公开(公告)号：US08508606B2

公开(公告)日：2013-08-13

申请号：US12622720

申请日：2009-11-20

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： H04N5/228 ,  H04N5/217

CPC分类号： G06T5/003 ,  G06T2207/20201 ,  H04N5/217 ,  H04N5/23248 ,  H04N5/772 ,  H04N5/781 ,  H04N5/907

摘要： An image deblurring system deblurs motion blurred images of a video stream captured from a moving object. An image deblurring method selects a blurred image from the video stream, selects blurred pixels from the blurred image, and calculates a movement offset for each of the blurred pixels according to coordinates of the blurred pixel in a frequency domain during the movement of the moving object. The method generates a point spread function according to the movement offset, and generates an image conversion formula according to the point spread function. The method converts each of the blurred pixels into a sharp pixel according to the image conversion formula, and generates a sharp image based on all of the sharp pixels.

摘要翻译： 图像去模糊系统消除从移动物体捕获的视频流的运动模糊图像。 图像去模糊方法从视频流中选择模糊图像，从模糊图像中选择模糊像素，并根据移动物体运动期间的频域中的模糊像素的坐标来计算每个模糊像素的移动偏移 。 该方法根据移动偏移产生点扩散函数，并根据点扩散函数生成图像转换公式。 该方法根据图像转换公式将每个模糊像素转换成锐利像素，并且基于所有尖锐像素产生清晰图像。

公开(公告)号：US08502380B2

公开(公告)日：2013-08-06

申请号：US12899258

申请日：2010-10-06

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： H01L23/48

CPC分类号： H01L24/03 ,  H01L21/6835 ,  H01L24/32 ,  H01L2221/68372 ,  H01L2224/0236 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/11849 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/00

摘要： A chip package and a fabrication method thereof are provided. The chip package includes a semiconductor substrate containing a semiconductor component and a conductive pad thereon. A through hole penetrates the semiconductor substrate from a backside thereof to expose the conductive pad. A redistribution layer is below the backside of the semiconductor substrate and electrically connected to the conductive pad in the through hole. A conductive trace layer is below the redistribution layer and extended along a sidewall of the semiconductor substrate to electrically contact with an edge of the redistribution layer.

摘要翻译： 提供了芯片封装及其制造方法。 芯片封装包括其上包含半导体部件和导电焊盘的半导体衬底。 通孔从其背面穿透半导体衬底以露出导电焊盘。 再分配层位于半导体衬底的背面下方并且与通孔中的导电焊盘电连接。 导电迹线层位于再分布层之下并且沿着半导体衬底的侧壁延伸以与再分布层的边缘电接触。

公开(公告)号：US08116902B2

公开(公告)日：2012-02-14

申请号：US12713181

申请日：2010-02-26

申请人： Chien-Hung Liu ,  Wen-Yuh Jywe ,  Yi-Tsung Li

发明人： Chien-Hung Liu ,  Wen-Yuh Jywe ,  Yi-Tsung Li

IPC分类号： G06F19/00 ,  G01B11/02

CPC分类号： G05B19/401 ,  B23Q1/5437 ,  B23Q17/2233 ,  B23Q17/2495 ,  G01B11/03 ,  G01B11/27 ,  G01B21/045 ,  G05B2219/37008 ,  G05B2219/37275 ,  Y10T409/305824

摘要： A method of detecting a dynamic path of a five-axis machine tool having a spindle and a turntable and has a preparing step, a correcting step and a detecting step. The preparing step includes mounting a detector on the spindle, mounting a cat-eye reflector on the turntable, emitting a laser light to the cat-eye reflector, reflecting the laser light to the detector and splitting into two light beams. One of the light beams is emitted to a four-quadrant position sensitive detector. The correcting step includes rotating the detector, detecting a signal of the laser light by the four-quadrant position sensitive detector to eliminate an offset between the detecting assembly and the spindle. The detecting step includes detecting the dynamic path of the five-axis machine tool by detecting the positions of at least two of the linear axes and at least one of the rotation axes of the five-axis machine tool.

摘要翻译： 一种检测具有主轴和转盘的五轴机床的动态路径的方法，具有准备步骤，校正步骤和检测步骤。 制备步骤包括将检测器安装在心轴上，将猫眼反射器安装在转盘上，向猫眼反射器发射激光，将激光反射到检测器并分成两束光束。 一个光束被发射到四象限位置敏感检测器。 校正步骤包括旋转检测器，通过四象限位置敏感检测器检测激光的信号，以消除检测组件和主轴之间的偏移。 检测步骤包括通过检测五轴机床中至少两个线性轴线和至少一个旋转轴线的位置来检测五轴机床的动态路径。

公开(公告)号：US08076744B2

公开(公告)日：2011-12-13

申请号：US11657733

申请日：2007-01-25

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： H01L31/0232

CPC分类号： H01L27/14618 ,  H01L2224/13

摘要： A photosensitizing chip package construction and manufacturing method thereof is comprised of photosensitizing chips constructed on one side of a wafer using a bonding layer; a color attachment array being disposed over those photosensitizing chips; a glass substrate provided with weir and covered up over the color attachment array; a proper gap being defined between the glass substrate and the color attachment array to promote permeability of stream of light by direct receiving stream of light from those photosensitizing chips constructed over the wafer.

摘要翻译： 光敏芯片封装结构及其制造方法由使用结合层的晶片一侧构成的光敏芯片构成; 在这些光敏芯片上设置着色附件阵列; 设置有堰并覆盖在附着阵列上的玻璃基板; 在玻璃基板和颜色附着阵列之间限定适当的间隙，以通过直接接收来自在晶片上构成的光敏芯片的光直接接收光来促进光流的透过性。

公开(公告)号：US20110298985A1

公开(公告)日：2011-12-08

申请号：US12962728

申请日：2010-12-08

申请人： Chao-Shin Wang ,  Chien-Hung Liu ,  Bomin Weng

发明人： Chao-Shin Wang ,  Chien-Hung Liu ,  Bomin Weng

IPC分类号： H04N5/14

CPC分类号： H04N5/57 ,  H04N5/20 ,  H04N21/4318

摘要： A method of enhancing a contrast ratio of a picture of a display device, comprising steps of providing the display device having a light source; continuously receiving plural display signals; and turning off the light source when the display device has a buffer time during which each of the continuously received plural display signals has a picture brightness equal to zero.

摘要翻译： 一种增强显示装置的图像的对比度的方法，包括以下步骤：提供具有光源的显示装置; 连续接收多个显示信号; 并且当所述显示装置具有缓冲时间时，关闭所述光源，在所述缓冲时间期间，所述连续接收的多个显示信号中的每一个具有等于零的图像亮度。

公开(公告)号：US08071889B2

公开(公告)日：2011-12-06

申请号：US11706411

申请日：2007-02-15

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： H05K1/11

CPC分类号： H01L23/552 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0231 ,  H01L2224/02331 ,  H01L2224/02371 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/06102 ,  H01L2224/11334 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14104 ,  H01L2224/14515 ,  H01L2224/16 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2224/05552

摘要： An electronic device with EMI screen and packaging process thereof to provide even active EMI prevention means includes adhesion of a transit substrate to a soldering surface of the electronic device, a protection circuit layer functioning as EMI screen being paved on the bottom of the transit substrate; a packaging circuit layer being laid; protection circuit layer and the transit substrate as well as the packaging and protection circuit layers being segregated with an insulation material; and solder balls provided with electric continuity to the protection circuit layer and the packaging circuit layer being respectively implanted as soldering points respectively for EMI grounding and linkage between the electronic device and a printed circuit.

摘要翻译： 具有EMI屏蔽及其包装工艺的电子设备提供均匀的有源EMI防止装置，包括将运输基板粘附到电子设备的焊接表面，保护电路层用作铺设在运输衬底底部的EMI屏蔽层; 铺设的包装电路层; 保护电路层和运输基板以及与绝缘材料隔离的封装和保护电路层; 分别为保护电路层和封装电路层提供与电连接的焊料球分别作为焊接点植入电子设备和印刷电路之间的EMI接地和连接。

公开(公告)号：US20110109863A1

公开(公告)日：2011-05-12

申请号：US12616420

申请日：2009-11-11

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： G02F1/1345 ,  H01J9/50

CPC分类号： G02F1/136259 ,  G02F2001/136263

摘要： One aspect of the present disclosure relates to a common repair structure for repairing scanning and/or data line defects in a liquid crystal display panel. In one embodiment, the common repair structure includes a plurality of “H” shaped structures, where each “H” shaped structure is placed over a corresponding segment of two neighboring scanning lines located between and associated with two neighboring pixels along the second direction or a corresponding segment of two neighboring data lines located between and associated with two neighboring pixels along the first direction.

摘要翻译： 本公开的一个方面涉及用于修复液晶显示面板中的扫描和/或数据线缺陷的常见修复结构。 在一个实施例中，公共修复结构包括多个“H”形结构，其中每个“H”形结构被放置在沿着第二方向位于两个相邻像素之间并与之相关联的两个相邻扫描线的对应段上，或者 两个相邻数据线的对应段位于沿着第一方向的两个相邻像素之间并与之相关联。

公开(公告)号：US20110042804A1

公开(公告)日：2011-02-24

申请号：US12788091

申请日：2010-05-26

申请人： Chien-Hung Liu ,  Cheng-Te Chou

发明人： Chien-Hung Liu ,  Cheng-Te Chou

IPC分类号： H01L23/498 ,  H01L21/50

CPC分类号： H01L27/14618 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/93 ,  H01L24/94 ,  H01L25/0657 ,  H01L27/14683 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/051 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/05638 ,  H01L2224/05688 ,  H01L2224/13022 ,  H01L2224/29007 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32052 ,  H01L2224/32145 ,  H01L2224/33181 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/01014 ,  H01L2924/053 ,  H01L2924/01 ,  H01L2224/83 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552

摘要： The invention provides a chip package and fabrication method thereof. In one embodiment, the chip package includes: a semiconductor substrate having opposite first and second surfaces, at least one bond pad region and at least one device region; a plurality of conductive pad structures disposed on the bond pad region at the first surface of the semiconductor substrate; a plurality of heavily doped regions isolated from one another, underlying and electrically connected to the conductive pad structures; and a plurality of conductive bumps underlying the heavily doped regions and electrically connected to the conductive pad structures through the heavily-doped regions.

摘要翻译： 本发明提供一种芯片封装及其制造方法。 在一个实施例中，芯片封装包括：具有相对的第一和第二表面，至少一个焊盘区域和至少一个器件区域的半导体衬底; 多个导电焊盘结构，设置在半导体衬底的第一表面处的焊盘区域上; 多个彼此隔离的重掺杂区域，其下面并电连接到导电焊盘结构; 以及在重掺杂区域下面的多个导电凸块，并通过重掺杂区域电连接到导电焊盘结构。

公开(公告)号：US07852478B1

公开(公告)日：2010-12-14

申请号：US12708481

申请日：2010-02-18

申请人： Wen-Yuh Jywe ,  Chien-Hung Liu ,  Tung-Hui Hsu ,  Chia-Ming Hsu

发明人： Wen-Yuh Jywe ,  Chien-Hung Liu ,  Tung-Hui Hsu ,  Chia-Ming Hsu

IPC分类号： G01B11/00

CPC分类号： G01B11/03 ,  B23Q17/24 ,  B23Q2230/002

摘要： A detecting assembly for multi-axis machine tools having a spindle and a turntable and has a detector, a lens device and a computer. The detector is connected to the spindle and has a mounting frame and two detecting segments. The mounting frame is connected to the spindle and has a connecting rod, a bottom board and multiple mounting boards. The detecting segments are mounted on the mounting boards and each has a light source and a sensor. The lens device is mounted on the turntable, extends into the detector and has a supporting shaft and a spherical lens. The spherical lens is mounted on an upper end of the supporting shaft to align light emitted from the light sources with corresponding sensors via the spherical lens. The computer is electrically connected to the detector to receive signals of the detecting segments of the detector and has a signal processor.

摘要翻译： 一种用于具有主轴和转台的多轴机床的检测组件，并具有检测器，透镜装置和计算机。 检测器连接到主轴，并具有安装框架和两个检测段。 安装框架连接到主轴，并具有连杆，底板和多个安装板。 检测段安装在安装板上，每个具有光源和传感器。 透镜装置安装在转台上，延伸到检测器中，并具有支撑轴和球面透镜。 球面透镜安装在支撑轴的上端，以通过球面透镜将来自光源的光与对应的传感器对准。 计算机电连接到检测器以接收检测器的检测段的信号，并具有信号处理器。

公开(公告)号：US20100219495A1

公开(公告)日：2010-09-02

申请号：US11657733

申请日：2007-01-25

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L2224/13

摘要： A photosensitizing chip package construction and manufacturing method thereof is comprised of photosensitizing chips constructed on one side of a wafer using a bonding layer; a color attachment array being disposed over those photosensitizing chips; a glass substrate provided with weir and covered up over the color attachment array; a proper gap being defined between the glass substrate and the color attachment array to promote permeability of stream of light by direct receiving stream of light from those photosensitizing chips constructed over the wafer.

摘要翻译： 光敏芯片封装结构及其制造方法由使用结合层的晶片一侧构成的光敏芯片构成; 在这些光敏芯片上设置着色附件阵列; 设置有堰并覆盖在附着阵列上的玻璃基板; 在玻璃基板和颜色附着阵列之间限定适当的间隙，以通过直接接收来自在晶片上构成的光敏芯片的光直接接收光来促进光流的透过性。