公开(公告)号：US08889078B2

公开(公告)日：2014-11-18

申请号：US13048382

申请日：2011-03-15

Applicant: Sang-min Ji ,  Hyun-chul Lee ,  Doo-hwan Lee ,  Seon-ah Jin

Inventor： Sang-min Ji ,  Hyun-chul Lee ,  Doo-hwan Lee ,  Seon-ah Jin

IPC: B01J23/00 ,  B01J21/00 ,  B01J20/00 ,  B01D50/00 ,  B01D53/34 ,  B01J37/02 ,  B01J37/08 ,  B01J35/10 ,  B01D53/86 ,  B01J37/00 ,  B01J23/83 ,  B01J23/89 ,  B01J37/03

CPC classification number: B01J23/002 ,  B01D53/864 ,  B01D2255/1023 ,  B01D2255/2065 ,  B01D2255/20715 ,  B01D2255/20761 ,  B01D2255/40 ,  B01D2255/9205 ,  B01D2257/708 ,  B01J23/83 ,  B01J23/894 ,  B01J35/1014 ,  B01J35/1038 ,  B01J35/1061 ,  B01J37/009 ,  B01J37/0236 ,  B01J37/03 ,  B01J37/082 ,  B01J37/086 ,  B01J2523/00 ,  B01J2523/17 ,  B01J2523/3712 ,  B01J2523/48 ,  B01J2523/824

Abstract: A porous oxide catalyst includes porous oxide, and an oxygen vacancy-inducing metal which induces an oxygen vacancy in a lattice structure of a porous metal oxide.

Abstract translation: 多孔氧化物催化剂包括多孔氧化物和诱导多孔金属氧化物的晶格结构中的氧空位的氧空位诱导金属。

公开(公告)号：US08633131B2

公开(公告)日：2014-01-21

申请号：US12915959

申请日：2010-10-29

Applicant: Doo-hwan Lee ,  Hyun-chul Lee ,  Sang-min Ji ,  Kyo-sung Park ,  Seung-jae Lee ,  Seon-ah Jin

Inventor： Doo-hwan Lee ,  Hyun-chul Lee ,  Sang-min Ji ,  Kyo-sung Park ,  Seung-jae Lee ,  Seon-ah Jin

IPC: B01J23/00 ,  B01J23/40 ,  B01J23/42 ,  B01J23/58 ,  B01J23/60 ,  B01J23/72 ,  B01J23/56 ,  B01J23/44 ,  B01J23/70 ,  B01J23/74 ,  B01J23/02 ,  B01J23/20 ,  B01J23/08 ,  H01M8/00 ,  H01M8/06

CPC classification number: B01J21/08 ,  B01J21/04 ,  B01J21/066 ,  B01J23/745 ,  B01J23/75 ,  B01J23/755 ,  B01J23/83 ,  B01J35/1061 ,  B01J37/036 ,  B01J37/04 ,  B01J37/082

Abstract: A mesoporous oxide-catalyst complex including: a mesoporous metal oxide; and a catalyst metal supported on the mesoporous metal oxide, wherein the catalyst on the mesoporous metal oxide has a degree of dispersion of about 30 to about 90 percent.

Abstract translation: 一种介孔氧化物 - 催化剂络合物，包括：介孔金属氧化物; 和负载在介孔金属氧化物上的催化剂金属，其中介孔金属氧化物上的催化剂具有约30至约90％的分散度。

公开(公告)号：US20130042472A1

公开(公告)日：2013-02-21

申请号：US13617694

申请日：2012-09-14

Applicant: Doo-Hwan LEE ,  Byoung-Youl MIN ,  Myung-Sam KANG ,  Moon-II KIM ,  Hyung-Tae KIM

Inventor： Doo-Hwan LEE ,  Byoung-Youl MIN ,  Myung-Sam KANG ,  Moon-II KIM ,  Hyung-Tae KIM

IPC: H05K3/30

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method of manufacturing a printed circuit board having embedded electronic components, the method including: mounting a first electronic component on one side of a core sheet and mounting a second electric component on the other side of the core sheet such that the second electronic component overlaps the first electronic component; stacking a first insulation layer on one side of the core sheet such that the first insulation layer covers the first electronic component and stacking a second insulation layer on the other side of the core sheet such that the second insulation layer covers the second electronic component; and forming a circuit pattern on a surface of the first insulation layer or the second insulation layer.

Abstract translation: 一种制造具有嵌入式电子部件的印刷电路板的方法，所述方法包括：将第一电子部件安装在芯片的一侧，并将第二电气部件安装在芯板的另一侧，使得第二电子部件重叠 第一个电子元件; 在芯片的一侧堆叠第一绝缘层，使得第一绝缘层覆盖第一电子部件，并且在芯片的另一侧堆叠第二绝缘层，使得第二绝缘层覆盖第二电子部件; 以及在所述第一绝缘层或所述第二绝缘层的表面上形成电路图案。

公开(公告)号：US20120160550A1

公开(公告)日：2012-06-28

申请号：US13252777

申请日：2011-10-04

Applicant: Tae Sung JEONG ,  Doo Hwan LEE ,  Seung Eun LEE

Inventor： Tae Sung JEONG ,  Doo Hwan LEE ,  Seung Eun LEE

IPC: H05K1/09 ,  H05K1/16 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/063 ,  H05K2203/1152 ,  H05K2203/1189 ,  H05K2203/1469 ,  Y10T29/4913

Abstract: Disclosed is a printed circuit board having an embedded electronic component, which includes a first insulating layer, an electronic component disposed in an opening formed in a thickness direction of the first insulating layer and having a metal bump, a polymer layer formed on one side of the first insulating layer and on which the electronic component is seated so that the metal bump of the electronic component perforates the polymer layer, a second insulating layer formed on the other side of the first insulating layer so as to embed the electronic component, a first circuit layer formed on the second insulating layer, and a second circuit layer formed on the polymer layer so as to be directly electrically connected to the metal bump that perforates the polymer layer, and in which roughness is formed on the polymer layer so that the force of adhesion of the polymer layer to a plating layer is enhanced, thus ensuring reliability of the electrical connection of a circuit layer which is subsequently formed.

Abstract translation: 公开了一种具有嵌入式电子部件的印刷电路板，其包括第一绝缘层，设置在沿第一绝缘层的厚度方向形成的开口中并具有金属凸块的电子部件，形成在第一绝缘层的一侧的聚合物层 第一绝缘层，并且电子部件就座于其上，使得电子部件的金属凸块穿透聚合物层;第二绝缘层，形成在第一绝缘层的另一侧上以嵌入电子部件;第一绝缘层， 形成在第二绝缘层上的电路层和形成在聚合物层上的第二电路层，以直接电连接到穿透聚合物层的金属凸块，并且在聚合物层上形成粗糙度，使得力 增强了聚合物层对镀层的粘附性，从而确保电路层的电连接的可靠性， 随后形成。

公开(公告)号：US08197563B2

公开(公告)日：2012-06-12

申请号：US12465889

申请日：2009-05-14

Applicant: Doo-hwan Lee ,  Hyun-chul Lee ,  Kang-hao Lee

Inventor： Doo-hwan Lee ,  Hyun-chul Lee ,  Kang-hao Lee

IPC: B01J7/00 ,  B01J8/00 ,  C01B3/36 ,  C01B6/24 ,  C01B3/24 ,  C01B3/26

CPC classification number: C01B3/384 ,  B01J8/0257 ,  B01J2208/00504 ,  B01J2219/00157 ,  B01J2219/00265 ,  C01B2203/0227 ,  C01B2203/066 ,  C01B2203/0816 ,  F23M9/06 ,  F23M9/10

Abstract: A fuel reformer, includes: a reformer burner, which generates a flame in a reforming pipe disposed to surround at least the flame of the reformer burner, the reforming pipe being filled with a reforming catalyst and having corrugated portions on a surface facing the reformer burner and a bottom surface of the reforming pipe disposed adjacent to the flame in which a flame blocking member is disposed between the flame of the reformer burner and the reforming pipe to isolate the flame of the reformer burner from the reforming pipe.

Abstract translation: 一种燃料重整器，包括：重整器燃烧器，其在至少包围重整器燃烧器的火焰的重整管中产生火焰，重整管填充有重整催化剂，并且在面向重整器燃烧器的表面上具有波纹部分 所述重整管的底面与所述重整器燃烧器的火焰与所述重整管的火焰之间设置有火焰阻挡构件的火焰相邻，以将所述重整器燃烧器的火焰与所述重整管隔离。

公开(公告)号：US20110230337A1

公开(公告)日：2011-09-22

申请号：US13048382

申请日：2011-03-15

Applicant: Sang-min JI ,  Hyun-chul LEE ,  Doo-hwan LEE ,  Seon-ah JIN

Inventor： Sang-min JI ,  Hyun-chul LEE ,  Doo-hwan LEE ,  Seon-ah JIN

IPC: B01J21/06 ,  B01J37/08 ,  B01J37/03

CPC classification number: B01J23/002 ,  B01D53/864 ,  B01D2255/1023 ,  B01D2255/2065 ,  B01D2255/20715 ,  B01D2255/20761 ,  B01D2255/40 ,  B01D2255/9205 ,  B01D2257/708 ,  B01J23/83 ,  B01J23/894 ,  B01J35/1014 ,  B01J35/1038 ,  B01J35/1061 ,  B01J37/009 ,  B01J37/0236 ,  B01J37/03 ,  B01J37/082 ,  B01J37/086 ,  B01J2523/00 ,  B01J2523/17 ,  B01J2523/3712 ,  B01J2523/48 ,  B01J2523/824

Abstract: A porous oxide catalyst includes porous oxide, and an oxygen vacancy-inducing metal which induces an oxygen vacancy in a lattice structure of a porous metal oxide.

Abstract translation: 多孔氧化物催化剂包括多孔氧化物和诱导多孔金属氧化物的晶格结构中的氧空位的氧空位诱导金属。

公开(公告)号：US20110123808A1

公开(公告)日：2011-05-26

申请号：US12774432

申请日：2010-05-05

Applicant: Sang-Chul Lee ,  Yul-Kyo Chung ,  Doo-hwan Lee ,  Sang-Jin Baek

Inventor： Sang-Chul Lee ,  Yul-Kyo Chung ,  Doo-hwan Lee ,  Sang-Jin Baek

IPC: B32B9/04 ,  B29C65/52 ,  B32B27/00

CPC classification number: H05K1/185 ,  H01L21/568 ,  H05K3/4602 ,  H05K2201/0195 ,  Y10T156/10 ,  Y10T428/31504

Abstract: An insulator and a manufacturing method of an electronic component embedded printed circuit board using the insulator are disclosed. The method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer covering the cavity to a lower surface of the core board, disposing an electronic component on an upper surface of the adhesive layer, in which the upper surface corresponds to the cavity, and stacking an insulator on an upper surface of the core board so as to fill the cavity, in which the insulator has an upper resin layer and a lower resin layer formed on an upper surface and a lower surface of a reinforcing material, respectively. The insulator has an asymmetric structure in which the lower resin layer is thicker than the upper resin layer.

Abstract translation: 公开了一种使用绝缘体的电子部件嵌入式印刷电路板的绝缘体和制造方法。 该方法包括提供具有形成在其表面上的电路图案的芯板，其中芯板被腔体穿透，将覆盖空腔的粘合剂层粘附到芯板的下表面，将电子部件放置在 粘合剂层的上表面，其上表面对应于空腔，并且在芯板的上表面上堆叠绝缘体以填充空腔，绝缘体具有上树脂层和下树脂层 分别形成在增强材料的上表面和下表面上。 绝缘体具有不对称结构，其中下树脂层比上树脂层厚。

公开(公告)号：US20110105310A1

公开(公告)日：2011-05-05

申请号：US12915959

申请日：2010-10-29

Applicant: Doo-hwan LEE ,  Hyun-chul LEE ,  Sang-min JI ,  Kyo-sung PARK ,  Seung-jae LEE ,  Seon-ah JIN

Inventor： Doo-hwan LEE ,  Hyun-chul LEE ,  Sang-min JI ,  Kyo-sung PARK ,  Seung-jae LEE ,  Seon-ah JIN

IPC: B01J31/06 ,  B01J37/08 ,  B01J37/16 ,  B01J37/18

CPC classification number: B01J21/08 ,  B01J21/04 ,  B01J21/066 ,  B01J23/745 ,  B01J23/75 ,  B01J23/755 ,  B01J23/83 ,  B01J35/1061 ,  B01J37/036 ,  B01J37/04 ,  B01J37/082

Abstract: A mesoporous oxide-catalyst complex including: a mesoporous metal oxide; and a catalyst metal supported on the mesoporous metal oxide, wherein the catalyst on the mesoporous metal oxide has a degree of dispersion of about 30 to about 90 percent.

Abstract translation: 一种介孔氧化物 - 催化剂络合物，包括：介孔金属氧化物; 和负载在介孔金属氧化物上的催化剂金属，其中介孔金属氧化物上的催化剂具有约30至约90％的分散度。

公开(公告)号：US07886433B2

公开(公告)日：2011-02-15

申请号：US12007795

申请日：2008-01-15

Applicant: Won-Cheol Bae ,  Je-Gwang Yoo ,  Sang-Chul Lee ,  Doo-Hwan Lee

Inventor： Won-Cheol Bae ,  Je-Gwang Yoo ,  Sang-Chul Lee ,  Doo-Hwan Lee

IPC: H05K3/02 ,  H05K3/10

CPC classification number: H05K1/185 ,  B32B3/06 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H05K2201/09509 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T156/1056 ,  Y10T428/22 ,  H01L2224/82

Abstract: A component-embedded PCB and a method of manufacturing the PCB are disclosed. Using a method that includes perforating a cavity in a core substrate; inserting a component in the cavity; stacking a film layer over the core substrate; forming at least one post by selectively leaving behind the film layer in correspondence to a position of at least one electrode of the component; covering an insulation layer over the core substrate such that the post penetrates the insulation layer to be exposed at a surface of the insulation layer; and forming at least one via hole by removing the post, can provide increased precision and finer pitch. Also, since laser is not used when processing the vias, damage to the component that may occur due to the laser is prevented. Furthermore, tolerance defects may be decreased, as well as defects caused by residue left after processing.

Abstract translation: 公开了一种组件嵌入式PCB及其制造方法。 使用包括在芯基板中穿孔的方法; 将部件插入腔中; 在芯基板上堆叠薄膜层; 通过选择性地将所述膜层留在所述元件的至少一个电极的位置上而形成至少一个柱; 覆盖所述芯基板上的绝缘层，使得所述柱穿透所述绝缘层以在所述绝缘层的表面上暴露; 并且通过去除柱形成至少一个通孔，可以提供更高的精度和更细的间距。 此外，由于在加工通孔时不使用激光，因此防止了由于激光而可能发生的部件的损坏。 此外，可能会降低公差缺陷，以及加工后残留物造成的缺陷。

公开(公告)号：US07833934B2

公开(公告)日：2010-11-16

申请号：US11605435

申请日：2006-11-29

Applicant: Yulia Potapova ,  Soon-ho Kim ,  Doo-hwan Lee ,  Hyun-chul Lee

Inventor： Yulia Potapova ,  Soon-ho Kim ,  Doo-hwan Lee ,  Hyun-chul Lee

IPC: B01J23/00 ,  B01J21/00 ,  B01J20/00 ,  B01J29/00 ,  B01J37/00

CPC classification number: B01J23/462 ,  B01J37/0009 ,  B01J37/04 ,  C01B3/38 ,  C01B3/40 ,  C01B2203/0227 ,  C01B2203/1047 ,  C01B2203/1082 ,  C01B2203/1241 ,  Y02P20/52

Abstract: A hydrocarbon reforming catalyst, a method of preparing the same, and a fuel processor including the same includes the hydrocarbon reforming catalyst having an active catalyst component impregnated in a oxide carrier and a thermally conductive material having higher thermal conductivity than that of the oxide carrier, the method of preparing the same, and a fuel processor including the same. The hydrocarbon reforming catalyst has excellent catalytic activity and thermal conductivity, and thus can easily transfer heat required in a hydrocarbon reforming reaction. Accordingly, by using the hydrocarbon reforming catalyst above, a high hydrogen production rate can be obtained.

Abstract translation: 烃重整催化剂及其制备方法以及包含该烃重整催化剂的燃料处理机包括具有浸渍在氧化物载体中的活性催化剂组分和导热性高于氧化物载体的导热材料的烃重整催化剂， 其制备方法以及包括该燃料处理器的燃料处理器。 烃重整催化剂具有优异的催化活性和导热性，因此可以容易地转移烃重整反应中所需的热。 因此，通过使用上述烃重整催化剂，可以得到高的氢生产率。