公开(公告)号：US08339796B2

公开(公告)日：2012-12-25

申请号：US12972355

申请日：2010-12-17

Applicant: Sang Chul Lee ,  Jung Soo Byun ,  Jin Seon Park ,  Doo Hwan Lee

Inventor： Sang Chul Lee ,  Jung Soo Byun ,  Jin Seon Park ,  Doo Hwan Lee

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/4652 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.

Abstract translation: 公开了一种嵌入式印刷电路板，其中可以将具有不同厚度的电子器件嵌入到一起，从而实现高密度电子器件，并且当嵌入具有相当不同厚度的电子器件时，可以将相对较薄的两个电子器件嵌入 垂直方向，从而减少了嵌入区域并抑制了印刷电路板的翘曲，并且将其厚度可变地调节的绝缘构件插入在基底之间，使得电子器件之间的空间被完全填充，从而解决了问题 的空隙缺陷，导致可靠的印刷电路板，并且当基底包括由金属制成的芯时，印刷电路板可以较少翘曲。 还提供了一种制造嵌入式印刷电路板的方法。

公开(公告)号：US08236260B2

公开(公告)日：2012-08-07

申请号：US12109161

申请日：2008-04-24

Applicant: Kang-hee Lee ,  Doo-hwan Lee ,  Hyun-chul Lee

Inventor： Kang-hee Lee ,  Doo-hwan Lee ,  Hyun-chul Lee

IPC: B01J8/00

CPC classification number: B01J12/00 ,  B01J12/007 ,  B01J2219/00006 ,  B01J2219/0004 ,  B01J2219/00103 ,  B01J2219/00117 ,  B01J2219/00157 ,  B01J2219/00159 ,  C01B3/34 ,  C01B3/48 ,  C01B3/583 ,  C01B3/586 ,  C01B2203/0233 ,  C01B2203/0283 ,  C01B2203/044 ,  C01B2203/0445 ,  C01B2203/047 ,  C01B2203/066 ,  C01B2203/0811 ,  C01B2203/0866 ,  C01B2203/0872 ,  C01B2203/0883 ,  C01B2203/1241 ,  C01B2203/1258 ,  C01B2203/145

Abstract: A fuel processor that extracts, from a fuel source, hydrogen gas used for an electricity generation reaction. The fuel processor includes a reformer that generates hydrogen gas by reacting a fuel source with water, a burner that heats the reformer to an appropriate temperature for a hydrogen generation reaction, a CO remover that removes CO generated during the hydrogen generation reaction in the reformer, and a heat exchanger for cooling the CO remover.

Abstract translation: 一种燃料处理器，其从燃料源中提取用于发电反应的氢气。 燃料处理机包括通过使燃料源与水反应产生氢气的重整器，将重整器加热到适合的氢气生成反应温度的燃烧器，去除在重整器中产氢反应期间产生的CO的CO去除剂， 以及用于冷却CO去除剂的热交换器。

公开(公告)号：US08202660B2

公开(公告)日：2012-06-19

申请号：US13238494

申请日：2011-09-21

Applicant: Hyun-chul Lee ,  Kang-hee Lee ,  Doo-hwan Lee ,  Jin S. Heo

Inventor： Hyun-chul Lee ,  Kang-hee Lee ,  Doo-hwan Lee ,  Jin S. Heo

IPC: H01M8/04 ,  H01M8/06

CPC classification number: H01M8/0612 ,  H01M8/04007 ,  H01M8/0668

Abstract: A fuel cell system including a fuel processor, and a method of operating the fuel cell system, the fuel cell system includes: a reformer that reforms a hydrocarbon group fuel source into a reformed gas; a burner that heats the reformer; a CO remover unit that removes CO from a reformed gas generated by the reformer; a stack to generate electricity using the reformed gas; a first burner fuel supply line to supply the hydrocarbon group fuel source to the burner; and a second burner fuel supply line to supply the reformed gas from the CO remover unit to the burner.

Abstract translation: 一种燃料电池系统，包括燃料处理器和操作燃料电池系统的方法，所述燃料电池系统包括：将烃类燃料源重整成重整气体的重整器; 加热改性剂的燃烧器; CO除去单元，其从由重整器产生的重整气体中除去CO; 使用改性气体发电的堆叠; 第一燃烧器燃料供应管线，用于向燃烧器供应烃类燃料源; 以及第二燃烧器燃料供应管线，用于将重整气体从CO去除器单元供应到燃烧器。

公开(公告)号：US08184448B2

公开(公告)日：2012-05-22

申请号：US11703814

申请日：2007-02-08

Applicant: Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

Inventor： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC: H05K1/16

CPC classification number: H01L23/5389 ,  H01L23/13 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/05599

Abstract: A PCB having an embedded bare chip includes an insulated substrate having a penetration hole formed therein; a filler filling up an inside of the penetration hole; a bare chip embedded in the filler such that electrode pads formed on one side thereof are exposed at the surface of the filler; and an electrode bump attached to a surface of the electrode pads and protruded to be exposed to the outside.

Abstract translation: 具有嵌入式裸芯片的PCB包括其中形成有穿透孔的绝缘基板; 填充物穿透孔内部的填充物; 嵌入填料中的裸芯片，使得在其一侧形成的电极焊盘在填料的表面露出; 以及附着到电极焊盘的表面并突出以暴露于外部的电极凸块。

公开(公告)号：US20120061833A1

公开(公告)日：2012-03-15

申请号：US12972310

申请日：2010-12-17

Applicant: Tae Sung JEONG ,  Doo Hwan LEE ,  Seung Eun LEE

Inventor： Tae Sung JEONG ,  Doo Hwan LEE ,  Seung Eun LEE

IPC: H01L23/485 ,  H01L21/60

CPC classification number: H01L24/11 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/2919 ,  H01L2224/32155 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/83001 ,  H01L2224/838 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed herein are an embedded ball grid array substrate and a manufacturing method thereof. The embedded ball grid array includes: a core layer having a cavity therein; a semiconductor device embedded in the cavity of the core layer; a first circuit layer having a circuit pattern including a wire bonding pad formed thereon; a second circuit layer having a circuit pattern including a solder ball pattern formed thereon; and a wire electrically connecting the semiconductor device to the wire bonding pad.

Abstract translation: 本文公开了嵌入式球栅阵列基板及其制造方法。 嵌入式球栅阵列包括：其中具有空腔的芯层; 嵌入在芯层的空腔中的半导体器件; 第一电路层，具有包括在其上形成的引线接合焊盘的电路图案; 第二电路层，其具有包括形成在其上的焊球图案的电路图案; 以及将半导体器件电连接到引线接合焊盘的线。

公开(公告)号：US20120009488A1

公开(公告)日：2012-01-12

申请号：US13238494

申请日：2011-09-21

Applicant: Hyun-chul LEE ,  Kang-hee LEE ,  Doo-hwan LEE ,  Jin S. HEO

Inventor： Hyun-chul LEE ,  Kang-hee LEE ,  Doo-hwan LEE ,  Jin S. HEO

IPC: H01M8/06

CPC classification number: H01M8/0612 ,  H01M8/04007 ,  H01M8/0668

Abstract: A fuel cell system including a fuel processor, and a method of operating the fuel cell system, the fuel cell system includes: a reformer that reforms a hydrocarbon group fuel source into a reformed gas; a burner that heats the reformer; a CO remover unit that removes CO from a reformed gas generated by the reformer; a stack to generate electricity using the reformed gas; a first burner fuel supply line to supply the hydrocarbon group fuel source to the burner; and a second burner fuel supply line to supply the reformed gas from the CO remover unit to the burner.

Abstract translation: 一种燃料电池系统，包括燃料处理器和操作燃料电池系统的方法，所述燃料电池系统包括：将烃类燃料源重整成重整气体的重整器; 加热改性剂的燃烧器; CO除去单元，其从由重整器产生的重整气体中除去CO; 使用改性气体发电的堆叠; 第一燃烧器燃料供应管线，用于向燃烧器供给烃类燃料源; 以及第二燃烧器燃料供应管线，用于将重整气体从CO去除器单元供应到燃烧器。

公开(公告)号：US08067332B2

公开(公告)日：2011-11-29

申请号：US11743763

申请日：2007-05-03

Applicant: Hyun-chul Lee ,  Soon-ho Kim ,  Kang-hee Lee ,  Doo-hwan Lee ,  Eun-duck Park ,  Eun-yong Ko

Inventor： Hyun-chul Lee ,  Soon-ho Kim ,  Kang-hee Lee ,  Doo-hwan Lee ,  Eun-duck Park ,  Eun-yong Ko

IPC: B01J23/00 ,  B01J23/40 ,  B01J23/42 ,  B01J23/44 ,  H01M8/00 ,  H01M4/02 ,  H01M4/36 ,  H01M4/92

CPC classification number: H01M8/0668 ,  B01J23/75 ,  B01J23/755 ,  B01J35/0006 ,  B01J35/023 ,  B01J37/031 ,  B01J37/033 ,  B01J37/036 ,  B01J37/16 ,  C01B3/586 ,  C01B2203/0233 ,  C01B2203/0283 ,  C01B2203/044 ,  C01B2203/0445 ,  C01B2203/047 ,  C01B2203/066 ,  C01B2203/0811 ,  C01B2203/0894 ,  C01B2203/127 ,  C01B2203/1294 ,  H01M8/0675

Abstract: A methanation catalyst, a carbon monoxide removing system, a fuel processor, and a fuel cell including the same, and more particularly a non-supported methanation catalyst including the catalytically active non-precious metal particles and the metal oxide particles, and a carbon monoxide removing system, a fuel processor, and a fuel cell including the same. The methanation catalyst has high selectivity for the methanation of carbon monoxide instead of the methanation of carbon dioxide and the reverse water gas shift reaction of carbon dioxide, which are side reactions of the methanation of carbon monoxide, maintains high concentration of generated hydrogen as small amounts of hydrogen and carbon dioxide are consumed, and effectively removes carbon monoxide at low operating temperatures of 200° C. or less.

Abstract translation: 甲烷化催化剂，一氧化碳去除系统，燃料处理器和包含该甲烷化催化剂的燃料电池，更具体地，包括催化活性非贵金属颗粒和金属氧化物颗粒的非负载型甲烷化催化剂和一氧化碳 燃料处理器和包括该系统的燃料电池。 甲烷化催化剂对于一氧化碳的甲烷化代替二氧化碳的甲烷化和二氧化碳的反向水煤气变换反应具有高选择性，二氧化碳是一氧化碳甲烷化的副反应，维持生成氢的高浓度少量 的氢和二氧化碳被消耗，并且在200℃或更低的低操作温度下有效地除去一氧化碳。

公开(公告)号：US20110277320A1

公开(公告)日：2011-11-17

申请号：US13067131

申请日：2011-05-11

Applicant: Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

Inventor： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC: H05K3/30

CPC classification number: H01L23/5389 ,  H01L23/13 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/05599

Abstract: A method of manufacturing a PCB that includes embedding a bare chip in a board such that electrode pads of the bare chip are exposed, and forming electrode bumps on the electrode pads.

Abstract translation: 一种制造PCB的方法，包括将裸芯片嵌入板中，使得裸芯片的电极焊盘露出，并在电极焊盘上形成电极凸块。

公开(公告)号：US20110216513A1

公开(公告)日：2011-09-08

申请号：US12877684

申请日：2010-09-08

Applicant: Doo-Hwan LEE ,  Sang-Jin Baek ,  Jin-Soo Jeong ,  Sang-Chul Lee ,  Jong-Yun Lee ,  Jae-Kul Lee

Inventor： Doo-Hwan LEE ,  Sang-Jin Baek ,  Jin-Soo Jeong ,  Sang-Chul Lee ,  Jong-Yun Lee ,  Jae-Kul Lee

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K3/4602 ,  H05K3/465 ,  H05K3/4697 ,  Y10T29/4913 ,  Y10T29/49139

Abstract: An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with an electro device, in which a pair of electrodes are formed on either end, includes: a core substrate in which a first cavity is formed; a first passive device embedded in the first cavity and being thinner than the core substrate; and a second passive device stacked on an upper side of the first passive device such that the second passive device is embedded in the first cavity. The first passive device and the second passive device are stacked to cross each other.

Abstract translation: 公开了电子装置嵌入式印刷电路板及其制造方法。 根据本发明的实施例，嵌入电气装置的印刷电路板，其中一端形成一对电极，包括：形成有第一空腔的芯基板; 第一无源器件，其嵌入在所述第一腔中并且比所述芯基板更薄; 以及堆叠在所述第一无源器件的上侧上的第二无源器件，使得所述第二无源器件嵌入在所述第一腔中。 第一无源器件和第二无源器件被堆叠以彼此交叉。

公开(公告)号：US20110207006A1

公开(公告)日：2011-08-25

申请号：US13029740

申请日：2011-02-17

Applicant: Hyun-chul LEE ,  Doo-hwan LEE ,  Sang-min JI

Inventor： Hyun-chul LEE ,  Doo-hwan LEE ,  Sang-min JI

IPC: H01M8/06 ,  C01B3/12

CPC classification number: H01M8/0612 ,  B01J19/123 ,  B01J21/06 ,  B01J21/063 ,  B01J23/42 ,  B01J35/004 ,  B01J2219/0892 ,  C01B3/16 ,  C01B13/0203 ,  C01B13/0251 ,  C01B2203/0405 ,  C01B2203/066 ,  H01M8/0618 ,  Y02E60/36 ,  Y02P20/52

Abstract: A method of generating hydrogen, the method including: reducing carbon dioxide to generate carbon monoxide and oxygen; separating the oxygen from the carbon monoxide; generating carbon dioxide and hydrogen by a water-gas shift reaction between water and the carbon monoxide remaining after the separating the oxygen from the carbon monoxide; and separating the generated carbon dioxide and hydrogen.

Abstract translation: 一种产生氢气的方法，所述方法包括：还原二氧化碳以产生一氧化碳和氧气; 从一氧化碳中分离氧气; 通过在与一氧化碳分离氧之后水和一氧化碳之间的水煤气变换反应产生二氧化碳和氢气; 并分离产生的二氧化碳和氢气。