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    HIGH DENSITY INTERCONNECT STRUCTURES CONFIGURED FOR MANUFACTURING AND PERFORMANCE
    74.
    发明申请
    HIGH DENSITY INTERCONNECT STRUCTURES CONFIGURED FOR MANUFACTURING AND PERFORMANCE 审中-公开

    公开(公告)号：US20200168553A1

    公开(公告)日：2020-05-28

    申请号：US16774508

    申请日：2020-01-28

    Applicant: Intel Corporation

    Inventor： Henning Braunisch ,  Kemal Aygun ,  Ajay Jain ,  Zhiguo Qian

    IPC: H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

    Abstract: Discussed generally herein are methods and devices including or providing a high density interconnect structure. A high density interconnect structure can include a stack of alternating dielectric layers and metallization layers comprising at least three metallization layers including conductive material with low k dielectric material between the conductive material, and at least two dielectric layers including first medium k dielectric material with one or more first vias extending therethrough, the at least two dielectric layers situated between two metallization layers of the at least three metallization layers, a second medium k dielectric material directly on a top surface of the stack, a second via extending through the second medium k dielectric material, the second via electrically connected to conductive material in a metallization layer of the three or more metallization layers, and a pad over the second medium k dielectric material and electrically connected to the second via.

    Electro-optical assembly including a glass bridge
    76.
    发明授权
    Electro-optical assembly including a glass bridge 有权
    电光组件包括玻璃桥

    公开(公告)号：US09250406B2

    公开(公告)日：2016-02-02

    申请号：US13722951

    申请日：2012-12-20

    Applicant: INTEL CORPORATION

    Inventor： Peter L. D. Chang ,  Edris M. Mohammed ,  Henning Braunisch ,  Hengju Cheng

    IPC: G02B6/12 ,  G02B6/43

    CPC classification number: G02B6/43 ,  H01L2224/73204 ,  Y10T29/49117 ,  Y10T29/4913

    Abstract: Embodiments of the present disclosure provide techniques and configurations for routing signals of an electro-optical assembly using a glass bridge. In one embodiment, an electro-optical assembly includes a laser die having a laser device and a glass bridge electrically coupled with the laser die by one or more interconnect structures, the glass bridge including electrical routing features configured to route electrical signals to the laser die from a transmitter device. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例提供了使用玻璃桥路由电光学组件路由信号的技术和配置。 在一个实施例中，电光学组件包括具有激光器件的激光器管芯和通过一个或多个互连结构与激光管芯电耦合的玻璃桥，所述玻璃桥接器包括被配置为将电信号路由到激光器管芯 从发射机设备。 可以描述和/或要求保护其他实施例。

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