21/6454 ,  G01N2021/6439 ,  G01N2021/6478 ,  G01N2035/00158

Abstract: A substrate for detecting samples includes; a body, and a plurality of micro lenses arranged on the body and configured for attachment to at least one sample, wherein the at least one sample emits fluorescent light, and wherein the plurality of micro lenses condense the fluorescent light emitted from the at least one sample via refraction.

Abstract translation: 用于检测样品的衬底包括： 主体和多个微透镜，其布置在主体上并且被配置为附接到至少一个样品，其中所述至少一个样品发射荧光，并且其中所述多个微透镜将从所述至少一个样品发射的荧光冷凝 样品通过折射。

公开(公告)号：US20120129334A1

公开(公告)日：2012-05-24

申请号：US13365378

申请日：2012-02-03

Applicant: Hyun-Soo CHUNG ,  Jae-Shin Cho ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang ,  Seung-Duk Baek

Inventor： Hyun-Soo CHUNG ,  Jae-Shin Cho ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang ,  Seung-Duk Baek

IPC: H01L21/768

CPC classification number: H01L24/91 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00

Abstract: Provided are semiconductor packages and methods of manufacturing the semiconductor package. The semiconductor packages may include a substrate including a chip pad, a redistributed line which is electrically connected to the chip pad and includes an opening. The semiconductor packages may also include an external terminal connection portion, and an external terminal connection pad which is disposed at an opening and electrically connected to the redistributed line. The present general inventive concept can solve the problem where an ingredient of gold included in a redistributed line may be prevented from being diffused into an adjacent bump pad to form a void or an undesired intermetallic compound. In a chip on chip structure, a plurality of bumps of a lower chip are connected to an upper chip to improve reliability, diversity and functionality of the chip on chip structure.

Abstract translation: 提供半导体封装和制造半导体封装的方法。 半导体封装可以包括衬底，其包括芯片焊盘，电连接到芯片焊盘并且包括开口的再分布线。 半导体封装还可以包括外部端子连接部分和设置在开口处并电连接到重新分配线路的外部端子连接焊盘。 本发明的总体构思可以解决包含在再分布线中的金的成分被阻止扩散到相邻的凸块焊盘中以形成空隙或不期望的金属间化合物的问题。 在片上芯片结构中，下部芯片的多个凸起连接到上部芯片以提高片上芯片结构的可靠性，分集性和功能性。

公开(公告)号：US20120098871A1

公开(公告)日：2012-04-26

申请号：US13167155

申请日：2011-06-23

Applicant: Tae-Hyeong PARK ,  Dong-Ho LEE ,  Joon-Ha PARK ,  Sang-Cheol SHIN

Inventor： Tae-Hyeong PARK ,  Dong-Ho LEE ,  Joon-Ha PARK ,  Sang-Cheol SHIN

IPC: G09G5/10 ,  H01L33/08

CPC classification number: G09G3/2003 ,  G09G3/36 ,  G09G3/3607 ,  G09G3/3614 ,  G09G3/3688 ,  G09G2300/0426 ,  G09G2300/0452 ,  G09G2310/027 ,  G09G2310/0281 ,  G09G2310/0297 ,  G09G2320/0242 ,  G09G2320/0247 ,  G09G2320/0276 ,  G09G2340/06

Abstract: A display panel includes a plurality of pixels including at least four even-numbered subpixels. The at least four even-numbered subpixels includes: a first red subpixel including a pixel electrode electrically connected to a switching element which is connected to a first data line and a first gate line; a first green subpixel including a pixel electrode electrically connected to a switching element which is connected to a second data line and a second gate line, where the second data line is disposed adjacent to the first data line; a first blue subpixel including a pixel electrode electrically connected to a switching element which is connected to the first data line and the second gate line; and a first multi-primary subpixel including a pixel electrode electrically connected to a switching element which is connected to the second data line and the first gate line.

Abstract translation: 显示面板包括包括至少四个偶数子像素的多个像素。 所述至少四个偶数子像素包括：第一红色子像素，包括电连接到与第一数据线和第一栅极线连接的开关元件的像素电极; 第一绿色子像素，包括电连接到与第二数据线连接的开关元件的像素电极和第二栅极线，其中第二数据线被布置为与第一数据线相邻; 第一蓝色子像素，包括电连接到与第一数据线和第二栅极线连接的开关元件的像素电极; 以及包括与连接到第二数据线和第一栅极线的开关元件电连接的像素电极的第一多原子像素。

公开(公告)号：US08053807B2

公开(公告)日：2011-11-08

申请号：US12923554

申请日：2010-09-28

Applicant: Yong-Chai Kwon ,  Dong-Ho Lee

Inventor： Yong-Chai Kwon ,  Dong-Ho Lee

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/3121 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2224/03

Abstract: A semiconductor package may include a semiconductor pattern, a bonding pad, and a polymer insulation member. The semiconductor pattern may include a semiconductor device and first hole. The bonding pad may include a wiring pattern and plug. The wiring pattern may be formed on an upper face of the semiconductor pattern. The plug may extend from the wiring pattern to fill the first hole. The polymer insulation member may be formed on a lower face of the semiconductor pattern and may include a second hole exposing a lower end of the plug. A method of manufacturing a semiconductor package may include forming a first hole through a semiconductor substrate; forming a bonding pad and plug; attaching a supporting member to the upper face of the substrate; reducing a thickness of the substrate; forming a polymer insulation member on the lower face of the substrate; and cutting the substrate.

Abstract translation: 半导体封装可以包括半导体图案，接合焊盘和聚合物绝缘构件。 半导体图案可以包括半导体器件和第一孔。 接合焊盘可以包括布线​​图案和插头。 布线图案可以形成在半导体图案的上表面上。 插头可以从布线图案延伸以填充第一孔。 聚合物绝缘构件可以形成在半导体图案的下表面上，并且可以包括暴露插头的下端的第二孔。 制造半导体封装的方法可以包括通过半导体衬底形成第一孔; 形成焊盘和插头; 将支撑构件附接到所述基板的上表面; 减小基板的厚度; 在所述基板的下表面上形成聚合物绝缘部件; 并切割基板。

公开(公告)号：US07944539B2

公开(公告)日：2011-05-17

申请号：US10412451

申请日：2003-04-11

Applicant: Dong-Ho Lee

Inventor： Dong-Ho Lee

IPC: G02F1/1345 ,  G02F1/1343 ,  G02F1/1339

CPC classification number: G02F1/13454 ,  G02F1/133345 ,  G02F1/1339 ,  G02F1/136227 ,  G02F1/136286 ,  G02F1/1368 ,  G02F2203/09

Abstract: An LCD device provides enhanced display quality. An insulating layer is formed on a first substrate. The insulating layer covers the contact portion of a switching device in which the switching device is electrically connected to a transparent electrode and has an opening for exposing a portion of the transparent electrode. A reflection electrode is electrically connected to the transparent electrode through the opening. The insulation layer covers a first portion of a driving circuit formed on the first substrate. A sealant is interposed between the first and second substrate to engage the first and second substrate and to cover a second portion of the driving circuit. Therefore, the driver circuit may operate normally, and the distortion of the signal outputted from the driver circuit may be prevented.

Abstract translation: LCD设备提供增强的显示质量。 在第一基板上形成绝缘层。 绝缘层覆盖开关器件的接触部分，其中开关器件电连接到透明电极并且具有用于暴露透明电极的一部分的开口。 反射电极通过开口与透明电极电连接。 绝缘层覆盖形成在第一基板上的驱动电路的第一部分。 密封剂插入在第一和第二基板之间以与第一和第二基板接合并覆盖驱动电路的第二部分。 因此，驱动器电路可以正常工作，并且可以防止从驱动器电路输出的信号的失真。

公开(公告)号：US07868836B2

公开(公告)日：2011-01-11

申请号：US11747100

申请日：2007-05-10

Applicant: Orest Genrihovich Vendik ,  Ivan Andreevich Pakhomov ,  An Sun Hyun ,  Kang Jae Jung ,  Dong Ho Lee

Inventor： Orest Genrihovich Vendik ,  Ivan Andreevich Pakhomov ,  An Sun Hyun ,  Kang Jae Jung ,  Dong Ho Lee

IPC: H01Q21/00

CPC classification number: H01Q7/00 ,  H01Q9/285 ,  H01Q21/29

Abstract: An antenna for a mobile terminal includes a substrate, a dipole placed on the substrate, a loop placed on the substrate, and a matching circuit on the substrate. The matching circuit comprises at least one of a variable capacitor or a variable inductor. The radiation center of the loop substantially coincides with the radiation center of the dipole.

Abstract translation: 用于移动终端的天线包括衬底，放置在衬底上的偶极子，放置在衬底上的环以及衬底上的匹配电路。 匹配电路包括可变电容器或可变电感器中的至少一个。 环的辐射中心基本上与偶极子的辐射中心重合。

公开(公告)号：US07825468B2

公开(公告)日：2010-11-02

申请号：US12003544

申请日：2007-12-28

Applicant: Yong-Chai Kwon ,  Dong-Ho Lee

Inventor： Yong-Chai Kwon ,  Dong-Ho Lee

IPC: H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L23/04 ,  H01L23/48

CPC classification number: H01L23/3121 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2224/03

Abstract: A semiconductor package may include a semiconductor pattern, a bonding pad, and a polymer insulation member. The semiconductor pattern may include a semiconductor device and first hole. The bonding pad may include a wiring pattern and plug. The wiring pattern may be formed on an upper face of the semiconductor pattern. The plug may extend from the wiring pattern to fill the first hole. The polymer insulation member may be formed on a lower face of the semiconductor pattern and may include a second hole exposing a lower end of the plug. A method of manufacturing a semiconductor package may include forming a first hole through a semiconductor substrate; forming a bonding pad and plug; attaching a supporting member to the upper face of the substrate; reducing a thickness of the substrate; forming a polymer insulation member on the lower face of the substrate; and cutting the substrate.

Abstract translation: 半导体封装可以包括半导体图案，接合焊盘和聚合物绝缘构件。 半导体图案可以包括半导体器件和第一孔。 接合焊盘可以包括布线​​图案和插头。 布线图案可以形成在半导体图案的上表面上。 插头可以从布线图案延伸以填充第一孔。 聚合物绝缘构件可以形成在半导体图案的下表面上，并且可以包括暴露插头的下端的第二孔。 制造半导体封装的方法可以包括通过半导体衬底形成第一孔; 形成焊盘和插头; 将支撑构件附接到所述基板的上表面; 减小基板的厚度; 在所述基板的下表面上形成聚合物绝缘部件; 并切割基板。

公开(公告)号：US20100148866A1

公开(公告)日：2010-06-17

申请号：US12711480

申请日：2010-02-24

Applicant: Chang-Ho Lee ,  Kyu Hwan An ,  Ki Seok Yang ,  Jaejoon Chang ,  Wangmyong Woo ,  Younsuk Kim ,  Haksun Kim ,  Ockgoo Lee ,  Dong Ho Lee ,  Hyungwook Kim ,  Joy Laskar

Inventor： Chang-Ho Lee ,  Kyu Hwan An ,  Ki Seok Yang ,  Jaejoon Chang ,  Wangmyong Woo ,  Younsuk Kim ,  Haksun Kim ,  Ockgoo Lee ,  Dong Ho Lee ,  Hyungwook Kim ,  Joy Laskar

IPC: H03F1/00 ,  H01F41/06

CPC classification number: H03F3/211 ,  H01F2017/0046 ,  H03F1/3211 ,  H03F3/195 ,  H03F3/45183 ,  H03F3/45475 ,  H03F3/604 ,  H03F2200/451 ,  H03F2200/537 ,  H03F2200/541 ,  H03F2203/21139 ,  H03F2203/21157 ,  H03F2203/45704 ,  H03F2203/45706 ,  H03F2203/45731 ,  Y10T29/49071

Abstract: Systems and methods may be provided for a power amplifier system. The systems and methods may include a plurality of power amplifiers, where each power amplifier includes at least one output port. The systems and methods may also include a plurality of primary windings each having a first number of turns, where each primary winding is connected to at least one output port of the plurality of power amplifiers, and a single secondary winding inductively coupled to the plurality of primary windings, where the secondary winding includes a second number of turns greater than the first number of turns.

Abstract translation: 可以为功率放大器系统提供系统和方法。 系统和方法可以包括多个功率放大器，其中每个功率放大器包括至少一个输出端口。 系统和方法还可以包括多个初级绕组，每个初级绕组具有第一圈数，其中每个初级绕组连接到多个功率放大器的至少一个输出端口，以及感应耦合到多个 初级绕组，其中次级绕组包括大于第一匝数的第二匝数。