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公开(公告)号：US06043564A
公开(公告)日：2000-03-28
申请号：US175807
申请日：1998-10-20
申请人： J. Mike Brooks , Alan G. Wood , Kevin G. Duesman
发明人： J. Mike Brooks , Alan G. Wood , Kevin G. Duesman
IPC分类号： H01L21/60 , H01L23/28 , H01L23/31 , H01L23/485 , H01L29/06
CPC分类号： H01L23/3107 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/11 , H01L2224/1134 , H01L2224/1191 , H01L2224/13 , H01L2224/1308 , H01L2224/13124 , H01L2224/13144 , H01L2224/13164 , H01L2224/16 , H01L2224/274 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/81801 , H01L2224/94 , H01L24/45 , H01L24/48 , H01L29/0657 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10157 , H01L2924/12042 , H01L2924/14 , H01L2924/181
摘要： A method for forming a semiconductor device comprises the steps of providing a semiconductor die having a plurality of pads thereon with at least one bond wire electrically coupled with one of the pads and providing a holder having a cavity therein. The die is placed in the cavity, then a layer of encapsulation is formed within the cavity to cover the die. Subsequently, the encapsulated die is removed from the cavity.
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公开(公告)号：US5990566A
公开(公告)日：1999-11-23
申请号：US82093
申请日：1998-05-20
申请人： Warren M. Farnworth , Salman Akram , Alan G. Wood , Mike Brooks , Eugene Cloud
发明人： Warren M. Farnworth , Salman Akram , Alan G. Wood , Mike Brooks , Eugene Cloud
IPC分类号： H01L23/48 , H01L23/498 , H01L25/065 , H01L23/52 , H01L29/40
CPC分类号： H01L25/0657 , H01L23/4985 , H01L24/72 , H01L2225/0652 , H01L2225/06551 , H01L2225/06575 , H01L2225/06579 , H01L2924/01004 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/12044 , H01L2924/14 , H01L2924/3011 , H01L2924/351
摘要： A semiconductor package and a method of fabrication are provided. The package includes multiple semiconductor dice contained in a housing, and mounted on edge to a substrate. Each die includes a polymer interconnect which attaches to a face of the die, and wraps around an end (or side) of the die. The polymer interconnect includes a flexible polymer tape with patterns of conductors. The conductors include microbumps for bonding to the die bond pads, and edge contacts for electrical connection to mating contacts on the substrate. The package also includes a force applying mechanism for biasing the dice against the substrate. In alternate embodiments, the polymer interconnect includes resilient edge contacts, cantilevered edge contacts, or multi level edge contacts.
摘要翻译： 提供半导体封装和制造方法。 封装包括容纳在外壳中的多个半导体裸片，并且安装在边缘到基板上。 每个管芯包括连接到管芯的表面并且围绕管芯的端部（或侧面）的聚合物互连。 聚合物互连包括具有导体图案的柔性聚合物带。 导体包括用于与芯片接合焊盘接合的微胶片，以及用于与衬底上的配合触点电连接的边缘触点。 该包装还包括用于将骰子偏压抵靠衬底的施力机构。 在替代实施例中，聚合物互连包括弹性边缘触点，悬臂边缘触点或多级边缘触点。
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公开(公告)号：USD407198S
公开(公告)日：1999-03-30
申请号：US80749
申请日：1997-12-15
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公开(公告)号：USD400699S
公开(公告)日：1998-11-10
申请号：US73407
申请日：1997-07-08
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公开(公告)号：US5824569A
公开(公告)日：1998-10-20
申请号：US611314
申请日：1996-03-05
申请人： J. Mike Brooks , Alan G. Wood , Kevin G. Duesman
发明人： J. Mike Brooks , Alan G. Wood , Kevin G. Duesman
CPC分类号： H01L23/3107 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/11 , H01L2224/1134 , H01L2224/1191 , H01L2224/13 , H01L2224/1308 , H01L2224/13124 , H01L2224/13144 , H01L2224/13164 , H01L2224/16 , H01L2224/274 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/81801 , H01L2224/94 , H01L24/45 , H01L24/48 , H01L29/0657 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10157 , H01L2924/12042 , H01L2924/14 , H01L2924/181
摘要： A method for forming a semiconductor device comprises the steps of providing a semiconductor die having a plurality of pads thereon with at least one bond wire electrically coupled with one of the pads and providing a holder having a cavity therein. The die is placed in the cavity, then a layer of encapsulation is formed within the cavity to cover the die. Subsequently, the encapsulated die is removed from the cavity.
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76.发明授权Carrier having slide connectors for testing unpackaged semiconductor dice 失效载体具有用于测试未封装的半导体骰子的滑动连接器
公开(公告)号：US5691649A
公开(公告)日：1997-11-25
申请号：US587175
申请日：1996-01-16
申请人： Warren M. Farnworth , Salman Akram , Mike Brooks
发明人： Warren M. Farnworth , Salman Akram , Mike Brooks
IPC分类号： G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/60 , H01L21/66 , H01L21/68 , H01L23/13 , H01L23/498 , H05K3/00 , H05K3/42 , G01R31/02
CPC分类号： G01R1/0466 , G01R1/0483 , G01R31/2893 , H01L21/6835 , H01L22/20 , H01L23/13 , H01L23/49816 , H01L23/49838 , H01L24/80 , H01L24/85 , H05K3/4007 , G01R3/00 , G01R31/2863 , H01L2224/16145 , H01L2224/451 , H01L2224/48 , H01L2224/85001 , H01L2225/06562 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15151 , H01L2924/15174 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H05K2201/0133 , H05K2201/0347 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2203/0307 , H05K2203/0723 , H05K3/0058 , H05K3/0067 , H05K3/423
摘要： A carrier for testing an unpackaged semiconductor die is provided. The carrier comprises a base for holding the die, an interconnect for establishing a temporary electrical connection with the die, and a force applying mechanism for biasing the die and interconnect together. The base includes external contacts arranged as flat metal pads in a dense grid array and electrically connected to a pattern of contact pads. The carrier also includes a pair of slide connector members which provide an electrical path between the contact pads on the base and corresponding contact pads on the interconnect. The slide connector members can be formed of molded plastic or ceramic and include tine contacts that slidably engage the contact pads on the interconnect and base. The slide connector members permit the interconnect to be easily replaced for testing of different types of dice.
摘要翻译： 提供了用于测试未封装的半导体管芯的载体。 载体包括用于保持模具的基座，用于建立与模具的临时电连接的互连件，以及用于偏压模具并互连在一起的施力机构。 底座包括以致密网格阵列布置成平坦金属焊盘并电连接到接触焊盘图案的外部触点。 载体还包括一对滑动连接器构件，其在基座上的接触焊盘和互连上的对应的接触焊盘之间提供电路径。 滑动连接器构件可以由模制塑料或陶瓷形成，并且包括滑动接合互连和底座上的接触垫的齿接触。 滑动连接器构件允许容易地替换互连以测试不同类型的骰子。
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公开(公告)号：USD386292S
公开(公告)日：1997-11-18
申请号：US55440
申请日：1996-06-04
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公开(公告)号：USD380599S
公开(公告)日：1997-07-08
申请号：US54748
申请日：1996-05-21
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公开(公告)号：USD380598S
公开(公告)日：1997-07-08
申请号：US54742
申请日：1996-05-21
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公开(公告)号：USD376684S
公开(公告)日：1996-12-24
申请号：US35556
申请日：1995-03-02
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