Abstract:
An image processing device and method to select a field to use in interpolation, if an input image is a film image. The image processing device includes a field selector to select a field to use to interpolate a current field based on difference values in field data among first, second, and third fields being consecutively input in an input image, the field to use to interpolate the current image being one of the first and the third fields and the current field being the second field, a film detector to generate a pattern based on the difference values in the field data between the first, second, and third fields and to determine whether the input image is a film image based on the generated pattern, and an interpolator to interpolate the second field using the one of the first and third field selected by the field selector if the film detector determines the input image to be a film image. Accordingly, when the input image is a film image without a bad-edit, the interpolation process is executed by selecting two temporarily consecutive fields of a field to be interpolated, and using the field with a smaller difference values in field data from the field to be interpolated and a problem of judder in images can be resolved.
Abstract:
A fat composition of high purity diglyceride containing conjugated linoleic acid and a preparation method thereof are provided. The fat composition comprises 85% to 99.9% by weight of diglyceride containing 0.1 to 80% by weight of conjugated linoleic acid, and the balance being monoglyceride, triglyceride or a mixture thereof. The fat composition can be used in highly functional food additives owing to conjugated linoleic acid having various functions of effecting anti-cancer activity, reducing human body fat, enhancing immunogenicity, and preventing and/or treating diabetes, and can be simply prepared at a high production yield.
Abstract:
An image processing device and a method thereof. The image processing device includes a mapper to map a two-dimensional plane of an input image into a three-dimensional vector surface, a coefficient calculator to calculate a coefficient with respect to an equation of a plane formed by a plurality of pixels mapped by the mapper, and an interpolator to interpolate by calculating a gray-level of a location to be interpolated based on the equation of the plane obtained by the coefficient calculator. When the pixels on the 2-D plane are mapped into the 3-D vector space, the image processing device according to an exemplary embodiment of the present general inventive concept prevents overshoot or undershoot which may occur at the edges or on planes, and thus displays a smooth image.
Abstract:
Provided are methods of forming a stack of electrodes and three-dimensional semiconductor devices fabricated thereby. The device may include electrodes sequentially stacked on a substrate to constitute an electrode structure. each of the electrodes may include a connection portion protruding horizontally and outward from a sidewall of one of the electrodes located thereon and an aligned portion having a sidewall coplanar with that of one of the electrodes located thereon or thereunder. Here, at least two of the electrodes provided vertically adjacent to each other may be provided in such a way that the aligned portions thereof have sidewalls that are substantially aligned to be coplanar with each other.
Abstract:
In a method of forming a semiconductor device, a feature layer is provided on a substrate and a mask layer is provided on the feature layer. A portion of the mask layer is removed in a first region of the semiconductor device where fine features of the feature layer are to be located, the mask layer remaining in a second region of the semiconductor device where broad features of the feature layer are to be located. A mold mask pattern is provided on the feature layer in the first region and on the mask layer in the second region. A spacer layer is provided on the mold mask pattern in the first region and in the second region. An etching process is performed to etch the spacer layer so that spacers remain at sidewalls of pattern features of the mold mask pattern, and to etch the mask layer in the second region to provide mask layer patterns in the second region. The feature layer is etched using the mask layer patterns as an etch mask in the second region and using the spacers as an etch mask in the first region to provide a feature layer pattern having fine features in the first region and broad features in the second region.
Abstract:
A spacer grid for dual-cooling nuclear fuel rods arranged at a narrow interval. The spacer grid solves the problem in which, since the dual-cooling nuclear fuel rods are used to improve the cooling performance and stability of nuclear fuel and obtain high burnup and output, the outer diameter of each dual-cooling nuclear fuel rod is increased, and thus the gap between each dual-cooling nuclear fuel rod and the grid strap is decreased. The spacer grid includes first grid straps and second grid straps, which are crossed and arranged in transverse and longitudinal directions at regular intervals and have the shape of a flat strip, and support structures, which are fitted into the first and second grid straps around intersections of the first and second grid straps so as to support the dual-cooling nuclear fuel rods.
Abstract:
Provided is a method of forming patterns for a semiconductor device in which fine patterns and large-width patterns are formed simultaneously and adjacent to each other. In the method, a first layer is formed on a substrate so as to cover a first region and a second region which are included in the substrate. Both a blocking pattern covering a portion of the first layer in the first region and a low-density large-width pattern covering a portion of the first layer in the second region are simultaneously formed. A plurality of sacrificial mask patterns are formed on the first layer and the blocking pattern in the first region. A plurality of spacers covering exposed sidewalls of the plurality of sacrificial mask patterns are formed. The plurality of sacrificial mask patterns are removed. The first layer in the first and second regions are simultaneously etched by using the plurality of spacers and the blocking pattern as etch masks in the first region and using the low-density large-width pattern as an etch mask in the second region.
Abstract:
A spacer grid can be applied to close-spaced nuclear fuel rods. The spacer grid is directed to solve the problem in which, as the outer diameter of each nuclear fuel rod increases due to the use of dual-cooled nuclear fuel rods for improving cooling performance and obtaining high combustion and high output power, the gap between the neighboring nuclear fuel rods is narrowed to thus make it impossible to use an existing spacer grid. The spacer grid is a combination of unit grid straps, each of which has supports for supporting each of the nuclear fuel rods set in a narrow array and has a sheet shape, which are combined with each other. The supports are located at positions shifted from the longitudinal central line of each unit grid strap toward sub-channels.
Abstract:
In an integrated circuit device and method of manufacturing the same, a resistor pattern is positioned on a device isolation layer of a substrate. The resistor pattern includes a resistor body positioned in a recess portion of the device isolation layer and a connector making contact with the resistor body and positioned on the device isolation layer around the recess portion. The connector has a metal silicide pattern having electric resistance lower than that of the resistor body at an upper portion. A gate pattern is positioned on the active region of the substrate and includes the metal silicide pattern at an upper portion. A resistor interconnection is provided to make contact with the connector of the resistor pattern. A contact resistance between the connector and the resistor interconnection is reduced.
Abstract:
A semiconductor device having a dual trench and methods of fabricating the same, a semiconductor module, an electronic circuit board, and an electronic system are provided. The semiconductor device includes a semiconductor substrate having a cell region including a cell trench and a peripheral region including a peripheral trench. The cell trench is filled with a core insulating material layer, and the peripheral trench is filled with a padding insulating material layer conformably formed on an inner surface thereof and a core insulating material layer formed on an inner surface of the padding insulating material layer. The core insulating material layer has a greater fluidity than the padding insulating material layer.