公开(公告)号：US09966282B2

公开(公告)日：2018-05-08

申请号：US14867458

申请日：2015-09-28

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Kunihiro Miyazaki ,  Kenji Minami ,  Yuji Nagashima ,  Konosuke Hayashi

IPC: H01L21/02 ,  H01L21/67 ,  G03F7/42 ,  H01L21/311

CPC classification number: H01L21/6708 ,  G03F7/423 ,  H01L21/31133

Abstract: According to one embodiment, a substrate processing apparatus includes a first liquid supplier, a second liquid supplier, and a controller. The first liquid supplier supplies a substrate with a sulfuric acid solution having a first temperature equal to or higher than the boiling point of hydrogen peroxide water. The second liquid supplier supplies a surface to be treated of the substrate with a mixture of sulfuric acid solution and hydrogen peroxide water having a second temperature lower than the first temperature. The controller controls the first liquid supplier to supply the sulfuric acid solution so as to heat the substrate to the boiling point of hydrogen peroxide water or higher. When the temperature of the substrate becomes equal to or higher than the second temperature, the controller controls the first liquid supplier to stop supplying the sulfuric acid solution and controls the second liquid supplier to supply the mixture.

公开(公告)号：US09964358B2

公开(公告)日：2018-05-08

申请号：US15141946

申请日：2016-04-29

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Jun Matsushita ,  Takashi Miyamoto ,  Konosuke Hayashi ,  Osamu Yamazaki

IPC: F26B3/30 ,  H01L21/67

CPC classification number: F26B3/30 ,  F26B5/08 ,  H01L21/67115

Abstract: The substrate processing unit 1 comprises the rotating table 31 configured to hold substrate W, the processing chamber 37 which accommodates the rotating table 31, a lamp 61 is provided above the processing chamber 37 and configured to heat the surface of substrate W, the lamp chamber 60 which accommodates that lamp 61, a transmission window 62 disposed below the lamp chamber 60, and a plurality of nozzle 64 which supply cooling fluid G to the transmission window 62. Then the substrate processing unit 1 can suppress generating of a water mark or pattern collapse, and can perform good substrate processing.

公开(公告)号：US20180117796A1

公开(公告)日：2018-05-03

申请号：US15860075

申请日：2018-01-02

Applicant: SHIBAURA MECHATRONICS CORPORATION ,  TOSHIBA MEMORY CORPORATION

Inventor： Kensuke DEMURA ,  Satoshi NAKAMURA ,  Daisuke MATSUSHIMA ,  Masayuki HATANO ,  Hiroyuki KASHIWAGI

IPC: B29C33/38 ,  B29C59/02 ,  G03F7/00 ,  B29C59/00

CPC classification number: B29C33/3842 ,  B29C33/38 ,  B29C33/42 ,  B29C59/002 ,  B29C59/02 ,  B29C2033/426 ,  B29L2031/757 ,  G03F7/0002

Abstract: According to one embodiment, an imprint template manufacturing apparatus includes: a stage that support a template having a convex portion where a concavo-convex pattern is formed; a supply head that supplies a liquid-repellent material in liquid form to the template on the stage; a moving mechanism that moves the stage and the supply head relatively in a direction along the stage; and a controller that controls the supply head and the moving mechanism such that the supply head applies the liquid-repellent material to at least a side surface of the convex portion so as to avoid the concavo-convex pattern. The liquid-repellent material contains a liquid-repellent component and a non-liquid-repellent component that react with the surface of the template, a volatile solvent that dissolves the liquid-repellent component, and a fluorine-based volatile solvent that dissolves the non-liquid-repellent component.

公开(公告)号：US09922861B2

公开(公告)日：2018-03-20

申请号：US14247329

申请日：2014-04-08

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Masaaki Furuya ,  Koichi Higuchi

IPC: H01L21/687

CPC classification number: H01L21/68728

Abstract: A rotary table; a drive motor M configured to rotate the rotary table; a pin base supported by the rotary table; a pin fixing member configured to move closer to or away from C1 upon the pin base revolving; first chuck pins and second chuck pins provided on the pin fixing member and configured to be into contact with an outer edge of the substrate W; a substrate gripping force generation mechanism including a spring member; a chuck pin switching mechanism including an inertia member configured to be rotated coaxially with the rotary table and a protruded member provided on an outer peripheral part of the inertia member; and a cam member provided on the pin fixing member and configured to engage with protruded member.

公开(公告)号：US20180022016A1

公开(公告)日：2018-01-25

申请号：US15720898

申请日：2017-09-29

Applicant: SHIBAURA MECHATRONICS CORPORATION ,  TOSHIBA MEMORY CORPORATION

Inventor： Satoshi NAKAMURA ,  Kensuke DEMURA ,  Daisuke MATSUSHIMA ,  Masayuki HATANO ,  Hiroyuki KASHIWAGI

IPC: B29C59/02

CPC classification number: B29C59/02 ,  B29C35/0888 ,  B29C43/021 ,  B29C2035/0827 ,  G03F7/0002 ,  H01L21/027

Abstract: According to one embodiment, a template for imprint includes a base, a convex portion, and a liquid-repellent layer. The base has a main surface. The convex portion is provided on the main surface. The convex portion has an end surface on a side opposite to the main surface, and a concavo-convex pattern to be pressed against a liquid material to be transferred is formed on the end surface. The liquid-repellent layer is formed on at least the side surface of the convex portion so as to avoid the concavo-convex pattern. The liquid-repellent layer repels the liquid material to be transferred.

公开(公告)号：US09795999B2

公开(公告)日：2017-10-24

申请号：US14671278

申请日：2015-03-27

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Takashi Ootagaki ,  Konosuke Hayashi ,  Yosuke Himori

IPC: B08B7/04 ,  B08B3/08 ,  H01L21/67

CPC classification number: B08B3/08 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67248

Abstract: A substrate processing apparatus according to an embodiment includes: a liquid supplier configured to supply a processing liquid to a surface of a substrate; a temperature detector configured to detect a surface temperature of the substrate supplied with the processing liquid by the liquid supplier; a temperature monitor configured to determine whether or not the surface temperature detected by the temperature detector has reached a predetermined temperature; and a controller configured to cause the liquid supplier to stop supplying the processing liquid when the temperature monitor determines that the surface temperature has reached the predetermined temperature.

公开(公告)号：US20170278729A1

公开(公告)日：2017-09-28

申请号：US15512308

申请日：2015-09-30

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Konosuke HAYASHI ,  Takashi OOTAGAKI

IPC: H01L21/67 ,  B08B3/02 ,  B08B3/10 ,  B08B3/08

CPC classification number: H01L21/67051 ,  B08B3/02 ,  B08B3/08 ,  B08B3/10 ,  B08B2203/0288 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/68728 ,  H01L21/68785 ,  H01L21/68792

Abstract: According to one embodiment, a substrate processing apparatus includes: a removing part (D1) configured to remove liquid droplets present in a recess (30); a drain hole (30a) located at the bottom of the recess (30) of a nozzle head (32), and configured to discharge the liquid droplets as a target to be removed out of the recess (30); and a controller configured to control the discharge state of a gas discharge nozzle (33) such that there is a period in which a gas is discharged from the gas discharge nozzle (33) at a flow rate, at which the gas discharged does not reach a surface to be processed of s substrate W, in a period from the end of the rinsing process using a treatment liquid to the start of the drying process using the gas.

公开(公告)号：US20170259308A1

公开(公告)日：2017-09-14

申请号：US15608554

申请日：2017-05-30

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Jun MATSUSHITA ,  Yuji NAGASHIMA ,  Konosuke HAYASHI ,  Kunihiro MIYAZAKI

IPC: B08B3/08 ,  H01L21/67 ,  B08B3/02

CPC classification number: B08B3/08 ,  B08B3/02 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

Abstract: A substrate processing device 10 has a water removing unit 110 and, when a solvent supply unit 58 supplies a volatile solvent to a surface of a substrate W, the water removing unit 110 supplies a water removing agent to the surface of the substrate W to promote replacement of the cleaning water on the surface of the substrate W with the volatile solvent.

公开(公告)号：US09679787B2

公开(公告)日：2017-06-13

申请号：US14472923

申请日：2014-08-29

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Masaaki Furuya

IPC: B05C13/00 ,  H01L21/00 ,  H01L21/67 ,  G03F7/30 ,  H01L21/687 ,  G03F7/16

CPC classification number: H01L21/67028 ,  G03F7/162 ,  G03F7/3021 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/68785

Abstract: A spin treatment apparatus includes an annular liquid receiver, an annular cup body and an annular partitioning member. The annular liquid receiver surrounds a rotating substrate at a distance from an outer periphery of the substrate and is configured to receive liquid flying from the rotating substrate and accommodate the liquid. The annular cup body surrounds the liquid receiver at a distance from an outer periphery of the liquid receiver and forms an annular outer exhaust flow channel for generating an airflow along an upper surface to an outer peripheral surface of the liquid receiver. The annular partitioning member is provided inside the annular liquid receiver and forms an annular inner exhaust flow channel for generating an airflow along an inner peripheral surface to a lower surface of the liquid receiver.

公开(公告)号：US20170017151A1

公开(公告)日：2017-01-19

申请号：US15124409

申请日：2015-02-19

Applicant: Shibaura Mechatronics Corporation

Inventor： Daisuke Matsushima ,  Kensuke Demura ,  Masafumi Suzuki ,  Satoshi Nakamura

IPC: G03F1/82 ,  B08B7/00 ,  G03F1/24

CPC classification number: G03F1/82 ,  B08B7/0035 ,  G03F1/24

Abstract: A reflective mask cleaning apparatus according to an embodiment comprises a first supply section configured to supply a first solution containing at least one of an organic solvent and a surfactant to a ruthenium-containing capping layer provided in a reflective mask; and a second supply section configured to supply at least one of a reducing solution and an oxygen-free solution to the capping layer.A reflective mask cleaning apparatus according to an alternative embodiment comprises a third supply section configured to supply a plasma product produced from a reducing gas to a ruthenium-containing capping layer provided in a reflective mask; and a second supply section configured to supply at least one of a reducing solution and an oxygen-free solution to the capping layer.

Abstract translation: 根据替代实施例的反射掩模清洁装置包括第三供应部分，其构造成将由还原气体产生的等离子体产物供应到设置在反射掩模中的含钌覆盖层; 以及第二供给部，其构造成向所述封盖层供给还原溶液和无氧溶液中的至少一种。