公开(公告)号：US20120196978A1

公开(公告)日：2012-08-02

申请号：US13165006

申请日：2011-06-21

Applicant: Yin-Hsi Lin ,  Chi-Shu Wei ,  Cheng-Chu Lin ,  Ming-Chih Kuo ,  Sheng-Shan Chang

Inventor： Yin-Hsi Lin ,  Chi-Shu Wei ,  Cheng-Chu Lin ,  Ming-Chih Kuo ,  Sheng-Shan Chang

IPC: C08L67/02 ,  B29C47/00 ,  C08G63/672

CPC classification number: C08G63/672 ,  C08G63/676

Abstract: A polyester heat storage material and a preparation method thereof are disclosed. The repeating unit of the polyester's main chain comprises a diacid fragment and a polyalkylene glycol fragment. The method for preparing the polyester heat storage material includes melting diacid anhydride and polyalkylene glycol and conducting the polycondensation reaction.

Abstract translation: 公开了聚酯储热材料及其制备方法。 聚酯主链的重复单元包含二酸片段和聚亚烷基二醇片段。 制备聚酯储热材料的方法包括二酸酐和聚亚烷基二醇的熔融并进行缩聚反应。

公开(公告)号：US20120119335A1

公开(公告)日：2012-05-17

申请号：US12945134

申请日：2010-11-12

Applicant: Chi-Chih Shen ,  Jen-Chuan Chen ,  Hui-Shan Chang ,  Chung-Hsi Wu ,  Meng-Jen Wang

Inventor： Chi-Chih Shen ,  Jen-Chuan Chen ,  Hui-Shan Chang ,  Chung-Hsi Wu ,  Meng-Jen Wang

IPC: H01L29/41

CPC classification number: H01L23/544 ,  H01L23/481 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/16146

Abstract: The present invention relates to a semiconductor device with a plurality of mark through substrate vias, comprising a semiconductor substrate, a plurality of original through substrate vias and a plurality of mark through substrate vias. The original through substrate vias and the mark through substrate vias are disposed in the semiconductor substrate and protrude from the backside surface of the semiconductor substrate. The mark through substrate vias are added at a specific position and/or in a specific pattern and serve as a fiducial mark, which facilitates identifying to the position and direction on the backside surface. Thus, the redistribution layer (RDL) or the special equipment for achieving the backside alignment (BSA) is not necessary.

Abstract translation: 本发明涉及具有多个标记通过衬底通孔的半导体器件，包括半导体衬底，多个原始通过衬底通孔和多个通过衬底通孔的标记。 原始通过衬底通孔和通过衬底通孔的标记设置在半导体衬底中并从半导体衬底的背面突出。 通过基板通孔的标记在特定位置和/或特定图案中添加，并且用作基准标记，其有助于识别背面上的位置和方向。 因此，再分配层（RDL）或用于实现背侧对准（BSA）的专用设备是不必要的。

公开(公告)号：US20120086120A1

公开(公告)日：2012-04-12

申请号：US13253816

申请日：2011-10-05

Applicant: Jen-Chuan Chen ,  Hui-Shan Chang ,  You-Cheng Lai

Inventor： Jen-Chuan Chen ,  Hui-Shan Chang ,  You-Cheng Lai

IPC: H01L23/48

CPC classification number: H01L25/50 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/3121 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/68368 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/11009 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/75301 ,  H01L2224/7565 ,  H01L2224/81002 ,  H01L2224/81005 ,  H01L2224/81007 ,  H01L2224/83002 ,  H01L2224/83005 ,  H01L2224/83007 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/05552 ,  H01L2924/00

Abstract: The present invention relates to a stacked semiconductor package and a method for making the same. The method includes the steps of: forming and curing a first protective layer to cover a plurality of first bumps of a first wafer; cutting the first wafer to form a plurality of first dice; forming a third protective layer to cover a plurality of second bumps of a second wafer; picking up the first dice through the first protective layer, and bonding the first dice to the second wafer; removing part of the first protective layer; cutting the second wafer to form a plurality of second dice; and bonding the first dice and the second dice to a substrate. Whereby, the first protective layer can protect the first bumps, and the first protective layer can increase the total thickness and the flatness.

Abstract translation: 本发明涉及堆叠式半导体封装及其制造方法。 该方法包括以下步骤：形成和固化第一保护层以覆盖第一晶片的多个第一凸块; 切割第一晶片以形成多个第一骰子; 形成第三保护层以覆盖第二晶片的多个第二凸起; 通过第一保护层拾起第一骰子，并将第一骰子接合到第二晶片; 去除所述第一保护层的一部分; 切割第二晶片以形成多个第二骰子; 以及将第一骰子和第二骰子结合到衬底。 由此，第一保护层可以保护第一凸起，并且第一保护层可以增加总厚度和平坦度。

公开(公告)号：US20110300669A1

公开(公告)日：2011-12-08

申请号：US12795315

申请日：2010-06-07

Applicant: Chi-Chih Shen ,  Jen-Chuan Chen ,  Hui-Shan Chang ,  Chia-Lin Hung ,  Ying-Sheng Chuang

Inventor： Chi-Chih Shen ,  Jen-Chuan Chen ,  Hui-Shan Chang ,  Chia-Lin Hung ,  Ying-Sheng Chuang

IPC: H01L21/50

CPC classification number: H01L25/0657 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73104 ,  H01L2224/81193 ,  H01L2224/83193 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00

Abstract: The present invention relates to a method for making chip assemblies, including the following steps of: (a) providing a tested upper wafer and at least one tested lower wafer; (b) sawing the at least one tested lower wafer to form a plurality of lower dice, the lower dice including a plurality of know good lower dice; (c) picking up and rearranging the know good lower dice on a carrier according to the wafer map of the upper wafer; (d) bonding the upper wafer and the carrier; (e) removing the carrier; and (f) proceeding sawing step. Whereby, the dice of the die assembly are both known good dice, thus the yield loss caused by the different yields between the upper wafer and the lower wafer will not occur.

Abstract translation: 本发明涉及一种制造芯片组件的方法，包括以下步骤：（a）提供测试的上晶片和至少一个经测试的下晶片; （b）锯切所述至少一个经测试的下晶片以形成多个下骰子，所述下骰子包括多个熟知的较低骰子; （c）根据上晶片的晶片图拾取并重新排列载体上的已知的较好的下骰子; （d）粘合上晶片和载体; （e）清除载体; 和（f）进行锯切步骤。 由此，芯片组件的裸片都是已知的好的裸片，因此不会发生由上晶片和下晶片之间的不同产量引起的屈服损失。

公开(公告)号：US08062372B2

公开(公告)日：2011-11-22

申请号：US11611821

申请日：2006-12-15

Applicant: Yang-Hwei Tsuang ,  Jui-Sheng Sun ,  Chun-Jen Liao ,  Chen-Chi Tsai ,  Shan-Chang Chueh ,  Yi-Hung Lin ,  Shian-Yih Wang ,  I-Fan Chiu

Inventor： Yang-Hwei Tsuang ,  Jui-Sheng Sun ,  Chun-Jen Liao ,  Chen-Chi Tsai ,  Shan-Chang Chueh ,  Yi-Hung Lin ,  Shian-Yih Wang ,  I-Fan Chiu

IPC: A61F2/44

CPC classification number: A61F2/4455 ,  A61F2/30771 ,  A61F2002/2835 ,  A61F2002/3008 ,  A61F2002/30153 ,  A61F2002/30163 ,  A61F2002/30171 ,  A61F2002/30772 ,  A61F2002/4629 ,  A61F2230/0019 ,  A61F2230/0028 ,  A61F2230/005 ,  A61F2250/0098 ,  A61F2310/00179 ,  A61F2310/00365

Abstract: A spinal fusion device abutting and fixed between adjacent vertebrae. The spinal fusion device includes a support frame. The support frame has a plurality of extending bodies, each radially extending from a center of the support frame. A predetermined gap exists between every two adjacent extending bodies, receiving a bone graft.

Abstract translation: 脊椎融合装置邻接并固定在相邻的椎骨之间。 脊柱融合装置包括支撑框架。 支撑框架具有多个延伸体，每个延伸体从支撑框架的中心径向延伸。 在每两个相邻的延伸体之间存在预定的间隙，接收骨移植物。

公开(公告)号：US20110152932A1

公开(公告)日：2011-06-23

申请号：US12860085

申请日：2010-08-20

Applicant: Jaw-Lin Wang ,  Dar-Ming Lai ,  Shan-Chang Chueh ,  Chih-Ming Wu ,  Pei-Yu Peng

Inventor： Jaw-Lin Wang ,  Dar-Ming Lai ,  Shan-Chang Chueh ,  Chih-Ming Wu ,  Pei-Yu Peng

IPC: A61B17/70

CPC classification number: A61B17/8085 ,  A61B17/7059

Abstract: A flexible spine fixing structure is provided. The flexible spine fixing structure is used for fixing adjacent two or more vertebras. The flexible spine fixing structure comprises a first flexible part, a first fixing part and a second fixing part. The first fixing part and the second fixing part are respectively connected to two ends of the first flexible part for fixing in the first vertebra. The second flexible part is directly connected to the first flexible part. The third fixing part and the fourth fixing part are respectively connected to two ends of the second flexible part for fixing in the second vertebra.

Abstract translation: 提供了一种柔性脊柱固定结构。 柔性脊椎固定结构用于固定相邻的两个或多个椎骨。 柔性脊椎固定结构包括第一柔性部分，第一固定部分和第二固定部分。 第一固定部分和第二固定部分分别连接到第一柔性部分的两端以固定在第一椎骨中。 第二柔性部件直接连接到第一柔性部件。 第三固定部分和第四固定部分分别连接到第二柔性部分的两端以固定在第二椎骨中。

公开(公告)号：US20100259373A1

公开(公告)日：2010-10-14

申请号：US11976725

申请日：2007-10-26

Applicant: Ching-Shan Chang

Inventor： Ching-Shan Chang

IPC: B60Q1/00 ,  H04N7/26

CPC classification number: H04N7/181 ,  G07C5/0891

Abstract: A storage device of car event data recorders is revealed. The storage device of car event data recorders includes at least two sets of memory or at least one memory set with at least two memory areas. The first memory module (or area) is used to record real time audio/video data with continuous attributes while the second memory module (or area) is for retrieving and recording audio/video data at the time of the accident and/or pre-alarm audio/video data before the accident and/or post-alarm audio/video data after the accident. The interval before or after the accident may be a few decades of seconds. Thereby the storage device of car event data recorders can perform long-term safety control operations and completely record real time audio/video data during, before and after each event. Therefore, certain audio/video data is stored for long-term preservation and checked. Thus the efficiency of the storage device of car event data recorders is improved.

Abstract translation: 揭示了汽车事件数据记录器的存储装置。 汽车事件数据记录器的存储装置包括至少两组存储器或具有至少两个存储区域的至少一个存储器组。 第一存储器模块（或区域）用于记录具有连续属性的实时音频/视频数据，而第二存储器模块（或区域）用于在事故发生时检索和记录音频/视频数据和/ 在事故发生之前报警音频/视频数据和/或事故发生后的音频/视频数据。 事故发生前后的间隔可能是几十秒。 因此，汽车事件数据记录器的存储装置可以执行长期安全控制操作，并且在每个事件之前和之后完全记录实时音频/视频数据。 因此，某些音频/视频数据被存储用于长期保存和检查。 因此，提高了汽车事件数据记录器的存储装置的效率。

公开(公告)号：US07791211B2

公开(公告)日：2010-09-07

申请号：US12228683

申请日：2008-08-15

Applicant: Jen-Chuan Chen ,  Chi-Chih Shen ,  Hui-Shan Chang ,  Tommy Pan

Inventor： Jen-Chuan Chen ,  Chi-Chih Shen ,  Hui-Shan Chang ,  Tommy Pan

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/09727 ,  H05K2201/0989 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2224/05599

Abstract: A flip chip package structure including a chip, a carrier, and a plurality of bumps is provided. The chip has a bonding surface and a plurality of bump pads thereon. The carrier is disposed corresponding to the chip and includes a substrate and a plurality of pre-solders. The substrate has a carrying surface and a patterned trace layer thereon. The patterned trace layer has a plurality of traces, and each of the traces has an outward protruding bonding portion corresponding to the bump. The line width of the bonding portion is greater than that of the trace. The pre-solders are disposed on the bonding portions, respectively. The bumps are disposed between the bump pads and the corresponding pre-solders such that the chip is electrically connected to the carrier through the bumps.

Abstract translation: 提供了包括芯片，载体和多个凸块的倒装芯片封装结构。 芯片具有接合表面和其上的多个凸块焊盘。 载体对应于芯片设置并且包括基底和多个预焊料。 衬底具有承载表面和其上的图案化迹线层。 图案化迹线层具有多个迹线，并且每个迹线具有对应于凸块的向外突出的接合部分。 接合部的线宽大于轨迹的线宽。 预焊料分别设置在接合部分上。 凸块设置在凸块焊盘和相应的预焊件之间，使得芯片通过凸块与载体电连接。

公开(公告)号：US20100154657A1

公开(公告)日：2010-06-24

申请号：US12507813

申请日：2009-07-23

Applicant: SUNG-SHAN CHANG CHIEN

Inventor： SUNG-SHAN CHANG CHIEN

IPC: A23N1/00

CPC classification number: A47J43/046 ,  A47J43/0716

Abstract: A food processing device includes at least a base, a drive unit accommodated in the base, a cutter selectively driven by the drive unit, a container, and a cover removably set in an open top of the container. The container has a wall that forms a juice discharge duct adjacent to a bottom thereof. The duct receives therein a filtering device integrally formed with the wall of the container. The duct further receives therein a filter screen. The duct has an outer circumferential surface forming an external thread to which a valve is coupled to the duct. By arranging the filtering device at one side of the lower portion of the container, the volume of the container can maintain maximum to accommodate pulverization operation of food inside the container. Thus, the convenience of use of the food processing device is enhanced.

Abstract translation: 食品加工装置至少包括基座，容纳在基座中的驱动单元，由驱动单元选择性地驱动的切割器，容器以及可移除地设置在容器的敞开顶部的盖子。 容器具有与其底部相邻形成汁液排放管的壁。 管道容纳与容器的壁一体形成的过滤装置。 所述管道还在其中容纳过滤网。 管道具有形成外螺纹的外圆周表面，阀连接到管道。 通过在容器的下部的一侧设置过滤装置，容器的体积可以保持最大，以适应容器内的食物的粉碎操作。 因此，提高了食品加工装置的使用便利性。

公开(公告)号：US20100143714A1

公开(公告)日：2010-06-10

申请号：US12346104

申请日：2008-12-30

Applicant: SHENG-SHAN CHANG

Inventor： SHENG-SHAN CHANG

IPC: B32B27/02 ,  H01B1/24 ,  C08L31/06 ,  C08K3/04

CPC classification number: H01B1/24 ,  C08J3/226 ,  C08J2467/02 ,  C08K3/04 ,  C08K3/041 ,  C08K5/29 ,  C08K5/353 ,  C08K2201/011 ,  C08L23/0876 ,  C08L67/02 ,  D01F1/09 ,  D01F6/62 ,  D04H3/007 ,  Y10T428/249921 ,  Y10T428/2918 ,  Y10T428/292

Abstract: The present invention relates to a polyester matrix powder comprising a polybutylene terephthalate, a homogeneously dispersed carbon nanotube powder, a dispersant and a chain extender; to a conductive masterbatch with homogeneous and smooth surface; to a process for the preparation of the conductive masterbatch; to a conductive monofilament prepared from the conductive masterbatch; to a process for the preparation of the conductive monofilament; and to a fabric article prepared from the monofilament. The present invention is characterized in the preparation of carbon nanotube-containing fiber materials with higher conductivity and the improvement of the spinning property of the conductive masterbatches to avoid blocking and yarn breakage during the spinning process.

Abstract translation: 本发明涉及包含聚对苯二甲酸丁二醇酯，均匀分散的碳纳米管粉末，分散剂和扩链剂的聚酯基质粉末; 到具有均匀和光滑表面的导电母料; 涉及制备导电母料的方法; 到由导电母料制备的导电单丝; 涉及制备导电单丝的方法; 以及由单丝制备的织物制品。 本发明的特征在于制备具有较高导电性的含碳纳米管的纤维材料，并提高了导电母料的纺丝性能，以避免纺丝过程中的堵塞和断线。