Abstract:
A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package.
Abstract:
A keyboard-input information-security apparatus and method are provided. The apparatus includes an interrupt-descriptor table for storing a list of addresses of functions for handling interrupts, and storing an address of a secure input interrupt-service routine at a specific location in an address area for an operating-system input interrupt-service routine supported by an operating system; a secure input-device driver for changing keyboard-interrupt-vector information to invoke the address of the secure input interrupt-service routine when a keyboard interrupt is generated by a keyboard, and receiving and encoding data input via the keyboard based on the address of the secure input interrupt-service routine; and a secure input unit for delivering the encoded data from the secure input-device driver to an application program, thereby providing higher-level security than a conventional keyboard-security scheme, and particularly, effectively blocking a port-polling attack or an action trying to change a setting in a debug register.
Abstract:
A circuit board including an embedded decoupling capacitor and a semiconductor package thereof are provided. The circuit board may include a core layer including an embedded decoupling capacitor, a first build-up layer at one side of the core layer, and a second build-up layer at the other side of the core layer, wherein the embedded decoupling capacitor includes a first electrode and a second electrode, the first build-up layer includes a first via contacting the first electrode, and the second build-up layer includes a second via contacting the first electrode.
Abstract:
A delay locked loop includes a closed loop circuit configured to generate preliminary delay information, a control unit configured to update the preliminary delay information into delay information in response to a control signal, and a first delay unit configured to delay an input clock signal by a first delay value determined by the delay information and generate an output clock signal.
Abstract:
An embedded chip-on-chip package comprises a printed circuit board having a recessed semiconductor chip mounting unit, a first semiconductor chip embedded in the recessed semiconductor chip mounting unit, and a second semiconductor chip mounted on the first semiconductor chip and the printed circuit board.
Abstract:
A semiconductor device including a common delay circuit configured to delay an input signal in response to a delay control code to output a first delayed input signal and a second delayed input signal; a first delay circuit configured to delay the first delayed input signal in response to the delay control code and to output a first output signal; and a second delay circuit configured to delay the second delayed input signal in response to the delay control code and to output a second output signal.
Abstract:
An internal clock signal generation circuit is capable of controlling a unit delay time depending on a frequency of an external clock signal. The internal clock signal generation circuit includes an internal clock signal generation unit configured to generate an internal clock signal corresponding to a plurality of unit delay cells enabled in response to a control signal, and a unit delay time control unit configured to detect a frequency of an external clock signal and control a unit delay time of each of the plurality of unit delay cells.
Abstract:
An electronic information system comprises an external storage device and an application processor. The external storage device stores boot code and the application processor is adapted to receive the boot code from the external storage device and to perform a system booting operation during a power-up operation by executing the boot code.
Abstract:
A thermoplastic resin foam which has both high reflectance and superior shape-retention properties, suitable for use in backlights and illumination boxes for illumination signboards, lighting fixtures, displays and the like. The thermoplastic resin foam is manufactured by a manufacturing method including a procedure for holding a resin sheet composed of thermoplastic resin (A) and thermoplastic resin (B), which has a functional group having an affinyty with thermoplastic resin (A), within a pressurized inert gas atmosphere to enable the resin sheet to contain inert gas, and a procedure for foaming by heating the resin sheet containing inert gas at a temperature higher than the softening temperature of thermoplastic resin, under normal pressure.
Abstract:
A photomask cleaning apparatus including a stage supporting a photomask, a cleaning fluid supplying unit configured to supply a cleaning fluid to remove contaminants from the photomask, a cleaning fluid absorbing unit configured to absorb the cleaning fluid supplied from the cleaning fluid supplying unit; and a contaminant removing structure configured to provide a path through which the cleaning fluid flows between the cleaning fluid supplying unit and the cleaning fluid absorbing unit through a surface of the photomask on the stage, and to have an opening aperture through which the cleaning fluid is exposed onto the surface of the photomask so as to remove at least some of the contaminants is provided. Methods of cleaning a photomask are also provided.