公开(公告)号：US20080238599A1

公开(公告)日：2008-10-02

申请号：US11729311

申请日：2007-03-27

申请人： Francois Hebert ,  Ming Sun

发明人： Francois Hebert ,  Ming Sun

IPC分类号： H01F17/04 ,  H01F27/28

CPC分类号： H01L23/645 ,  H01L23/5227 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/1902 ,  H01L2924/3025 ,  Y10T29/4902 ,  Y10T29/49075 ,  H01L2924/00 ,  H01L2224/0401

摘要： A chip scale power converter package having an inductor substrate and a power integrated circuit flipped onto the inductor substrate is disclosed. The inductor substrate includes a high resistivity substrate having a planar spiral inductor formed thereon.

摘要翻译： 公开了一种具有电感器基板和翻转到电感器基板上的功率集成电路的芯片级功率转换器封装。 电感器基板包括其上形成有平面螺旋电感器的高电阻率基板。

公开(公告)号：US20080207094A1

公开(公告)日：2008-08-28

申请号：US11712846

申请日：2007-02-28

申请人： Tao Feng ,  Ming Sun

发明人： Tao Feng ,  Ming Sun

IPC分类号： B24B1/00 ,  B05D1/00 ,  B24B41/06

CPC分类号： B24B7/228 ,  B24B41/06 ,  B28D5/0011 ,  B28D5/0052 ,  H01L24/06 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/06181 ,  H01L2224/16225 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/03 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method and apparatus for ultra thin wafer backside processing are disclosed. The apparatus includes an outer ring holding a high temperature grinding and/or dicing tape to form a support structure. An ultra thin wafer or diced wafer is adhered to the tape within the ring for wafer backside processing. The wafer backside processing includes ion implantation, annealing, etching, sputtering and evaporation while the wafer is in the support structure. Alternative uses of the support structure are also disclosed including the fabrication of dies having metalized side walls.

摘要翻译： 公开了一种用于超薄晶片背面处理的方法和装置。 该装置包括保持高温研磨和/或切割胶带以形成支撑结构的外圈。 超薄晶片或切片晶片粘附在环内用于晶片背面处理的带子上。 晶片背面处理包括离子注入，退火，蚀刻，溅射和蒸发，而晶片处于支撑结构中。 还公开了支撑结构的替代用途，包括制造具有金属化侧壁的模具。

公开(公告)号：US07394151B2

公开(公告)日：2008-07-01

申请号：US11058913

申请日：2005-02-15

申请人： Leeshawn Luo ,  Kai Liu ,  Ming Sun ,  Xiao Tian Zhang

发明人： Leeshawn Luo ,  Kai Liu ,  Ming Sun ,  Xiao Tian Zhang

IPC分类号： H01L23/48

CPC分类号： H01L21/568 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49524 ,  H01L24/40 ,  H01L24/73 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/37099 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor package and method for making a semiconductor package are disclosed. The semiconductor package has a top surface and a mounting surface and includes a die, a conducting connecting material, a plating material and an insulating material. The die has a processed surface facing towards the mounting surface of the semiconductor package. Exposed metal connections are at the processed surface of the die. The conducting connecting material is disposed on the exposed metal connections. The plating material is in contact with the conducting connecting material. The insulating material is formed around the conducting connecting material, and the plating material extends to the exterior of the insulating material.

公开(公告)号：US20070231954A1

公开(公告)日：2007-10-04

申请号：US11396404

申请日：2006-03-31

申请人： Kai Liu ,  Ming Sun

发明人： Kai Liu ,  Ming Sun

IPC分类号： H01L21/00

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32506 ,  H01L2224/83801 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/01014 ,  H01L2924/00

摘要： A gold/silicon eutectic die bonding method is disclosed. The method includes the steps of 1) vacuum evaporating a layer of titanium to a silicon wafer backside, the titanium layer having a thickness less than 200 Å, 2) immediately vacuum evaporating a layer of gold onto the titanium layer, the gold layer having a thickness in the range of 0.5 to 1.5 microns, 3) dicing the wafer, and 4) mounting the die onto a substrate at a eutectic temperature to form a gold/silicon eutectic alloy bond.

摘要翻译： 公开了一种金/硅共晶晶片接合方法。 该方法包括以下步骤：1）将钛层真空蒸发到硅晶片背面，钛层的厚度小于200; 2）立即将一层金层真空蒸发到钛层上，金层具有 厚度在0.5至1.5微米的范围内，3）切割晶片，以及4）以共晶温度将模具安装在基板上以形成金/硅共晶合金。

公开(公告)号：US07263396B2

公开(公告)日：2007-08-28

申请号：US10900146

申请日：2004-07-28

申请人： Yunquan Chen ,  Luya Li ,  Rakesh Kumar Sethi ,  Ming Sun ,  Christopher Grant Denny ,  Scott Howard Phillips

发明人： Yunquan Chen ,  Luya Li ,  Rakesh Kumar Sethi ,  Ming Sun ,  Christopher Grant Denny ,  Scott Howard Phillips

IPC分类号： A61B5/00

CPC分类号： A61B5/14552 ,  A61B5/6816

摘要： A sensor assembly for monitoring physiological characteristics interfaces to a subject's ear. The sensor assembly has a projection that projects into the subject's concha. The projection may have a notch to accommodate the subject's anti-tragus. A clip connected to the projection holds a sensor against the subject's lobule. The sensor may comprise a pulse-oximetry-type sensor.

摘要翻译： 用于监测生理特征的传感器组件与受试者的耳朵接口。 传感器组件具有投影到被检者的外观中的突出部。 该投影可以具有凹口以适应受试者的反耳屏。 连接到突起的夹子将传感器保持在对象的小叶上。 传感器可以包括脉搏血氧测定型传感器。

公开(公告)号：US20070075406A1

公开(公告)日：2007-04-05

申请号：US11242625

申请日：2005-09-30

申请人： Yueh-Se Ho ,  Ming Sun

发明人： Yueh-Se Ho ,  Ming Sun

IPC分类号： H01L23/495

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40249 ,  H01L2224/4103 ,  H01L2224/73221 ,  H01L2224/84345 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A wafer level method for metallizing source, gate and drain contact areas of a semiconductor die includes the steps of (a) plating Ni onto the source, gate and drain contact areas of the semiconductor die, and (b) plating Au onto the source, gate and drain contact areas of the semiconductor die after completing step (a). A semiconductor package having plate interconnections between leadframe leads and the metalized passivation areas is also disclosed.

摘要翻译： 用于金属化半导体管芯的源极，栅极和漏极接触区域的晶片级方法包括以下步骤：（a）将Ni镀在半导体管芯的源极，栅极和漏极接触区域上，和（b）将Au电镀到源极上， 在完成步骤（a）之后半导体管芯的栅极和漏极接触区域。 还公开了在引线框引线和金属化钝化区之间具有板互连的半导体封装。

公开(公告)号：US20070057368A1

公开(公告)日：2007-03-15

申请号：US11226913

申请日：2005-09-13

申请人： Yueh-Se Ho ,  Ming Sun

发明人： Yueh-Se Ho ,  Ming Sun

IPC分类号： H01L23/48 ,  H01L23/28

CPC分类号： H01L23/49524 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40249 ,  H01L2224/4103 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having metalized source and gate areas separated by a passivation area, a patterned source connection coupling the source lead to the semiconductor die metalized source area, a patterned gate connection coupling the gate lead to the semiconductor die metalized gate area, a semiconductor die drain area coupled to the drain lead and an encapsulant covering at least a portion of the semiconductor die and drain, source and gate leads.

摘要翻译： 公开了半导体封装。 该封装包括具有漏极，源极和栅极引线的引线框架，耦合到引线框架的半导体管芯，具有金属化源的半导体管芯和由钝化区域分开的栅极区域，将源极引线耦合到半导体管芯金属化源 将栅极引线耦合到半导体管芯金属化栅极区域的图案化栅极连接，耦合到漏极引线的半导体管芯漏极区域和覆盖半导体管芯和漏极，源极和栅极引线的至少一部分的密封剂。

公开(公告)号：US06695152B1

公开(公告)日：2004-02-24

申请号：US10288028

申请日：2002-11-05

申请人： Dion Fabrizio ,  Ming Sun

发明人： Dion Fabrizio ,  Ming Sun

IPC分类号： A47F500

CPC分类号： A47F1/12

摘要： An elongate display track device has a plurality of track segments frangibly connected end-to-end to one another forming a continuous track for receiving a row of articles for sliding movement therealong. There are a front track segment defining an a-keyway, and a rear track segment defining a b-keyway. At least one first intermediate track segment has an a-key on one end and a b-key on the other end. The a-keys are mateable only with a-keyways and b-keys are mateable only with b-keyways. At least one second intermediate track segment has an b-keyway on one end a b-key on the other end. At least one third intermediate track segment has an b-keyway on one end an a-keyway on the other end. The track device is separated at the a-keys and a-keyways to shorten the track length and separated at the b-keys and b-keyways to lengthen the track to fit a shelf.

摘要翻译： 细长的显示轨道装置具有多个彼此端对端地彼此易断连接的轨道段，形成用于接收一排物品的连续轨道，用于沿其滑动运动。 存在限定a键槽的前轨道段和限定b键槽的后轨道段。 至少一个第一中间轨道段在一端具有一键和另一端具有一个双键。 a键仅适用于a键盘，b键仅适用于b键槽。 至少一个第二中间轨道段在一端具有在另一端的b键的b键槽。 至少一个第三中间轨道段在一端具有一个b键槽，另一端具有一个键槽。 轨道设备在a键和键盘上分离，以缩短轨道长度，并在b键和b键上分离，以延长轨道以适应架子。

公开(公告)号：US5962336A

公开(公告)日：1999-10-05

申请号：US953930

申请日：1997-10-20

申请人： Ming Sun

发明人： Ming Sun

IPC分类号： G01N33/543

CPC分类号： G01N33/54366 ,  Y10S435/805 ,  Y10S435/81 ,  Y10S435/97 ,  Y10S435/973 ,  Y10S435/975 ,  Y10S436/805 ,  Y10S436/81

摘要： A multi-test panel with several test strips containing a separate and different immunochromatographic system, each strip being housed in a separate structure so that the structures may be joined together and interchanged, depending upon what substances within a fluid sample are being detected.

摘要翻译： 具有多个测试条的多测试面板包含单独和不同的免疫层析系统，每个条带以独立的结构容纳，使得结构可以连接在一起并互换，这取决于在检测流体样品内的什么物质。

公开(公告)号：US20160260876A1

公开(公告)日：2016-09-08

申请号：US14395094

申请日：2014-08-15

申请人： Ming SUN ,  Jian DAI ,  SHANGHAI OPPELLIGHTING CO., LTD.

发明人： Ming Sun ,  Wen-Jung Chuang ,  Xing-Bao Chen ,  Jian Dai

IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L33/64 ,  H01L33/50 ,  H01L33/56

CPC分类号： H01L33/62 ,  F21K9/232 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/502 ,  H01L33/56 ,  H01L33/641 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0075

摘要： The present invention is related to a LED light source and its manufacturing method. It is related to the LED technology field. The LED light source includes a glass case, LED chips sealed inside the glass case and the transparent substrate carrying the LED chips. The manufacturing method of the present invention is simple and easy.

摘要翻译： 本发明涉及一种LED光源及其制造方法。 它与LED技术领域有关。 LED光源包括玻璃外壳，密封在玻璃外壳内的LED芯片和承载LED芯片的透明基板。 本发明的制造方法简单易行。