公开(公告)号：US20130122688A1

公开(公告)日：2013-05-16

申请号：US13811570

申请日：2012-07-02

申请人： Takatoshi Sasaki ,  Koji Mizuno ,  Fumiteru Asai ,  Goji Shiga

发明人： Takatoshi Sasaki ,  Koji Mizuno ,  Fumiteru Asai ,  Goji Shiga

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  C08K5/005 ,  C09J7/38 ,  C09J11/06 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  H01L21/6836 ,  H01L2221/68336 ,  Y10T428/28 ,  Y10T428/2848

摘要： An object of the present invention is to provide a pressure-sensitive adhesive sheet for dicing that is capable of preventing scratching of an adsorption stage when laser-scribing a semiconductor wafer. Provided is a pressure-sensitive adhesive sheet for dicing having a base and a pressure-sensitive adhesive layer provided on the base, in which 0.02 to 5 parts by weight of an ultraviolet absorber is contained in the pressure-sensitive adhesive layer with respect to 100 parts by weight of resin solid content, and in which the light transmittance at a wavelength of 355 nm of the pressure-sensitive adhesive sheet for dicing is 30% to 80%.

摘要翻译： 本发明的目的是提供一种用于切割的压敏粘合片，其能够在激光刻划半导体晶片时能够防止吸附阶段的刮擦。 提供一种用于切割的压敏粘合片，其具有设置在基底上的基底和压敏粘合剂层，其中压敏粘合剂层中含有0.02至5重量份的紫外线吸收剂相对于100 树脂固体成分重量份，切割用粘合片的波长355nm的透光率为30〜80％。

公开(公告)号：US20130108867A1

公开(公告)日：2013-05-02

申请号：US13809047

申请日：2011-07-07

申请人： Shigeki Ishiguro ,  Takumi Yutou ,  Hiroki Senda ,  Masamichi Matsumoto ,  Yuka Sekiguchi ,  Aya Nagatomo ,  Yuji Okawa ,  Fumiteru Asai ,  Michihito Ooishi ,  Toshimasa Sugimura

发明人： Shigeki Ishiguro ,  Takumi Yutou ,  Hiroki Senda ,  Masamichi Matsumoto ,  Yuka Sekiguchi ,  Aya Nagatomo ,  Yuji Okawa ,  Fumiteru Asai ,  Michihito Ooishi ,  Toshimasa Sugimura

IPC分类号： C09J11/06

CPC分类号： C09J11/06 ,  C07C233/05 ,  C07C233/35 ,  C08K5/20 ,  C09J7/22 ,  C09J7/38 ,  C09J133/24 ,  C09J2205/102 ,  C09J2427/006 ,  C09J2433/00 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2891

摘要： The present invention provides a methylenebis(fatty acid amide) composition containing as a main component a methylenebis(fatty acid amide) obtained by reacting a fatty acid monoamide with formaldehyde, a content of impurities which consist of the fatty acid monoamide and a fatty acid from which the fatty acid monoamide is constituted is 0 to less than 2 wt %, and a adhesive sheet containing the methylenebis(fatty acid amide) composition.

摘要翻译： 本发明提供一种亚甲基双（脂肪酸酰胺）组合物，其以脂肪酸单酰胺与甲醛反应获得的亚甲基双（脂肪酸酰胺）为主要成分，由脂肪酸单酰胺和脂肪酸组成的杂质含量 构成脂肪酸单酰胺的比例为0〜2重量％，含有亚甲基双（脂肪酸酰胺）组合物的粘合片。

公开(公告)号：US08404522B2

公开(公告)日：2013-03-26

申请号：US13172945

申请日：2011-06-30

申请人： Goji Shiga ,  Naohide Takamoto ,  Fumiteru Asai

发明人： Goji Shiga ,  Naohide Takamoto ,  Fumiteru Asai

IPC分类号： H01L21/00

CPC分类号： H01L21/6836 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3164 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2223/54433 ,  H01L2223/54473 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  Y10T428/24959 ,  Y10T428/265 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00

摘要： The present invention relates to a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer laminated in this order, and a film for semiconductor back surface provided on the pressure-sensitive adhesive layer of the dicing tape, where the pressure-sensitive adhesive layer has a thickness of from 20 μm to 40 μm.

摘要翻译： 本发明涉及一种半导体背面用切割带一体化膜，其特征在于，具有：依次层叠有基材和粘合剂层的切割带和设置在所述压敏粘合剂上的半导体背面用膜 切割胶带的层，其中压敏粘合剂层的厚度为20μm至40μm。

公开(公告)号：US20120107576A1

公开(公告)日：2012-05-03

申请号：US13347432

申请日：2012-01-10

申请人： Shuhei MURATA ,  Takeshi MATSUMURA ,  Koji MIZUNO ,  Fumiteru ASAI

发明人： Shuhei MURATA ,  Takeshi MATSUMURA ,  Koji MIZUNO ,  Fumiteru ASAI

IPC分类号： B32B7/12 ,  B05D3/06 ,  B05D3/02 ,  B05D5/08

CPC分类号： H01L21/67132 ,  B32B7/12 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/36 ,  C09J2203/326 ,  H01L24/45 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/24331 ,  Y10T428/24777 ,  Y10T428/24802 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention aims to provide a tape for holding a chip that makes pasting and peeling of a chip-shaped workpiece easy. It is a tape for holding a chip having a configuration in which a pressure-sensitive adhesive layer is formed on a base material, wherein the pressure-sensitive adhesive layer has a chip-shaped workpiece pasting region onto which a chip-shaped workpiece is pasted and a frame pasting region onto which a mount frame is pasted, and that is used by pasting the mount frame to the frame pasting region, wherein the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the frame pasting region is 5 times or more the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the chip-shaped workpiece pasting region.

摘要翻译： 本发明的目的在于提供一种用于保持芯片的带状物，其使得片状工件的粘贴和剥离变得容易。 用于保持具有在基材上形成压敏粘合剂层的构造的芯片的胶带，其中粘合剂层具有将片状工件粘贴到其上的切屑状工件粘贴区域 以及粘贴安装框架的框架粘贴区域，并且通过将安装框架粘贴到框架粘贴区域来使用，其中压敏粘合剂层的180度剥离粘合力到硅镜晶片 框状粘贴区域是片状工件粘贴区域的粘合剂层向硅镜面晶片的180度剥离粘合力的5倍以上。

公开(公告)号：US20120028415A1

公开(公告)日：2012-02-02

申请号：US13172945

申请日：2011-06-30

申请人： Goji SHIGA ,  Naohide TAKAMOTO ,  Fumiteru ASAI

发明人： Goji SHIGA ,  Naohide TAKAMOTO ,  Fumiteru ASAI

IPC分类号： H01L21/78 ,  B32B7/02 ,  B32B3/00

CPC分类号： H01L21/6836 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3164 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2223/54433 ,  H01L2223/54473 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  Y10T428/24959 ,  Y10T428/265 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00

摘要： The present invention relates to a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer laminated in this order, and a film for semiconductor back surface provided on the pressure-sensitive adhesive layer of the dicing tape, where the pressure-sensitive adhesive layer has a thickness of from 20 μm to 40 μm.

摘要翻译： 本发明涉及一种半导体背面用切割带一体化膜，其特征在于，具有：依次层叠有基材和粘合剂层的切割带和设置在所述压敏粘合剂上的半导体背面用膜 切割胶带的层，其中压敏粘合剂层的厚度为20μm至40μm。

公开(公告)号：US20120024469A1

公开(公告)日：2012-02-02

申请号：US13170581

申请日：2011-06-28

申请人： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

发明人： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

IPC分类号： H01L21/02 ,  B32B38/04 ,  B32B38/10 ,  B65D65/28

CPC分类号： H01L21/6836 ,  B32B37/1284 ,  B32B38/0004 ,  B32B38/10 ,  B32B2405/00 ,  B32B2457/14 ,  C09J7/20 ,  C09J165/00 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2223/54406 ,  H01L2223/5442 ,  H01L2223/5448 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/73204 ,  H01L2224/81095 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  Y10T156/1052 ,  Y10T156/1064 ,  Y10T156/1075 ,  Y10T156/1077 ,  Y10T156/1082 ,  Y10T156/1093 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/1495 ,  Y10T428/15 ,  Y10T428/21 ,  H01L21/78 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2224/13099

摘要： The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator.

摘要翻译： 本发明涉及一种用于半导体器件生产的膜，其包括：隔板; 以及多个粘附层附着的切割带，每个粘合剂层附着的切割带包括层合在切割带上的切割带和粘合剂层，它们以预定的间隔层压在隔板上，使得粘合剂层附着到隔板上，其中 分离器具有沿着切割带的外周形成的切口，并且切割深度为隔板的厚度的至多。。

公开(公告)号：US20120018903A1

公开(公告)日：2012-01-26

申请号：US13186000

申请日：2011-07-19

申请人： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

发明人： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

IPC分类号： H01L23/48 ,  B32B3/00 ,  H01L21/50

CPC分类号： H01L21/6835 ,  C09J163/00 ,  H01L21/561 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3157 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16258 ,  H01L2224/16268 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81002 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/831 ,  H01L2224/83862 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/15788 ,  Y10T428/24802 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2224/13099

摘要： The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film having a light transmittance at a wavelength of 532 nm or 1064 nm of 20% or less, and having a contrast between a marking part and a part other than the marking part after laser marking of 20% or more.

摘要翻译： 本发明涉及一种用于倒装芯片型半导体背表面的薄膜，该薄膜形成在连接到被粘物上的半导体元件倒装芯片的背面上，该膜具有波长为532nm或1064nm的透光率为20 ％以下，并且在激光标记20％以上之后，标记部与标记部以外的部分之间具有对比度。

公开(公告)号：US20100230036A1

公开(公告)日：2010-09-16

申请号：US12720704

申请日：2010-03-10

申请人： Takashi HABU ,  Fumiteru ASAI ,  Tomokazu TAKAHASHI ,  Akinori NISHIO ,  Toshio SHINTANI

发明人： Takashi HABU ,  Fumiteru ASAI ,  Tomokazu TAKAHASHI ,  Akinori NISHIO ,  Toshio SHINTANI

IPC分类号： B32B38/00 ,  B32B5/00 ,  B05D3/06

CPC分类号： H01L21/304 ,  C09J133/066 ,  C09J2201/606 ,  C09J2203/326 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/3025

摘要： The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa.

摘要翻译： 本发明提供一种用于保护半导体晶片的无基板用粘合片，其将在半导体晶片的背面磨削时粘贴到半导体晶片的前表面，该压敏粘合片由 压敏粘合剂层，其中压敏粘合剂层由含有主要由丙烯酸单体可聚合化合物组成的聚合物的UV可固化压敏粘合剂形成，压力表面的压敏粘合力 要粘附到半导体晶片的前表面的敏感粘合剂层大于其相对表面的压敏粘合力，并且压敏粘合剂层的初始弹性模量为0.01MPa至500MPa。

公开(公告)号：US20100080989A1

公开(公告)日：2010-04-01

申请号：US12571618

申请日：2009-10-01

申请人： Fumiteru ASAI ,  Tomokazu TAKAHASHI ,  Keiko MAEKAWA ,  Kazuhiro AOYAGI

发明人： Fumiteru ASAI ,  Tomokazu TAKAHASHI ,  Keiko MAEKAWA ,  Kazuhiro AOYAGI

IPC分类号： B32B15/082 ,  B29C65/16

CPC分类号： H01L21/6836 ,  B23K26/18 ,  C03B33/0222 ,  C03B33/091 ,  C08K5/0025 ,  C08K5/07 ,  C08K5/17 ,  C08K5/51 ,  C08K5/5397 ,  C09J7/385 ,  C09J2203/326 ,  C09J2205/102 ,  H01L21/78 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T428/2809

摘要： The present invention provides a pressure-sensitive adhesive sheet for laser processing, which includes a base and a pressure-sensitive adhesive layer provided on one surface of the base, the pressure-sensitive adhesive layer having an absorption coefficient at a wavelength of 355 nm of from 50 cm−1 to 900 cm−1, the pressure-sensitive adhesive layer containing a light-absorbing agent in which an absorbance of the light-absorbing agent in a 0.01% by weight acetonitrile solution at a wavelength of 355 nm is from 0.01 to 1.20, and in which the pressure-sensitive adhesive sheet is to be used at the time when a workpiece is laser-processed by a laser light having a wavelength of an ultraviolet region or a laser light enabling light absorption via multiphoton absorption process.

摘要翻译： 本发明提供一种用于激光加工的压敏粘合片，其包括基底和设置在基底的一个表面上的压敏粘合剂层，压敏粘合剂层的波长为355nm处的吸收系数为 从50cm -1至900cm -1，含有光吸收剂的粘合剂层，其中吸光剂在355nm波长的0.01重量％乙腈溶液中的吸光度为0.01 至1.20，并且在通过具有紫外线区域的波长的激光或能够通过多光子吸收过程进行光吸收的激光来对工件进行激光加工时使用压敏粘合片。

公开(公告)号：US20090311474A1

公开(公告)日：2009-12-17

申请号：US12307882

申请日：2008-04-15

申请人： Tomokazu Takahashi ,  Fumiteru Asai ,  Toshio Shintani ,  Takatoshi Sasaki ,  Akiyoshi Yamamoto ,  Tsubasa Miki

发明人： Tomokazu Takahashi ,  Fumiteru Asai ,  Toshio Shintani ,  Takatoshi Sasaki ,  Akiyoshi Yamamoto ,  Tsubasa Miki

IPC分类号： B32B3/10

CPC分类号： H01L21/67132 ,  C09J7/20 ,  C09J2201/20 ,  C09J2205/31 ,  H01L21/67092 ,  Y10T428/24331

摘要： An object of the present invention is to provide an adhesive sheet which, through improvement in the permeability of liquids originating in a liquid stream during water jet laser dicing, allows chips, IC components, or the like to be detached, prevents machining precision from being compromised such as by chipping or the scattering of chips and the like, and allows extremely thin semiconductor wafers or materials to be processed. The adhesive sheet for water jet laser dicing of the present invention comprises an adhesive layer laminated on a base film, the base film made of mesh fiber.

摘要翻译： 本发明的目的是提供一种粘合片，其通过在喷水激光切割期间通过提高液体流中的液体的渗透性而允许芯片，IC部件等被分离，从而防止加工精度 例如通过切片或芯片等的散射而受到损害，并且允许非常薄的半导体晶片或材料被加工。 本发明的喷水激光切割用粘合片包括层压在基膜上的粘合剂层，由网状纤维构成的基膜。